QFP PACKAGE 80 LEAD Search Results

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 80 PIN CERAMIC To Top / Package Lineup / Package Index FPT-80C-A02 80-pin ceramic QFP Lead pitch 0.8 mm Lead shape Gullwing Sealing method Metal seal FPT-80C-A02 80-pin ceramic QFP (FPT-80C-A02)

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 80 PIN CERAMIC To Top / Package Lineup / Package Index FPT-80C-A01 80-pin ceramic QFP Lead pitch 0.8 mm Lead shape Gullwing Sealing method Metal seal FPT-80C-A01 80-pin ceramic QFP (FPT-80C-A01)

Contextual Info: QUAD FLAT L-LEADED PACKAGE 80 PIN CERAMIC FPT-80C-A02 Lead pitch 0.8 mm Lead shape Gullwing Sealing method Metal seal 80-pin ceramic QFP FPT-80C-A02 80-pin ceramic QFP (FPT-80C-A02) 0.51(.020) TYP 17.91(.705) TYP 16.00(.630) 14.00±0.25 TYP (.551±.010)

Contextual Info: QUAD FLAT L-LEADED PACKAGE 80 PIN CERAMIC FPT-80C-A01 Lead pitch 0.8mm Lead shape Gullwing Sealing method Metal seal 80-pin ceramic QFP FPT-80C-A01 80-pin ceramic QFP (FPT-80C-A01) 1.60(.063)TYP 0.51(.020)TYP 17.91(.705) TYP 14.00±0.25 (.551±.010) INDEX AREA

QFP080-P-1420-4

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 80 PIN PLASTIC To Top / Package Lineup / Package Index FPT-80P-M06 EIAJ code :∗QFP080-P-1420-4 80-pin plastic QFP Lead pitch 0.80 mm Package width x package length 14 × 20 mm Lead shape Gullwing

QFP080-P-1420-5

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 80 PIN PLASTIC To Top / Package Lineup / Package Index FPT-80P-M07 EIAJ code :∗QFP080-P-1420-5 80-pin plastic QFP Lead pitch 0.80 mm Package width x package length 14 × 20 mm Lead shape Gullwing

QFP080-P-1420-5

Contextual Info: QUAD FLAT L-LEADED PACKAGE 80 PIN PLASTIC FPT-80P-M07 EIAJ code : ∗QFP080-P-1420-5 80-pin plastic QFP Lead pitch 0.80mm Package width x package length 14 × 20mm Lead shape Gullwing Sealing method Plastic mold Length of flat portion of pins 1.20mm FPT-80P-M07

QFP080-P-1420-4

Contextual Info: QUAD FLAT L-LEADED PACKAGE 80 PIN PLASTIC FPT-80P-M06 EIAJ code : ∗QFP080-P-1420-4 80-pin plastic QFP Lead pitch 0.80mm Package width x package length 14 × 20mm Lead shape Gullwing Sealing method Plastic mold Length of flat portion of pins 0.80mm FPT-80P-M06

CX25837

Abstract: BEST BASS TREBLE CIRCUIT bc 548 CX25843 CX25842 mod 10 up counter data sheet CX25840 YPBPR TO VGA NEW TRANSISTOR DATA SHEET BEST BASS TREBLE CIRCUIT w/ pcb layout bt.656 parallel to serial conversion vga
Contextual Info: Sh ee t ta Da CX25840/1/2/3 Video Decoder and Broadcast Audio Decoder Pr od uc tio n Data Sheet 102284B August 2005 Ordering Information Description Package CX25840 Worldwide Video and BTSC Basic Broadcast Audio Decoder 80-pin QFP lead-free CX25841 Worldwide Video and BTSC (dbx) Broadcast Audio Decoder

3TC14

Abstract: CM6206 L23C SE757 AL207
Contextual Info: Order this document by DSP56004/D M OTOROLA • SEMICONDUCTOR T E C H N IC A L D A TA Advance Information 24-Bit General Purpose Digital Signal Processor DSP56004 Rev.1 Plastic Quad Flat Pack QFP Available in an 80-pin, small footprint, surface mount package.

IC51-0484-806

Abstract: IC51-1284-1788 IC51-0324-1498 IC51-1764-1505-5 IC51-1284-1433 IC51-1844-1148 IC51-2564-1668-10 ic51-0804-795 ic51-0444-825 IC51-1604-1350
Contextual Info: QFP, PQFP, TQFP Clamshell IC51 Series IC51- 064 4- 038 Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: Socket Series No. of Leads No. of Sides with Contacts Design No. Characteristics 1,000M½minimum at 500 VDC 700 VAC for 1 minute

YAMAICHI ic357

Abstract: IC51-1284-1702 IC51-0644-1972 IC357-0484-078 IC357 ic51-1284-1702-2 IC500-1444-002P-2 YAMAICHI ic500 IC51-2084-1052-36 IC500-1004-004
Contextual Info: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage:

IC51-1284-1433

Abstract: IC51-807 IC51-0484-806 IC51-1444-1354-7 IC51-0644-1240 IC51-2564-1668-6 OT 306 IC51-128 IC217-2404-007 cxd 158
Contextual Info: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage:

cxd 158

Abstract: ot 239 IC51-128 OT 306 IC51-2564-1668-6 IC51-0444-467 IC51-1764 socket Yamaichi ic234 IC51-1764-1505-10 IC217-1444-003
Contextual Info: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Speci cations Insulation Resistance: Dielectric Withstanding Voltage:

FPT-160P-M03

Abstract: QFP160-P-2828-3 80 m03
Contextual Info: QUAD FLAT L-LEADED PACKAGE 160 PIN PLASTIC FPT-160P-M03 EIAJ code : ∗QFP160-P-2828-3 160-pin plastic QFP Lead pitch 0.65mm Package width x package length 28 × 28mm Lead shape Gullwing Sealing method Plastic mold Length of flat portion of pins 0.80mm FPT-160P-M03

FPT-160P-M03

Abstract: QFP160-P-2828-3
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 160 PIN PLASTIC To Top / Package Lineup / Package Index FPT-160P-M03 EIAJ code :∗QFP160-P-2828-3 160-pin plastic QFP Lead pitch 0.65 mm Package width x package length 28 × 28 mm Lead shape Gullwing

160LEAD

Abstract: QFP160-P-2424-1
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 160 PIN PLASTIC To Top / Package Lineup / Package Index FPT-160P-M10 EIAJ code :∗QFP160-P-2424-1 160-pin plastic QFP Lead pitch 0.50 mm Package width x package length 24 × 24 mm Lead shape Gullwing

FPT-100P-M15

Abstract: 216-0040
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC To Top / Package Lineup / Package Index FPT-100P-M15 100-pin plastic QFP Lead pitch 0.65 mm Package width x package length 14 × 20 mm Lead shape Gullwing Sealing method Plastic mold

QFP160-P-2828-4

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 160 PIN PLASTIC To Top / Package Lineup / Package Index FPT-160P-M04 EIAJ code :∗QFP160-P-2828-4 160-pin plastic QFP Lead pitch 0.65 mm Package width x package length 28 × 28 mm Lead shape Gullwing

QFP160-P-2828-5

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 160 PIN PLASTIC To Top / Package Lineup / Package Index FPT-160P-M08 EIAJ code :∗QFP160-P-2828-5 160-pin plastic QFP Lead pitch 0.65 mm Package width x package length 28 × 28 mm Lead shape Gullwing

bga socket

Abstract: BGA and QFP Package Reliability Data Plastic Packages QFP testing of diode J-Lead, QFP TQFP 80 socket
Contextual Info: Packaging Contents March 2000 Application Notes AN 71 Guidelines for Handling J-Lead & QFP Devices AN 80 Selecting Sockets for Altera Devices AN 81 Reflow Soldering Guidelines for Surface-Mount Devices AN 90 SameFrame Pin-Out Designs for FineLine BGA Packages

QFP100-P-1420-4

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC To Top / Package Lineup / Package Index FPT-100P-M06 EIAJ code :∗QFP100-P-1420-4 100-pin plastic QFP Lead pitch 0.65 mm Package width x package length 14 × 20 mm Lead shape Gullwing

QFP100-P-1420-5

Abstract: fujitsu
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC To Top / Package Lineup / Package Index FPT-100P-M07 EIAJ code :∗QFP100-P-1420-5 100-pin plastic QFP Lead pitch 0.65 mm Package width x package length 14 × 20 mm Lead shape Gullwing

pin diagram of hcs12 microcontroller

Abstract: HCS12 M68HC11 MC9S12Q hcs12 cpu registers
Contextual Info: Freescale Semiconductor Product Brief MC9S12QFAMPP Rev. 6, 9/2005 MC9S12Q-Family 16-bit Microcontroller Based on Freescale Semiconductor’s market-leading Flash technology, members of the MC9S12Q Family deliver the power and flexibility of our 16-bit core CPU12 family to a whole new range