QFP 94 Search Results

ASTM-B16-85

Contextual Info: Part No. 96-080M80 - QFP to PGA Adapter for EIAJ 80 Position, .0315 [.80] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

ASTM-B16-85

Contextual Info: Part No. 96-100M65 - QFP to PGA Adapter for EIAJ 100 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

ASTM-B16-85

Contextual Info: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

56001 motorola

Abstract: 56001 ASTM-B16-85 18021
Contextual Info: Part No. 97-56001 - QFP to PGA Adapter for Motorola DSP56000/001 FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board

144 QFP body size

Abstract: ASTM-B16-85
Contextual Info: Part No. 97-68340 - 144 Pin QFP to PGA Adapter for Motorola 68340 FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board

ASTM-B16-85

Contextual Info: Part No. 96-160M65 - QFP to PGA Adapter for 160 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board

Contextual Info: ADVANCED QFP Sockets INTERCONNECTIONS. 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850 / 401-823-5200 Fax 401-823-8723 Email advintC0rp@a0l.C0m Internet http://www.advintcorp.com QFP Sockets Preliminary - Consult Factory Features:

Motorola MC6805 pin diagram

Abstract: MC6805 motorola a00a a06b 848B AN1066 AN442 MC145003 MC145004 MC6805
Contextual Info: MOTOROLA Order this document by MC145003/D SEMICONDUCTOR TECHNICAL DATA MC145003 MC145004 Product Preview 128 Segment LCD Drivers CMOS 1 ORDERING INFORMATION MC145003FU MC145004FU QFP QFP PIN ASSIGNMENT FP32 FP31 FP30 FP29 FP28 FP27 FP26 FP25 FP24 FP23 FP22

icx060ak

Abstract: sdfw0xxx CCD SENSORS OPB 715 44n30
Contextual Info: PRELIMINARY KS7213 CCD TIMING GENERATOR GENERAL DESCRIPTION 80-QFP-1212 The KS7213 is a timing generator IC which generates the timing pulses necessary for color CCD image sensors. ORERING INFORMATION Device KS7213 FEATURES Package 80-QFP-1212 Operating Temperature

3DSD3G48VQ6486

Contextual Info: MEMORY MODULE SDRam 64Mx48-QFP Synchronous Dynamic Ram MODULE 3DSD3G48VQ6486 3Gbit SDRam organized as 64Mx48, based on 32Mx16 Pin Assignment Top View QFP 114-(Pitch : 0.635mm) - Organized as 64Mx48-bit. - Single +3.3V power supply. 27 28 29 30 31 32 33 34

P113

Abstract: P114 P115 Z87000 Z87010 Z87L00
Contextual Info: PRELIMINARY PRODUCT SPECIFICATION 1 Z87000/Z87L00 1 SPREAD SPECTRUM CONTROLLERS FEATURES Device ROM KWords RAM* I/O (Words) Lines Z87000 12 512 32 Z87L00 12 512 32 Package Information • 84-Pin PLCC 100-Pin QFP 100-Pin QFP Note: *General-Purpose ■ ■

sd3-75

Abstract: FDC37C67X FDC37C93X cross PD6 GP20 GP25 SA10 SMSC Corporation cross reference
Contextual Info: APPLICATION NOTE 6.13 FDC37C67x/FDC37C93x Dual Footprint By Nizar Azzam This document describes a dual footprint layout for the FDC37C67x and the FDC37C93x. The FDC37C67x is a 100 pin QFP/TQFP package and the FDC37C93x is a 160 pin QFP package. Refer to FDC37C67x and

Aluminum nitride QFP

Abstract: nitride
Contextual Info: QUAD FLAT L-LEADED PACKAGE 160 PIN CERAMIC FPT-160C-C02 Lead pitch 0.65mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.80mm Base ceramic material Aluminum nitride 160-pin ceramic QFP FPT-160C-C02 160-pin ceramic QFP (FPT-160C-C02)

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 80 PIN CERAMIC To Top / Package Lineup / Package Index FPT-80C-A02 80-pin ceramic QFP Lead pitch 0.8 mm Lead shape Gullwing Sealing method Metal seal FPT-80C-A02 80-pin ceramic QFP (FPT-80C-A02)

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN CERAMIC To Top / Package Lineup / Package Index FPT-64C-A02 64-pin ceramic QFP Lead pitch 1.0 mm Lead shape Gullwing Sealing method Metal seal FPT-64C-A02 64-pin ceramic QFP (FPT-64C-A02)

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN CERAMIC To Top / Package Lineup / Package Index FPT-100C-A02 100-pin ceramic QFP Lead pitch 0.65 mm Lead shape Gullwing Sealing method Metal seal FPT-100C-A02 100-pin ceramic QFP (FPT-100C-A02)

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN CERAMIC To Top / Package Lineup / Package Index FPT-64C-A01 64-pin ceramic QFP Lead pitch 1.0 mm Lead shape Gullwing Sealing method Metal seal FPT-64C-A01 64-pin ceramic QFP (FPT-64C-A01)

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN CERAMIC To Top / Package Lineup / Package Index FPT-100C-A01 100-pin ceramic QFP Lead pitch 0.65 mm Lead shape Gullwing Sealing method Metal seal FPT-100C-A01 100-pin ceramic QFP (FPT-100C-A01)

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 80 PIN CERAMIC To Top / Package Lineup / Package Index FPT-80C-A01 80-pin ceramic QFP Lead pitch 0.8 mm Lead shape Gullwing Sealing method Metal seal FPT-80C-A01 80-pin ceramic QFP (FPT-80C-A01)

QFP176-P-2424-1

Abstract: QFP176
Contextual Info: QUAD FLAT L-LEADED PACKAGE 176 PIN PLASTIC FPT-176P-M01 EIAJ code : ∗QFP176-P-2424-1 176-pin plastic QFP Lead pitch 0.50mm Package width x package length 24 × 24mm Lead shape Gullwing Sealing method Plastic mold FPT-176P-M01 176-pin plastic QFP (FPT-176P-M01)

Contextual Info: QUAD FLAT L-LEADED PACKAGE 80 PIN CERAMIC FPT-80C-A02 Lead pitch 0.8 mm Lead shape Gullwing Sealing method Metal seal 80-pin ceramic QFP FPT-80C-A02 80-pin ceramic QFP (FPT-80C-A02) 0.51(.020) TYP 17.91(.705) TYP 16.00(.630) 14.00±0.25 TYP (.551±.010)

Contextual Info: QUAD FLAT L-LEADED PACKAGE 64 PIN CERAMIC FPT-64C-A02 Lead pitch 1.0 mm Lead shape Gullwing Sealing method Metal seal 64-pin ceramic QFP FPT-64C-A02 64-pin ceramic QFP (FPT-64C-A02) 0.51(.020) TYP 9.40(.370)TYP 17.91(.705) TYP 16.00(.630) 14.00±0.25 TYP

ceramic QFP Package 100 lead

Contextual Info: QUAD FLAT L-LEADED PACKAGE 100 PIN CERAMIC FPT-100C-A02 Lead pitch 0.65 mm Lead shape Gullwing Sealing method Metal seal 100-pin ceramic QFP FPT-100C-A02 100-pin ceramic QFP (FPT-100C-A02) 0.51(.020) TYP 8.89(.350)DIA TYP 17.91(.705) TYP 16.00(.630) 14.00±0.25

Contextual Info: QUAD FLAT L-LEADED PACKAGE 80 PIN CERAMIC FPT-80C-A01 Lead pitch 0.8mm Lead shape Gullwing Sealing method Metal seal 80-pin ceramic QFP FPT-80C-A01 80-pin ceramic QFP (FPT-80C-A01) 1.60(.063)TYP 0.51(.020)TYP 17.91(.705) TYP 14.00±0.25 (.551±.010) INDEX AREA