QFP 64 PACKAGE Search Results

QFP-48A

Contextual Info: Package MITSUMI Packages QFP Series Units : mm QFP-32A QFP-44B QFP-48A QFP-56B QFP-64B QFP-64E 0.15+0.10 -0.06 33 48 49 52 14.0±0.20 17.9±0.40 32 64 32 0.8±0.20 33 14.0±0.2 16.0±0.3 51 0.6±0.2 0.15+0.10 -0.05 20 17 64 19 1 0.15 M 0~10° 16 14.0±0.2

ka8511

Abstract: KS8804b KT8557 KT8593
Contextual Info: FUNCTION GUIDE LINEAR ICs 4. TELECOMMUNICATION APPLICATION Application Device Package Continued Circuit Function 1 Chip CLP ÎT KA8510 ff KA8511 ff KA8522 t f KA8523 64 DIP/64 QFP 64 DIP/64 QFP Included dual conversion receiver, transmitter, compandor and PLL

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN CERAMIC To Top / Package Lineup / Package Index FPT-64C-A02 64-pin ceramic QFP Lead pitch 1.0 mm Lead shape Gullwing Sealing method Metal seal FPT-64C-A02 64-pin ceramic QFP (FPT-64C-A02)

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN CERAMIC To Top / Package Lineup / Package Index FPT-64C-A01 64-pin ceramic QFP Lead pitch 1.0 mm Lead shape Gullwing Sealing method Metal seal FPT-64C-A01 64-pin ceramic QFP (FPT-64C-A01)

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN CERAMIC FPT-64C-A01 64-pin ceramic QFP Lead pitch 1.0 mm Lead shape Gullwing Sealing method Metal seal FPT-64C-A01 64-pin ceramic QFP (FPT-64C-A01) 17.91(.705) TYP 16.00(.630) 14.00±0.25

64-PIN

Abstract: 5510-10
Contextual Info: QUAD FLAT L-LEADED PACKAGE 64 PIN CERAMIC FPT-64C-A01 64-pin ceramic QFP Lead pitch 1.0 mm Lead shape Gullwing Sealing method Metal seal FPT-64C-A01 64-pin ceramic QFP (FPT-64C-A01) 0.51(.020) TYP 17.91(.705) TYP 16.00(.630) 14.00±0.25 TYP (.551±.010)

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN CERAMIC FPT-64C-A02 64-pin ceramic QFP Lead pitch 1.0 mm Lead shape Gullwing Sealing method Metal seal FPT-64C-A02 64-pin ceramic QFP (FPT-64C-A02) 0.51(.020) TYP 9.40(.370)TYP 17.91(.705)

FPT-64P-M09

Abstract: QFP064-P-1212-1
Contextual Info: QUAD FLAT L-LEADED PACKAGE 64 PIN PLASTIC FPT-64P-M09 EIAJ code : ∗QFP064-P-1212-1 Lead pitch 0.65mm Package width x package length 12 × 12mm Lead shape Gullwing Sealing method Plastic mold 64-pin plastic QFP FPT-64P-M09 64-pin plastic QFP (FPT-64P-M09)

Contextual Info: QUAD FLAT L-LEADED PACKAGE 64 PIN CERAMIC FPT-64C-A02 Lead pitch 1.0 mm Lead shape Gullwing Sealing method Metal seal 64-pin ceramic QFP FPT-64C-A02 64-pin ceramic QFP (FPT-64C-A02) 0.51(.020) TYP 9.40(.370)TYP 17.91(.705) TYP 16.00(.630) 14.00±0.25 TYP

Contextual Info: 64-304518-10 Adapter for using 64 Pin QFP in Place of 64 Shrink Dip Package Hitachi HD6475208 and Others FEATURES: • A cost effective means of upgrading to QFP without changing your PCB layout. • Pin for Pin Layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper

HD6475208

Abstract: HD647520
Contextual Info: 64-304518-10 Adapter for using 64 Pin QFP in Place of 64 Shrink Dip Package Hitachi HD6475208 and Others FEATURES: • A cost effective means of upgrading to QFP without changing your PCB layout. • Pin for Pin Layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper

Contextual Info: 64-304518-10 Adapter for using 64 Pin QFP in Place of 64 Shrink Dip Package Hitachi HD6475208 and Others FEATURES: • A cost effective means of upgrading to QFP without changing your PCB layout. • Pin for Pin Layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper

Contextual Info: 64-304518-10 Adapter for using 64 Pin QFP in Place of 64 Shrink Dip Package Hitachi HD6475208 and Others FEATURES: • A cost effective means of upgrading to QFP without changing your PCB layout. • Pin for Pin Layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper

Contextual Info: 64-304518-10 Adapter for using 64 Pin QFP in Place of 64 Shrink Dip Package Hitachi HD6475208 and Others FEATURES: • A cost effective means of upgrading to QFP without changing your PCB layout. • Pin for Pin Layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper

frequency hopping spread spectrum

Abstract: spread spectrum receiver circuity TDD synchronizer cordless phone "control signals" cordless phone Transceiver IC direct sequence spread spectrum P115 Z87000 Z87001 Z87010
Contextual Info: PRELIMINARY CUSTOMER PROCUREMENT SPECIFICATION 1 Z87001/Z87L01 1 ROMLESS SPREAD SPECTRUM CORDLESS PHONE CONTROLLER FEATURES Device ROM * KWords Z87001 Z87L01 64 64 RAM I/O (Words) Lines 512 512 32 32 Package Information • 144-Pin QFP 144-Pin QFP Note: *Maximum accessible external ROM

64QFP

Contextual Info: 82078 64 PIN 12.1 Package Outline for the 64 QFP Part The 82078 addresses the current need of the smaller and thinner packages, for the current market. The size of the part is becoming increasingly important in the portable computer market. The QFP part considerably

A2 diode

Abstract: transistor A2 3eb data lmu a2 TQFP 32 PACKAGE 272-pin TQFP 100 Pitch 0,4
Contextual Info: : Available, : Under development Plastic QFP Fine Pitch Nominal Dimensions (mm) Lead Pitch Classification (mm) Pin Counts 48 64 72 80 88 100 120 144 160 176 208 216 240 256 272 304 376 QFP 7x7 TQFP QFP 10 × 10 TQFP QFP 12 × 12 TQFP QFP 14 × 14 LQFP 0.5

132 pin PGA socket

Contextual Info: Part No. 95-132I25 - QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch FEATURES: •Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

100-PGM13069-30

Contextual Info: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

ASTM-B16-85

Contextual Info: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

132 pin PGA socket

Contextual Info: Part No. 95-132I25 - QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch FEATURES: •Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Part No. 95-132I25 - QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch FEATURES: •Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

95-132I25

Abstract: ASTM-B16-85
Contextual Info: Part No. 95-132I25 - QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch FEATURES: •Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.