QFP 64 PACKAGE Search Results

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN CERAMIC To Top / Package Lineup / Package Index FPT-64C-A02 64-pin ceramic QFP Lead pitch 1.0 mm Lead shape Gullwing Sealing method Metal seal FPT-64C-A02 64-pin ceramic QFP (FPT-64C-A02)

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN CERAMIC To Top / Package Lineup / Package Index FPT-64C-A01 64-pin ceramic QFP Lead pitch 1.0 mm Lead shape Gullwing Sealing method Metal seal FPT-64C-A01 64-pin ceramic QFP (FPT-64C-A01)

Contextual Info: QUAD FLAT L-LEADED PACKAGE 64 PIN CERAMIC FPT-64C-A02 Lead pitch 1.0 mm Lead shape Gullwing Sealing method Metal seal 64-pin ceramic QFP FPT-64C-A02 64-pin ceramic QFP (FPT-64C-A02) 0.51(.020) TYP 9.40(.370)TYP 17.91(.705) TYP 16.00(.630) 14.00±0.25 TYP

64-pin qfp

Abstract: qfp 0.8mm 64PIN
Contextual Info: M38007T-PRB Converter for Connecting 64-pin RSS Type Emulator MCU to 64-pin 0.5, 0.65 and 0.8mm-pitch QFP Target Function The M38007T-PRB is a board to convert the pin assignment of 64-pin RSS type emulator MCU to that of 64-pin 0.5mm-pitch, 0.65mm-pitch and 0.8mm-pitch QFP.

ASTM-B16-85

Contextual Info: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: M3T-DUMMY64 Dummy IC for 64-pin 0.8mm-pitch QFP 64P6N-A Dimensions Function This accessory tool connects the probe of an emulation pod and the target, or an MCU and the target. Its dimensions are the same as those of the MCU for the 64-pin 0.8mm-pitch QFP (64P6N-A) package.

3 phase discrete pwm signal generator ic

Abstract: IM2000F IM2000P 3 phase pwm signal generator ic internal circuit diagram for ic 4047 IC 4047 pin diagram IM2000S phase controller trigger ic three phase pulse generator IM2000
Contextual Info: FEATURES • Complete Microstepping Control System in the following packages: - 68 Pin PLCC IM2000P - 80 Pin QFP (IM2000F) - 64 Pin QFP (IM2000S) • Up to 10MHz Step Clock Rate • Internal Sine/Cosine Generator • PWM Phase Current Control • Minimal External Components

3568A

Contextual Info: TRAY CONTAINER UNIT : mm 335±1.0 20.5±0.5 294±0.5 PPE 27.5±0.1 耐熱 137.5±0.5 180±1.0 21.25±0.5 21±0.1 A' 18.4 A LA-3568A-1 135°C MAX 18.4 SECTION A-A' 18.4 5.45 6.3 8.8 13.9 Applied Package Quantity (pcs) 52-pin Plastic QFP (2.7mm thick) 64-pin Plastic QFP (2.55mm, 2.7mm thick)

FPT-64P-M09

Abstract: fujitsu 64-Pin Plastic QFP QFP064-P-1212-1
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN PLASTIC To Top / Package Lineup / Package Index FPT-64P-M09 EIAJ code :∗QFP064-P-1212-1 64-pin plastic QFP Lead pitch 0.65 mm Package width x package length 12 × 12 mm Lead shape Gullwing

QFP064-P-1420-3

Abstract: 016C
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN PLASTIC To Top / Package Lineup / Package Index FPT-64P-M07 EIAJ code :∗QFP064-P-1420-3 64-pin plastic QFP Lead pitch 1.00 mm Package width x package length 14 × 20 mm Lead shape Gullwing

QFP064-P-1420-5

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN PLASTIC To Top / Package Lineup / Package Index FPT-64P-M10 EIAJ code :∗QFP064-P-1420-5 64-pin plastic QFP Lead pitch 1.00 mm Package width x package length 14 × 20 mm Lead shape Gullwing

land pattern QFP 208

Abstract: qfp 64 land pattern IC SOCKET Yamaichi ic61 IC61-0644-052 IC61-0644-053 IC61-080-079 80P6N-A
Contextual Info: IC61-0644-052 64-pin LCC Socket Manually Soldering Type Made by Yamaichi Electronics Co., Ltd. Function The IC61-0644-052 is an IC socket that can be soldered to a foot pattern for a 64-pin 0.8mm-pitch QFP (64P6N-A) package MCU (manually soldering type).

LA-0568A-1

Abstract: SSD-A-H6203-2 QFp Package tray NEC PS
Contextual Info: TRAY CONTAINER Unit : mm 335±1.0 20.5±0.5 294±0.5 27.5±0.1 PS 137.5±0.5 180±1.0 21.25±0.5 21±0.1 A A' 18.4 LA-0568A-1 50°C MAX. 18.4 SECTION A-A' 18.4 5.8 8.8 13.9 5.45 Applied Package Quantity (pcs) 52-pin•Plastic QFP (2.7mm thick) 64-pin·Plastic QFP (2.55mm, 2.7mm thick)

FPT-64P-M06

Abstract: QFP064-P-1420-3
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN PLASTIC To Top / Package Lineup / Package Index FPT-64P-M06 EIAJ code :∗QFP064-P-1420-3 64-pin plastic QFP Lead pitch 1.00 mm Package width x package length 14 × 20 mm Lead shape Gullwing

diode code m10

Abstract: QFP064-P-1420-5
Contextual Info: QUAD FLAT L-LEADED PACKAGE 64 PIN PLASTIC FPT-64P-M10 EIAJ code : ∗QFP064-P-1420-5 Lead pitch 1.00mm Package width x package length 14 × 20mm Lead shape Gullwing Sealing method Plastic mold Length of flat portion of pins 0.80mm 64-pin plastic QFP FPT-64P-M10

FPT-64P-M07

Abstract: QFP064-P-1420-3
Contextual Info: QUAD FLAT L-LEADED PACKAGE 64 PIN PLASTIC FPT-64P-M07 EIAJ code : ∗QFP064-P-1420-3 Lead pitch 1.00mm Package width x package length 14 × 20mm Lead shape Gullwing Sealing method Plastic mold Length of flat portion of pins 1.70mm 64-pin plastic QFP FPT-64P-M07

lqfp64

Abstract: LQFP-48 LQFP-64 QFP-64 P22TXD CPU H8
Contextual Info: • Compact package Package Code Body Size Pin Pitch LQFP-64 FP-64E 10.0 x 10.0 mm 0.5 mm QFP-64 FP-64A LQFP-48 FP-48F LQFP-48 FP-48B 14.0 × 14.0 mm 10.0 × 10.0 mm 7.0 × 7.0 mm 0.8 mm 0.65 mm 0.5 mm Only LQFP-64 FP-64E for H8/3694N package Port 8 Port 7

Contextual Info: UG3D3264C7B8 256K Bytes 32K x 64 160 Pin SRAM DIMM based on 32K x 32 Features General Description The UG3D3264C7B8 is a 262,019 bits by 64 Sync Burst SRAM module. The UG3D3264C7B8 is assembled using 2 pcs of 32K x 32 Sync Burst SRAMs in 100-pin QFP packages and

UG3D6464D7B8

Contextual Info: UG3D6464D7B8 512K Bytes 64K x 64 160 Pin SRAM DIMM based on 64K x 32 Features General Description The UG3D6464D7B8 is a 524,038 bits by 64 Sync Burst SRAM module. The UG3D6464D7B8 is assembled using 2 pcs of 64K x 32 Sync Burst SRAMs in 100-pin QFP packages and

IR8200B

Abstract: microstepping L6203 3 phase discrete pwm signal generator ic schematic diagram 48v dc motor speed controller SGS L6203 sine cosine l298 IM2000S MICROSTEP l298 IR8200 L6203 im2000
Contextual Info: TTM intelligent motion systems, inc. Excellence in MotionTM IM2000S HIGH PERFORMANCE MICROSTEPPING STEP MOTOR CONTROLLER IM2000S - ULTRA SMALL 64 PIN QFP OPERATING INSTRUCTIONS Table of Contents Introduction to the IM2000S . 3

Contextual Info: SONY* C X A 1 3 9 1 Q / R Processing IC for Complementary Color Mosaic CCD Camera Description The CXA1391Q/R is a bipolar IC developed for signal processing in complementary color mosaic CCD cameras. CXA1391Q 64 pin QFP Plastic CXA1391R 64 pin VQFP (Plastic)

FLX100

Abstract: HQPACK064SA
Contextual Info: M3T-FLX-64NSA Converter for Connecting 100-core Flexible Board FLX100 to 64-pin 0.8mm-pitch QFP/LQFP External View and Dimensions Function The M3T-FLX-64NSA is a converter for connecting the FLX100 100-core flexible board to a foot pattern of a 64-pin 0.8mm-pitch

TT 2222

Abstract: TMP95C063F QFP100-P-2222-0 tmp95c061bf QFP 144 PACKAGE QFP144 QFP64 package QFP100-P-1414-0 QFP64-P-1414-0 TMP95C001F
Contextual Info: TO SHIBA PACKAGE 64 pin QFP : fo r TMP95C001F PACKAGE NAME : QFP64-P-1414-0.80A Unit. mm 17.210.2 14.010.2 F'~ T3= i32 '49' "TI*1"'"! ^*”11' o 64 & CM CM $ TÍ CM S 17 16 1.0TYP 0.3510.1 4H0.16Çm | CM- $ r-« «Ä CM in L-M o.1 15.610.2 PKG900-1 ? .X .

LQFP64

Abstract: LQFP-48 LQFP-64 QFP-64 CPU H8
Contextual Info: • Compact package Package Code Body Size Pin Pitch LQFP-64 FP-64E 10.0 x 10.0 mm 0.5 mm QFP-64 FP-64A LQFP-48 FP-48F 10.0 × 10.0 mm 0.65 mm LQFP-48 FP-48B SDIP-42 DP-42S 14.0 × 14.0 mm 7.0 × 7.0 mm 14.0 × 37.3 mm 0.8 mm 0.5 mm 1.78 mm Only LQFP-64 FP-64E for H8/3664N package