QFP 144 PACKAGE Search Results

FPT-144P-M05

Contextual Info: QUAD FLAT L-LEADED PACKAGE 144 PIN PLASTIC FPT-144P-M05 144-pin plastic QFP Lead pitch 0.50mm Package width x package length 20 × 20mm Lead shape Gullwing Sealing method Plastic mold Mounting height 2.45mm MAX FPT-144P-M05 144-pin plastic QFP (FPT-144P-M05)

footprint plcc 208

Abstract: PLASTIC QUAD FLAT PACK 160 PINS DIMENSION LXT304A LXT305A LXT307 LXT310 LXT317 LXT318 LXT325 A 3120 8 Pins ICs
Contextual Info: Fall 1998 Communication ICs Data Book Table 1: Telecom Product/Packages Product Table 1: Telecom Product/Packages Product Package Package SXT6051 208 QFP SXT6251 208 QFP SXT6282 144-Pin LQFP LXT300Z/301Z 28-Pin DIP and 28-Pin PLCC LXT304A 28-Pin DIP and 28-Pin PLCC

144-TERMINAL

Abstract: 82365SL PCI1510 PCI1510GGU PCI1510PGE PCI1510PGEG4 PCI1510ZGU TPS2211A
Contextual Info: PCI1510 GGU/GVF PGE/ZGU/ZVF www.ti.com SLLA229 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • A 144-terminal low-profile QFP PGE , 144-terminal MicroStar BGA ball-grid array (GGU/ZGU) package, or a 209-terminal PBGA (GVF/ZVF) package

MPC5643L

Abstract: mpc5643 MPC5643LRM MPC5643L Microcontroller Reference Manual MPC5604P MPC5643L manual MPC5643L interrupts MPC560XPRM e200 MPC5643L pinout
Contextual Info: Document Number: AN3952 Rev. 0, 10/2009 MPC560xP and MPC564xL Compatibility Transition from MPC5604P to MPC5643L in QFP 144 packages by: Oliver Bibel München, Freescale EMEA The high performance MPC56xxx MCU architecture, which includes the MPC560xP family, now adds the

Contextual Info: HYM8V64110 PG-Series SDIMM 1Mx64 bit SGRAM MODULE based on 512Kx32 SGRAM, LVTTL, 1K-Refresh 1 PRELIMINARY DESCRIPTION The HYM8V64110 is high speed 3.3 Volt Synchronous Graphic RAM module consisting of four 512Kx32 bit Synchronous GRAMs in 100pin QFP on a 144 pin glass-epoxy circuit board. 0.1µF and 0.01µF decoupling

CXD1160aq

Abstract: VL82C486-FC2 VL82C486FC NCR53C720 vl82c486 cxd1160 74HC125 EPM7128 d75304gf A1280
Contextual Info: Issued March 1997 232-5109 Data Pack H Surface mount test clips Manufacturers device number to RS stock number cross reference Data Sheet N.B. Some devices have the same basic type numbers but are available in several package styles. Before selecting a test clip ensure that the package type matches that of the device to be tested.

IC51-1284-1433

Abstract: IC51-807 IC51-0484-806 IC51-1444-1354-7 IC51-0644-1240 IC51-2564-1668-6 OT 306 IC51-128 IC217-2404-007 cxd 158
Contextual Info: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage:

Contextual Info: Document Number: SCF5250EC Rev. 1.3, 07/2006 Freescale Semiconductor Data Sheet: Technical Data SCF5250 Package Information MAPBGA–196 LQFP-144 SCF5250 Integrated ColdFire Microprocessor Data Sheet 1 Introduction This document provides an overview of the SCF5250

cxd 158

Abstract: ot 239 IC51-128 OT 306 IC51-2564-1668-6 IC51-0444-467 IC51-1764 socket Yamaichi ic234 IC51-1764-1505-10 IC217-1444-003
Contextual Info: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Speci cations Insulation Resistance: Dielectric Withstanding Voltage:

TT 2222

Abstract: TMP95C063F QFP100-P-2222-0 tmp95c061bf QFP 144 PACKAGE QFP144 QFP64 package QFP100-P-1414-0 QFP64-P-1414-0 TMP95C001F
Contextual Info: TO SHIBA PACKAGE 64 pin QFP : fo r TMP95C001F PACKAGE NAME : QFP64-P-1414-0.80A Unit. mm 17.210.2 14.010.2 F'~ T3= i32 '49' "TI*1"'"! ^*”11' o 64 & CM CM $ TÍ CM S 17 16 1.0TYP 0.3510.1 4H0.16Çm | CM- $ r-« «Ä CM in L-M o.1 15.610.2 PKG900-1 ? .X .

Z87000

Abstract: Z8700000TSC Z8700000ZEM Z8700001ZCO Z87010 Z87100 Z87200 QFP PACKAGE mass Z86193
Contextual Info: WIRELESS PROCESSORS Product Family Pin Count ROM KW RAM (General-Purpose) OTP (Words) I/O INT Z87000 Z87010 Z87100 Z87200 84, 100 44 18 100 12 4 * *1 KB — — 512 X 512 — 124 byte — — 32 4 12 — COMP CTCs WDT Package Type Speed (MHz) — — 1 —

PCN0714

Abstract: EQFP-144 XZ074 EQFP 144 PACKAGE altera TQFP 32 PACKAGE ep1k30 pin marking ic 2008 EP1K100 EPF8452A EPF8636A
Contextual Info: Revision: 1.3.0 PROCESS CHANGE NOTIFICATION PCN0714 UPDATE ASSEMBLY PLANT CHANGE FOR PQFP AND TQFP PACKAGES Change Description: This is an update to PCN0714; please see the revision history table for information specific to this update. The plastic quad flat pack PQFP and thin quad flat pack (TQFP) packages currently

4100-005

Abstract: IC234 IC234-0644-027 IC234-1604-018 IC234-0804-026 X1912 IC234-1444-016 IC234-1204-065 IC234-1004-008
Contextual Info: IC234 Series Open Top Quad Flat Package (QFP - Shoulder Contact Type) Specifications Part Number (Details) Insulation Resistance: 1,000M Ω min. at 100V DC, pitch 0.4, 0.5 1,000M Ω min. at 500V DC, pitch 0.65, 0.8 Dielec. Withstd. Voltage: for 1 minute at 100V AC, pitch 0.4, 0.5

AK32D300-QFP5X5

Abstract: AK32D600-QFP5X5 AK32D300-QFP7X7 AK32D600-QFP7X7 AK32D600-QFP7X7-A1-1 AK44D600-QFP .65mm AK44D600-QFP .8mm 10x10 AK44D900-QFP 1.0mm AK48D600-QFP .5mm 7x7 AK48D900-QFP .8mm 12x12
Contextual Info: ACCUTEK Quad Flat Package QFP DIP or PGA Adapters MICROCIRCUIT CORPORATION DIP or PGA ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek QFP Adapter Modules converts surface

LQFP-48 thermal pad

Abstract: exposed QFP 144 CQFP 240 QFP-128 20 x 14 pad exposed QFP 128 BGA-64 pad LQFP-64 thermal pad 2-CQFP SOT23-6 1152 BGA 144
Contextual Info: Thermal Characteristics of IC Assembly method for using this board is specified by the SEMI standard G38-87. These standards are available in the SEMI International Standards book, Volume 4, for packaging. INTRODUCTION The purpose of this document is to provide a centralized

35 x 35 PBGA, 580 100 balls

Abstract: of BGA Staggered Pins package BGA Ball Crack without underfill BGA PACKAGE thermal resistance 60um of BGA Staggered pins
Contextual Info: NEW PRODUCTS 7 LATEST TECHNOLOGICAL TRENDS IN VLSI PACKAGES AND DEVELOPMENT OF NEW PACKAGES Hisao Kasuga/Miwa Momma Introduction Consumers expect constant progress in electronic systems and record-breaking size reduction each time a new product is released. To kindle consumers’ interest,

IC51-0484-806

Abstract: IC51-1284-1788 IC51-0324-1498 IC51-1764-1505-5 IC51-1284-1433 IC51-1844-1148 IC51-2564-1668-10 ic51-0804-795 ic51-0444-825 IC51-1604-1350
Contextual Info: QFP, PQFP, TQFP Clamshell IC51 Series IC51- 064 4- 038 Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: Socket Series No. of Leads No. of Sides with Contacts Design No. Characteristics 1,000M½minimum at 500 VDC 700 VAC for 1 minute

IC51-1444-1354-7

Abstract: IC51-1444-1354 IC51-1204-1646 IC51-1444-1014-3 ic51-1204-1812 IC51-1204-1497 IC51-1284-1433 IC51-1124-1036-YED IC51-1124-1036-2 ks 213 F
Contextual Info: IC51 Series Clamshell QFP, PQFP and TQFP Part Number (Details) Specifications As specifications for this product differ by pitch and material-mix, please contact our Sales Department for detailed information. IC51 Series No. 1,000M Ω min. at100V DC, 500V DC

R5S72671

Abstract: sh7266 SH7267 R5S72661P144FP R5S72671P144FP R5S72670W144FP R5S72660W144FP R5S7266 R5S7267 digital car dashboard
Contextual Info: Renesas Technology to Release SH7266 and SH7267 32-bit MCUs with LargeCapacity 1.5 MB On-Chip SRAM ⎯ Contributes to reduced overall system cost and size by enabling VGA display for applications such as digital audio players and equipments with LCD display

9s12xdt384

Contextual Info: Freescale Semiconductor Product Brief 9S12XDFAMPP Rev. 2.14, 7-Nov-2005 MC9S12XD Family 16-bit Microprocessor Family covers MC9S12XD64 through MC9S12XDP512 and MC3S12XDT256/MC3S12XDG128 Introduction Targeted at automotive multiplexing applications, the MC9S12XD Family will deliver 32-bit performance

SH7264

Abstract: SH7262 R5S72643P144FPU R5S72642W144FPU R5S72620P144FPU digital car dashboard E10A-USB FAT32 RGB565 SH7263
Contextual Info: Renesas Technology Releases SH7262 and SH7264 SuperH Microcontrollers with 1 Mbyte On-Chip SRAM for Digital Audio and Graphical Dashboard Applications ⎯ Support for WQVGA-size TFT LCD panel display without external SDRAM; largely single-chip implementation of midrange or low-end systems ⎯

HC9S12XFAMFS

Abstract: MC9S12XDT512 Architecture of MC9S12xDP512 MC9S12XD256 MC9S12XDT256 MC9S12XA256 LQFP-112 68HC11 68HC12 HCS12
Contextual Info: High-Performance 16-bit Microcontrollers HCS12X Target Applications > Climate control > Improved 32-bit calculations and semaphore handling > > Access to large data segments independent of PPAGE > > > > Industrial control gateways Body control module > Factory

pin diagrams of basic gates

Abstract: BGA and QFP Package Nand gate Crystal Oscillator 272000 astro tool HQFP-208 MCM NAND qcm 5 sim 980 CE61
Contextual Info: To Top / Lineup / Index Product Line-up FUJITSU Semicustom Products Semicustom Products Gate arrays Sea-of-Gate CMOS Macro-embedded type cell arrays CMOS Standard cell CMOS Semicustom microcontrollers QCM series* ASTRO NT Bi-CMOS SIM/PLL SERIES Bi-CMOS SAW PLL

SC-82AB

Contextual Info: PACKAGE LINE-UP Lead pitch and Number of pins of each package are shown in the following chart. < Lead Insertion Type > Name of PKG PKG CODE DIP SDIP SIP ZIP DX L L S TO-220 T△x TO-220F F Ver.2009-05-25 PITCH 2.54mm 1.778mm 2.54mm 1.50mm 1.7mm 2.54mm 2.54mm