QFP 132 Search Results

32Q-QF

Contextual Info: PA32QF-32QF Data Sheet 32 pin QFP socket/32 pin QFP plug Supported Device/Footprints Adapter Construction These adapters accept 32 pin QFP devices and have a removable 32 pin QFP solder-down plug. This allows QFP device to be inserted into and removed from a prototype easily.

Contextual Info: PA711D3-QFP Data Sheet 44 pin QFP socket/28 pin DIP 0.6” plug Supported Device/Footprints Adapter Wiring Using this adapter, the Motorola 68HC711D3 in the QFP package can be programmed on 28 pin DIP programmers. The following chart shows the connections from the QFP device

132 pin PGA socket

Contextual Info: Part No. 95-132I25 - QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch FEATURES: •Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

132 pin PGA socket

Contextual Info: Part No. 95-132I25 - QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch FEATURES: •Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: PA552-QFP Data Sheet 80 pin QFP socket/40 pin DIP 0.6” plug Supported Device/Footprints Adapter Wiring This adapter allows programming of the Philips 87C552 and 87C554 in a QFP package on 40 pin DIP programmers capable of programming the 87C51Fx. The following chart shows the connections from the QFP device

YAMAICHI ic357

Abstract: IC51-1284-1702 IC51-0644-1972 IC357-0484-078 IC357 ic51-1284-1702-2 IC500-1444-002P-2 YAMAICHI ic500 IC51-2084-1052-36 IC500-1004-004
Contextual Info: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage:

cxd 158

Abstract: ot 239 IC51-128 OT 306 IC51-2564-1668-6 IC51-0444-467 IC51-1764 socket Yamaichi ic234 IC51-1764-1505-10 IC217-1444-003
Contextual Info: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Speci cations Insulation Resistance: Dielectric Withstanding Voltage:

IC51-1284-1433

Abstract: IC51-807 IC51-0484-806 IC51-1444-1354-7 IC51-0644-1240 IC51-2564-1668-6 OT 306 IC51-128 IC217-2404-007 cxd 158
Contextual Info: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage:

95-132I25

Abstract: AMS-QQ-N-290
Contextual Info: P/N 95-132I25 JEDEC 132-Position QFP-to-PGA Adapter 0.025 [0.64] Pitch FEATURES • Convert surface-mount QFP packages to a 13x13 PGA footprint. • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,

FPQ-128-0

Contextual Info: PA1048C-128 Data Sheet 128 pin QFP socket/28 pin DIP 0.6" plug Supported Device/Footprints Adapter Wiring Using this adapter several 128 pin Lattice devices in QFP packages can be programmed on 28 pin DIP programmers. The following chart shows the connections from the QFP device

PLCC 84 PINS

Abstract: camtex trays MIL-I-8835A
Contextual Info: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP

132 pin PGA socket

Abstract: INTEL 132 QFP land pattern QFP 132 80960JA SF-QFJ132SA-G-02 Cobra
Contextual Info: Relative orientations top views 0.100" typ. PGA A1 1.450" Pin 1 QFP Pin 1 ( TRST ) A1 Top view Target PCB 80960JA QFP Land Pattern 1.450" The Surface mount foot (QFP Base) is symmetrical and can solder to the Target PCB in any of 4 90° rotations. The PGA top,

WA24050DQAET

Abstract: WA084 WA128
Contextual Info: WINSLOW ADAPTICs Data Sheet – QFP to PGA Generic Adapters These adapters allow the prototyping of QFP and TQFP devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the QFP device can be soldered. The underside of the adapter has male PGA pins on a 2.54mm

Contextual Info: ADVANCED INTERCONNECTIONS QFP/PLCC Adapters Patents issuedand/or pending ® QFP/PLCC Adapters Features:

68302

Abstract: motorola ST 1076 QFE132SA SF-QFJ132SA-G-02 land pattern QFP 132
Contextual Info: Relative orrientations top views 1 13 A A1 PGA 1.800" Pin 1 QFP N Top View 1.800" 2 1 0.501" 0.630" (assembled) Surface mount base: (included) see SF-QFJ132SA-G-02 drawing for greater detail 0.276" 0.025" pitch 1.076" Side View Target PCB 132 position QFP Land Pattern

68302

Abstract: QFE132SA SF-QFJ132SA-L-01
Contextual Info: Relative orrientations top views 1 13 A A1 PGA 1.800" Pin 1 QFP N Top View 1.800" 2 1 0.501" 0.600" (assembled) Surface mount base: (included) see SF-QFJ132SA-L-01 drawing for greater detail 0.250" 0.025" pitch 1.040" Side View Target PCB 132 position QFP Land Pattern

XC2064

Abstract: XC3030 XC2018 XC3020 XC3020A XC3030A XC3042 XC3064 XC3090 xc5204
Contextual Info: 10 44 48 64 68 84 100 120 132 144 156 160 164 175 176 184 191 196 208 223 225 228 240 299 304 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA CERAMIC QFP PLASTIC PQFP

P113

Abstract: P114 P115 Z87000 Z87010 Z87L00
Contextual Info: PRELIMINARY PRODUCT SPECIFICATION 1 Z87000/Z87L00 1 SPREAD SPECTRUM CONTROLLERS FEATURES Device ROM KWords RAM* I/O (Words) Lines Z87000 12 512 32 Z87L00 12 512 32 Package Information • 84-Pin PLCC 100-Pin QFP 100-Pin QFP Note: *General-Purpose ■ ■

frequency hopping spread spectrum

Abstract: spread spectrum receiver circuity TDD synchronizer cordless phone "control signals" cordless phone Transceiver IC direct sequence spread spectrum P115 Z87000 Z87001 Z87010
Contextual Info: PRELIMINARY CUSTOMER PROCUREMENT SPECIFICATION 1 Z87001/Z87L01 1 ROMLESS SPREAD SPECTRUM CORDLESS PHONE CONTROLLER FEATURES Device ROM * KWords Z87001 Z87L01 64 64 RAM I/O (Words) Lines 512 512 32 32 Package Information • 144-Pin QFP 144-Pin QFP Note: *Maximum accessible external ROM

sd3-75

Abstract: FDC37C67X FDC37C93X cross PD6 GP20 GP25 SA10 SMSC Corporation cross reference
Contextual Info: APPLICATION NOTE 6.13 FDC37C67x/FDC37C93x Dual Footprint By Nizar Azzam This document describes a dual footprint layout for the FDC37C67x and the FDC37C93x. The FDC37C67x is a 100 pin QFP/TQFP package and the FDC37C93x is a 160 pin QFP package. Refer to FDC37C67x and

PA-QFE144S-A-S-01

Abstract: 13 53 111
Contextual Info: Ironwood Electronics, Inc. PO Box 21151 • St Paul, MN 55121 • 651 452-8100 • Fax (651) 452-8400 _ PA-QFE144S-A-S-01 Map Rev B, 6/19/98 1 14 35 54 73 92 111 132 132 111 92 73 13 34 53 72 91 110 131 144 144 110 91 Top View - QFP QFP 1

GP62

Abstract: GP15 126-150 GP61 GP22 GP65 gp6*5 GP10 SA10 SA12
Contextual Info: APPLICATION NOTE 6.15 FDC37C68x/FDC37C93x Dual Footprint By Nizar Azzam This document describes a dual footprint layout for the FDC37C68x and the FDC37C93x. The FDC37C68x is a 128 pin QFP package and the FDC37C93x is a 160 pin QFP package. Refer to FDC37C68x and FDC37C93x data

Contextual Info: PA32Q1498-28D6-20 Data Sheet 32 pin QFP socket/28 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction This adapter allows programming of 32 pin QFP devices in their 28 pin DIP footprint. The adapter is made up of 3 sub-assemblies. They assemble via

65630

Abstract: uPD7105 UART TTL buffer CMOS-6A 65640 65611 CMOS-6S uPD71054 NS16550A uPD71037
Contextual Info: DATA SHEET CMOS-6 1.0 Micron CMOS Gate Array Description Features CMOS-6 is NEC’s well-established channelless gate array family. The CMOS-6 family comprises 17 masters, which are available in a wide variety of package types including thin packages T-QFP , QFP with