QFP 100 SOCKET Search Results

socket Yamaichi IC201

Abstract: IC201 IC201-1004-008
Contextual Info: QFP- PC Board Layouts IC200 to IC248 Series Top View from Socket Recommended PC Board Layouts Reference Only QFP IC201-1004-008 (100 Pins) QFP IC201-1004-050 (100 Pins) 34.67±0.05 28.67+0.05 29.59±0.05 5 - 0.65x29=18.85±0.1 29.59±0.05 QFP IC201-1004-016 (100 Pins)

100P6S-A

Abstract: 100p6s PCA4687A 100-PIN
Contextual Info: PCA4687A Converter for Connecting 100-pin 0.65mm-pitch QFP to 100-pin 0.65mm-pitch LCC Function The PCA4687A is a board for converting 100-pin 0.65mm-pitch QFP 100P6S-A to 100-pin 0.65mm-pitch LCC (100D0). Application Solder an MCU housed in the 100-pin 0.65mm-pitch QFP

QFP-100

Abstract: QFP100 MB2132-465 l/QFP100
Contextual Info: PREFACE Thank you for purchasing the QFP-100 *1 Probe Cable <NQPACK version> (MB2132-465). The QFP-100 Probe Cable is used to connect an emulator for F2MC (*2)-16LX to a user system. This manual explains the handling and operation of the QFP-100 Probe Cable <NQPACK version>

F2MC-16LX

Abstract: QFP-100
Contextual Info: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-44003-2E F2MC-16LX QFP-100 PROBE CABLE NQPACK VERSION MB2132-465 OPERATION MANUAL PREFACE Thank you for purchasing the QFP-100 *1 Probe Cable (NQPACK version) (MB2132-465). The QFP-100 Probe Cable is used to connect an emulator for F2MC *2 -16LX to a user system.

NQPACK100RB179-A

Abstract: QFP-100 F2MC-16LX MB2132-464 QFP100 NQPACK 100RB179-A
Contextual Info: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-44010-1E F2MC-16LX QFP-100 PROBE CABLE NQPACK VERSION MB2132-464 OPERATION MANUAL PREFACE Thank you for purchasing the QFP-100*1 Probe Cable (NQPACK version) (MB2132-464). The QFP-100 Probe Cable is used to connect an F2MC*2-16LX family emulator to a user system.

100P6S-A

Abstract: 100p6s 64-pin qfp 80p6n LCC 18 Pin Package 80d0
Contextual Info: SEAL100FP Sealed Conversion Board for Converting from 100-pin 0.65mm-pitch QFP 100P6S-A or LCC (100D0) to 100-pin Standard Pitch Function The SEAL100FP is a board for converting the foot pattern of an MCU with a 100-pin 0.65mm-pitch QFP (100P6S-A) or LCC

Contextual Info: Part No. 96-100M65 - QFP to PGA Adapter for EIAJ 100 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Part No. 96-100M65 - QFP to PGA Adapter for EIAJ 100 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Part No. 96-100M65 - QFP to PGA Adapter for EIAJ 100 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

100-PGM13069-30

Contextual Info: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

ASTM-B16-85

Contextual Info: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

IC198-100-2000

Abstract: IC198-100-2001
Contextual Info: IC198 Series SMT Quad Flat Package (QFP) - 100 pins 100 Pins QFP - (25 x 25 pins) 0.5 mm pitch Socket Dimensions Specifications Current Rating: Rated Voltage: Contact Resistance: 0.3 A 50V DC 30mΩ max. at 10mA and 20mV max. Insulation Resistance: 500MΩ min. at 500V DC

ASTM-B16-85

Contextual Info: Part No. 96-100M65 - QFP to PGA Adapter for EIAJ 100 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Part No. 96-100M65 - QFP to PGA Adapter for EIAJ 100 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

ASTM-B16-85

Abstract: MIL-T-10727 QQN-290
Contextual Info: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

ASTM-B16-85

Abstract: MIL-T-10727
Contextual Info: Part No. 96-100M65 - QFP to PGA Adapter for EIAJ 100 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

IC198-1000-1000

Abstract: IC198-1000-1001
Contextual Info: IC198A Series SMT Quad Flat Package (QFP) - Low Inductance 100 Pins QFP - (20 x 30 pins) 0.65 mm pitch Socket Dimensions Specifications Current Rating: Rated Voltage: Contact Resistance: 0.3 A 50V DC 30mΩ max. at 10mA and 20mV max. Insulation Resistance:

B4402

Abstract: xeltek sa636 SA675 SA248 SA663 xeltek sa663 SA684 sa245a sa683 sa673
Contextual Info: Xeltek Inc. : Socket Adapter: QFP 1 #QFP44 Page 1 of 4 E Advanced search Socket Adapter: QFP(1) Back to Socket Adapter page SuperPro 3000U SuperPro 3000U-100 SuperPro 3000U Cluster SuperPro 580U SuperPro 280U SA:QFPN8 Part # BottomPCB W*L(mm) Pitch Pin #

telephone KEYPAD

Abstract: telephone hybrid cordless phone circuit telephone handset pin RJ11 rj11 telephone Z87000 Z8700000TSC ENCODER "Development Kit" Z8700001ZCO
Contextual Info: Z8700001ZCO CP95WRL0703 CUSTOMER PROCUREMENT SPECIFICATION Z8700001ZCO Z87000 DEVELOPMENT KIT FEATURES • Supported Devices Packages 100-Pin QFP 84-Pin PLCC 44-Pin QFP 44-Pin PLCC ■ Evaluation Programming/Emulation Z8700016FSC N/A Z8700016VSC N/A Z8701016FSC

telephone hybrid

Abstract: telephone KEYPAD Z87000 Z8700000TSC Z8700000ZEM Z8700001ZCO Z8700016FSC Z8700016VSC Z87010 Z8701016FSC
Contextual Info: Z8700001ZCO CP95WRL0703 CUSTOMER PROCUREMENT SPECIFICATION Z8700001ZCO Z87000 DEVELOPMENT KIT FEATURES • Supported Devices Packages 100-Pin QFP 84-Pin PLCC 44-Pin QFP 44-Pin PLCC ■ Evaluation Programming/Emulation Z8700016FSC N/A Z8700016VSC N/A Z8701016FSC

100p6s

Abstract: 100P6S-A
Contextual Info: M3T-DUMMY100S Dummy IC for 100-pin 0.65mm-pitch QFP 100P6S-A, 100P6S-E Dimensions Function This accessory tool connects the probe of an emulation pod and the target, or an MCU and the target. Its dimensions are the same as those of the MCU for the 100-pin 0.65mm-pitch QFP (100P6S, 100P6S-E)