QFP 1.27 Search Results

YAMAICHI ic357

Abstract: IC51-1284-1702 IC51-0644-1972 IC357-0484-078 IC357 ic51-1284-1702-2 IC500-1444-002P-2 YAMAICHI ic500 IC51-2084-1052-36 IC500-1004-004
Contextual Info: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage:

cxd 158

Abstract: ot 239 IC51-128 OT 306 IC51-2564-1668-6 IC51-0444-467 IC51-1764 socket Yamaichi ic234 IC51-1764-1505-10 IC217-1444-003
Contextual Info: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Speci cations Insulation Resistance: Dielectric Withstanding Voltage:

IC51-1284-1433

Abstract: IC51-807 IC51-0484-806 IC51-1444-1354-7 IC51-0644-1240 IC51-2564-1668-6 OT 306 IC51-128 IC217-2404-007 cxd 158
Contextual Info: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage:

823B

Abstract: DL201 motorola handbook 84 pin plcc ic base Reliability and quality handbook
Contextual Info: MOTOROLA SEMICONDUCTOR GENERAL INFORMATION Packaging & Case Information 84-Pin PLCC CASE 780A-01 ISSUE A FN SUFFIX 181-Pin PGA CASE 795A–02 ISSUE A HI SUFFIX 128-Pin QFP CASE 862A-02 ISSUE B DD SUFFIX 208-Pin QFP CASE 872A-01 ISSUE TBD DK SUFFIX 160-Pin QFP

Tray

Abstract: TRAY DIMENSIONS QFP-48A qfp tray standard QFp Package tray carbon black
Contextual Info: MITSUMI Packing Packing Tray Packing 1. Tray dimensions for QFP Models used QFP-32A QFP-48A Maximum number stored 50/tray 50/tray Units : mm No holes in 16 places 116.0 18.0 20.0 4 =80.0 9.8 9. 8 18.0 20.0 9 =180.0 4.1 216.0 1.3 5.4 Material: PS with carbon black (hard

Contextual Info: ADVANCED INTERCONNECTIONS QFP/PLCC Adapters Patents issuedand/or pending ® QFP/PLCC Adapters Features:

SF-QFE44SH-L-01

Contextual Info: Emulates QFP package: 10.0mm body 12.6mm Tip to Tip 11.86mm [0.467"] sqr. 0.80mm typ. [0.031"] QFP Pin 1 Pad Detail 0.89mm [0.035"] 10.08mm [0.397"] 0.51mm [0.020"] Ø 0.45mm dia. [Ø 0.0177"] Top View 0.46mm [0.018"] 1.27mm typ. [0.050"] A compatible target board

Contextual Info: ADVANCED INTERCONNECTIONS QFP Adapters 0.65mm, 0.80mm & 1.0mm Pitch ® 0.65mm, 0.80mm & 1.0mm Pitch QFP Devices

Contextual Info: ADVANCED INTERCONNECTIONS QFP Adapters .5mm & .65mm Pitch ® 0.5 mm & 0.65 mm Pitch QFP Devices DSq.

QFP-176

Abstract: QFP176 68F333 0.3mm qfp SF-QFE160SA-L-02
Contextual Info: A P G A 1 1 1 6 - 7 6 / M G A1 PGA 38.10mm [1.500"] Relative orientations top views Pin 1 QFP 6 Top View 8 F 3 3 3 Note: QFP base is numbered counter-clockwise from pin 1 as shown. QFP base is not symmetrical and must be aligned correctly to target board. PGA adaptor (top part)

icx060ak

Abstract: sdfw0xxx CCD SENSORS OPB 715 44n30
Contextual Info: PRELIMINARY KS7213 CCD TIMING GENERATOR GENERAL DESCRIPTION 80-QFP-1212 The KS7213 is a timing generator IC which generates the timing pulses necessary for color CCD image sensors. ORERING INFORMATION Device KS7213 FEATURES Package 80-QFP-1212 Operating Temperature

QFP-100

Contextual Info: Multiadapters RE460-05 - Epoxy FR4 1.50 mm, two-sided 35 µm CU through plated - Chem. AU and solder resist mask - Hole diameter 1.00 mm - Grid spacing from 0.50 mm to 1.27 mm - Adaption circuit board for PLCC 32, 52, 68.84 (1.27 mm) and QFP 100 (0.635 mm) and QFP 100 (0.50 mm)

FBGA-484

Abstract: BGA313 reflow soldering profile BGA
Contextual Info: Actel provides simple step-by-step assembly flow instructions for attaching QFP and BGA sockets to a PCB. Also included is solder reflow information along with a sample standard reflow temperature profile. Recommended method of attaching QFP prototype sockets to a PCB.

B4402

Abstract: xeltek sa636 SA675 SA248 SA663 xeltek sa663 SA684 sa245a sa683 sa673
Contextual Info: Xeltek Inc. : Socket Adapter: QFP 1 #QFP44 Page 1 of 4 E Advanced search Socket Adapter: QFP(1) Back to Socket Adapter page SuperPro 3000U SuperPro 3000U-100 SuperPro 3000U Cluster SuperPro 580U SuperPro 280U SA:QFPN8 Part # BottomPCB W*L(mm) Pitch Pin #

an 819

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 68 PIN CERAMIC To Top / Package Lineup / Package Index FPT-68C-A01 68-pin ceramic QFP Lead pitch 1.00 mm Lead shape Gullwing Sealing method Metal seal FPT-68C-A01 68-pin ceramic QFP (FPT-68C-A01)

footprint plcc 208

Abstract: PLASTIC QUAD FLAT PACK 160 PINS DIMENSION LXT304A LXT305A LXT307 LXT310 LXT317 LXT318 LXT325 A 3120 8 Pins ICs
Contextual Info: Fall 1998 Communication ICs Data Book Table 1: Telecom Product/Packages Product Table 1: Telecom Product/Packages Product Package Package SXT6051 208 QFP SXT6251 208 QFP SXT6282 144-Pin LQFP LXT300Z/301Z 28-Pin DIP and 28-Pin PLCC LXT304A 28-Pin DIP and 28-Pin PLCC

Contextual Info: 1C 201 SERIES QFP IC SOCKETS FEATURES • Open top type sockets for QFP packages. • Lever operation ensures low actuation force and high durability. • Unique contact design ensures outstanding contact reliability. For SPECIFICATIONS lest PERFORMANCE Contact our Sales Department for detail. Specifications differ by the contact

Z89323

Abstract: Z8932312ZEM Z89373
Contextual Info: PRODUCT SPECIFICATION Z8932312ZEM 1 DSP FAMILY EMULATOR—Z89323 FEATURES Supported Devices Packages Emulation OTP Programming 44-pin PLCC Z89223/2731 N/A Z89323/373 N/A Z892731 N/A Z89373 Z89373 44-pin QFP 68-pin PLCC 80-pin QFP Notes: 1. Requires an optional, separately-purchased accessory

Contextual Info: ADVANCED INTERCONNECTIONS QFP/PLCC Adapters Patents issued and/or pending. 5 Energy Way, P.O. Box 1019, West Warwick, Rl 02893 QFP/PLCC Adapters Tel. 401-823-5200 • FAX 401-823-8723 Body Material: FR-4: Fiberglass Epoxy Board U.L. Rated 94V-0, Index 140"C 284’ F

Contextual Info: <5*2iLCE PRELIMINARY PRODUCT SPECIFICATION Z86C72/76 ZlLOG INFRARED REMOTE CONTROLLER FAMILY ZIRC FEATURES • ROM/Package Options: - Z86C76 12K ROM, 768 RAM 40-Pin DIP or 44-Pin PLCC/QFP - Z86C72 16K ROM, 768 RAM, 40-Pin DIP or 44-Pin PLCC/QFP ■ Five Priority Interrupts

Contextual Info: QUAD FLAT L-LEADED PACKAGE 32 PIN CERAMIC FPT-32C-C02 Lead pitch 50mil Package width x package length 450 × 550mil Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.80mm 32-pin ceramic QFP FPT-32C-C02 32-pin ceramic QFP (FPT-32C-C02)

a06 transistor

Contextual Info: QUAD FLAT L-LEADED PACKAGE 28 PIN CERAMIC FPT-28C-A06 Lead pitch 50mil Package width x package length 11.40 × 11.40mm Lead shape Gullwing Sealing method Metal seal Length of flat portion of pins 0.80mm TYP 28-pin ceramic QFP FPT-28C-A06 28-pin ceramic QFP

Contextual Info: SMALL OUTLINE PACKAGE 28 PIN CERAMIC FPT-28C-A07 28-pin ceramic QFP Lead pitch 50mil Package width x package length 11.40 × 11.40mm Lead shape Gullwing Sealing method Metal seal Length of flat portion of pins 0.48mm FPT-28C-A07 28-pin ceramic QFP (FPT-28C-A07)

package QFP 68

Contextual Info: QUAD FLAT L-LEADED PACKAGE 68 PIN CERAMIC FPT-68C-A01 Lead pitch 1.00mm Lead shape Gullwing Sealing method Metal seal 68-pin ceramic QFP FPT-68C-A01 68-pin ceramic QFP (FPT-68C-A01) 1.78±0.30 (.071±.012) 0.51(.020)MIN 19.61±0.25 (.772±.010) CARRY-PLATES(3PLCS)