QFN-24 6X6 PACKAGE Search Results

Contextual Info: VG111 The Communications Edge TM • MTTF > 100 years GND GND GND GND VA CTRL 2 1 28 GND 27 GND Amp GND 10 26 GND RF IN 11 25 RF OUT GND 12 24 GND Variable Attenuator 23 GND GND 14 22 GND 15 16 17 18 19 20 21 N/C • 6x6 mm 28-pin QFN package 3 GND 9 GND 13

variable inductor 17 18

Contextual Info: VG101 The Communications Edge TM Cellular-band Variable Gain Amplifier • MTTF > 100 years GND GND GND VA CTRL GND GND 2 1 28 GND 27 GND Amp GND 10 26 GND RF IN 11 25 RF OUT GND 12 24 GND Variable Attenuator 23 GND GND 14 22 GND 15 16 17 18 19 20 21 GND • 6x6 mm 28-pin QFN package

CHL8228G

Abstract: CHL8228G-00CRT CHL8228 CHL8225G-00CRT qfn 8x8 reel CHL822 qfn 52 6x6 A/sh 40/085/21/QFN-6x6
Contextual Info: CHL8225G/8G Digital Multi-Phase Buck Controller DESCRIPTION • Pb-Free, RoHS, 6x6 40-pin & 8x8 56-pin QFN packages APPLICATIONS  Multiphase GPU systems The CHL8225G/8G provides extensive OVP, UVP, OCP and OTP fault protection and includes thermistor based

Contextual Info: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface

CHL8228G-00CRT

Contextual Info: CHL8225G/8G Digital Multi-Phase Buck Controller DESCRIPTION • Pb-Free, RoHS, 6x6 40-pin & 8x8 56-pin QFN, MSL2 package APPLICATIONS  Multiphase GPU systems The CHL8225G/8G provides extensive OVP, UVP, OCP and OTP fault protection and includes thermistor based

tray qfn 6x6

Abstract: tqfp 7x7 tray QFN tray 5x5 QFN tray QFn Package tray QFN tray qfn 4x4 QFN tray 4x4 LQFP Package tray 6x6 TRAY tray QFN 5x5
Contextual Info: Supertex Packaging Specifications Suffix Package Type B1 B2 FB FG FG FG FG GA GA K1 K1 K2 K4 K4 K5 K6 K6 K6 K6 K6 K6 K6 K6 K6 K6 K7 K7 K7 K7 K7 K7 LG L / LL MG MG N2 N3 N3 N5 N8 NG NG P P P P PG PG PG PG PJ PJ PJ SG T TG WG WG WG WG 26L BCC 84L BCC+ 64B FCBGA

Contextual Info: ACCUTEK Chip Scale Packages LLP, DFN, QFN, MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface

QFN leadframe

Contextual Info: ACCUTEK Chip Scale Packages LLP, DFN, QFN, MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface

AK08D300-CLCC

Abstract: AK08D300-LFCSP2X3 .5mm AK08D300-LFCSP3x3 .5mm AK08D300-MLP.65mm AK10D300-8SON .65mm MLP 3X3 MLP 4X4 AK22D300-DFN AK24D300-LLP MLP 5X5
Contextual Info: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface

NP364

Abstract: QFN11T032-003 QFN11T048-008 QFN11T040-006 QFN 56 7x7 0.5 NP445-048-001 NP445-064-002 NP364-01649 QFN11T032-004 NP445-032-003
Contextual Info: QFN Quad Flat Non-leaded Packages TH Sockets - Open Top and Clamshell Types SMT Devices Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temp.Range: Contact Force: 10,000MΩ min. at 100V DC 500V AC for 1 minute 30mΩ max. at 10mA/20mV max.

Contextual Info: Digital Multi-Phase Buck Controller DESCRIPTION • Pb-Free, RoHS, QFN packages APPLICATIONS  Intel VR12 & AMD® SVI based systems  High Performance Desktops CPU VRs  Value Servers CPU & DDR Memory VRs ISEN_L2  3.3V +10%/-15% supply voltage; 0ºC to 85ºC

PIC18F45K22

Abstract: PIC18F46K22 pic18f25k22 PIC18F26k22 PIC18F23K22 PIC18F67K22 40 pin PIC18F46K22 Pic18f24k22 DS41398 PIC18LF46K22
Contextual Info: PIC18F “K22” Family of Microcontrollers Broadest Line of Low Power, 5V 8-bit MCUs Summary The nanoWatt XLP PIC18F “K22” Flash Family of microcontrollers offer all of the advantages of the well recognized PIC18F High Performance MCUs; C compiler optimized architecture and an industry leading peripheral

Contextual Info: Digital Multi-Phase Buck Controller DESCRIPTION • Pb-Free, RoHS, QFN packages APPLICATIONS  Intel VR12 & AMD® SVI based systems  High Performance Desktops CPU VRs  Value Servers CPU & DDR Memory VRs ISEN_L2  3.3V +10%/-15% supply voltage; 0ºC to 85ºC

Contextual Info: Digital Multi-Phase Buck Controller DESCRIPTION • Pb-Free, RoHS, QFN packages APPLICATIONS  Intel VR12 & AMD® SVI based systems  High Performance Desktops CPU VRs  Value Servers CPU & DDR Memory VRs 40 39 38 37 36 ISEN_L2  3.3V +10%/-15% supply voltage; 0ºC to 85ºC

Contextual Info: CHL8225G/8G Digital Multi-Phase Buck Controller FEATURES DESCRIPTION APPLICATIONS • Multiphase GPU systems RCSP IRTN1 ISEN1 IRTN2 ISEN2 IRTN3 ISEN3 IRTN4 ISEN4 IRTN5 ISEN5 PIN DIAGRAM 40 39 38 37 36 35 34 33 32 31 1 30 ISEN6  Pb-Free, RoHS, 6x6 40-pin & 8x8 56-pin QFN

Contextual Info: 36 Pin to 40 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:

VG111-PCB1900

Abstract: MOTOROLA TRANSISTOR JESD22-A114 MMBT2222 VG111 VG111-PCB2100 QFN-6x6 package capacitor 22 pf DNP
Contextual Info: VG111 The Communications Edge TM PCS/UMTS-band Variable Gain Amplifier Applications GND 5 GND 6 GND Vctrl 7 GND GND The VG111 is a PCS / UMTS-band high dynamic range variable gain amplifier VGA packaged in a 6x6 mm surface-mount package. The +22 dBm output

QFN "100 pin" PACKAGE

Abstract: JEDEC qfn tape QFN 3x4 SOT23 JEDEC standard orientation MP transistor SOIC16 SOIC24 SOIC28 TSSOP16 TSSOP28
Contextual Info: Tape & Reel Packaging for Automated Handling The Future of Analog IC Technology General Overview Surface mount products are available in Tape & Reel packaging. Below is a table of standard Tape & Reel configurations. These packages conform to EIA-481-1/2/3 and JEDEC standards. All products are lead

TG2H214220-FL

Abstract: TGA2572 TGA2573 lte transceiver TGA2540-FL TQM963014 TGA2517 TQM6M9069 TQP6M9002 TQM7M5013
Contextual Info: Product Selection Guide Choose TriQuint’s Innovative RF Solutions Connecting the Digital World to the Global Network Welcome to Our Product Selection Guide Table of Contents About TriQuint Semiconductor.3 Guide by Market Automotive. 4

P1050-QJ

Contextual Info: 7.1 - 8.5 GHz Linear Power Amplifier 6x6mm QFN P1050-QJ June 2008 - Rev 06-Jun-08 Features 16 dB Small Signal Gain 49 dBm Third Order Intercept Point OIP3 Integrated Power Detector 6x6mm QFN Package, RoHS Compliant 100% RF Testing General Description The XP1050-QJ is a packaged linear power amplifier

Contextual Info: 7.1 - 8.5 GHz Linear Power Amplifier 6x6mm QFN P1050-QJ August 2008 - Rev 18-Aug-08 Features 16 dB Small Signal Gain 49 dBm Third Order Intercept Point OIP3 Integrated Power Detector 6x6mm QFN Package, RoHS Compliant 100% RF Testing General Description The XP1050-QJ is a packaged linear power amplifier

1000-pin bga 0,8 mm

Abstract: HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"
Contextual Info: Renesas Semiconductor Packages General Catalog 2004.10 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble

Contextual Info: 7.1 - 8.5 GHz Linear Power Amplifier 6x6mm QFN P1050-QJ October 2008 - Rev 01-Oct-08 Features 14.5 dB Small Signal Gain 49 dBm Third Order Intercept Point OIP3 Integrated Power Detector 6x6mm QFN Package, RoHS Compliant 100% RF Testing General Description

CHV2710-QJ

Abstract: CHV2710-QJ-0G00 CHV2710-QJ-0G0T PB-CHV2710-0000 RO4003
Contextual Info: 2.5 GHz InGaP HBT 5W Linear Power Amplifier CHV2710-QJ August 2007 - Rev 30-Aug-07 Features Internal Pre-matching Single Supply operation, 12V Power Gain 9 dB ESD Protection on board Current Control for multiple applications 2.5% EVM @ 29 dBm avg power, 802.16 OFDM