QFN 7X7
Abstract: qfn 8x8 56 qfn 7x7 QFN 7X7 package QFN-4x4 QFN 56 7x7
Contextual Info: Package Diagram QFN 20-Lead QFN 4x4 mm LF20 51-85163-* 48-Lead QFN (7x7 mm) LF48 51-85152-* 1 Package Diagram 56-Lead QFN (8x8 mm) 51-85144-*A 2
|
Original
|
20-lead48-lead56-leadqfn 7x7+5qfn 8x856 qfn 7x7qfn 7x7 packageqfn-4x4qfn 56 7x7
|
PDF
|
TPS61070
Abstract: TPS63 TPS61000 TPS61020 TPS61029 TPS61050 TPS61081 TPS61085 TPS61090 TPS61100
Contextual Info: Boost Converter – TPS61… 4.5A Vout 1.8 to 5.5V 4x4 QFN TPS61087 3.0 to 18.5 3x3 QFN 5.0 to 38.0 HTSSOP 1.8 to 5.5V 4x4 QFN 3.0 to 18.5 3x3 QFN 1.8 to 5.5V 3x3 QFN 1.8 to 5.5V 3x3 QFN 1.8 to 5.5V 3x3 QFN Vin to 5.5V 2.1x1.9 DSBGA 1.5 to 5.5V 4x4 QFN 2.5 to 5.5V
|
Original
|
tps61tps61030tps61087tps61028+12tps61070tsot-23tps61175tps61090tps61085tps61029tps63tps61000tps61020tps61050tps61081tps61100
|
PDF
|
QFN 5x5
Abstract: qfn stencil "exposed pad" PCB via "thermal via" solder mask P4171 X-RAY INSPECTION via diameter pitch 40-QFN QFN "exposed die"
Contextual Info: Thermal Via Note: PCA 40 QFN 5X5 NDG 40 package QFN EXPOSED DIE PAD DIMENSIONS = 3.7 mm +- 0.10 mm QFN I/0 PAD LENGTH =0.4+-0.10 mm max QFN I/0 PAD WIDTH =0.15 mm min 0.20 mm typ 0.25 mm max PCA 40 QFN 5x5 NDG 40 package the land pattern dimensions should
|
Original
|
com/data/tb/tb389dwg/plastic/p4171qfn 5x5qfn stencil+8exposed pad" pcb viathermal viasolder maskp4171x-ray inspectionvia diameter pitch40-qfnqfn "exposed die
|
PDF
|
QFN 5X5
Abstract: "thermal via" qfn land pattern
Contextual Info: Thermal Via Note: PCA 40 QFN 5X5 NDG 40 package QFN EXPOSED DIE PAD DIMENSIONS = 3.5 mm +- 0.10 mm QFN I/0 PAD LENGTH =0.4+-0.10 mm max QFN I/0 PAD WIDTH =0.17 mm min 0.20 mm typ 0.25 mm max PCA 40 QFN 5x5 NDG 40 package the land pattern dimensions should
|
Original
|
com/data/tb/tb389dwg/plastic/p4171qfn 5x5thermal via+1qfn land pattern
|
PDF
|
Device Orientation
Abstract: device QFN12 QFN-12 QFN16 QFN-16 qfn 12
Contextual Info: Device Orientation Vishay Siliconix Device Orientation for QFN-12/QFN-16 DEVICE ORIENTATION PACKAGE METHOD QFN-12 T1 QFN-16 T1 User Direction of Feed Revision control of this drawing is maintained through Document Control, Pack Specification-PACK-0007-15 Document Number: 72725
|
Original
|
qfn-12/qfn-16qfn-12qfn-16specification-pack-0007-15+608-nov-10device orientationdeviceqfn12qfn16qfn 12
|
PDF
|
AD1882AJCIZ
Abstract: virage AD1882AJCPZ AD1882A
Contextual Info: AD1882A High Definition Audio Codec Data Sheet DSH-202011D September 2012 Ordering Information Device Set Order ID Package Type Operating Temperature Package AD1882AJCPZ* QFN 48-Lead QFN, 7x7 mm 0 °C to +70 °C AD1882AJCIZ* QFN 48-Lead QFN, 7x7 mm -40 °C to +85 °C
|
Original
|
ad1882adsh-202011dad1882ajcpzad1882ajciz+348-leadmo-220-vkkd-2virage
|
PDF
|
AD1882AJCIZ
Abstract: AD1882AJCPZ 882A 401F conexant hd audio Widgets
Contextual Info: AD1882A High Definition Audio Codec Data Sheet DSH-202011C November 2009 Ordering Information Device Set Order ID Package Type Operating Temperature Package AD1882AJCPZ* QFN 48-Lead QFN, 7x7 mm 0 °C to 70 °C AD1882AJCIZ* QFN 48-Lead QFN, 7x7 mm -20 °C to 85 °C
|
Original
|
ad1882adsh-202011cad1882ajcpz48-lead+6ad1882ajcizmo-220-vkkd-2882a401fconexant hd audiowidgets
|
PDF
|
size 0204
Abstract: QFN PCB Layout guide TL-TORQUEDRIVER-05 TL-TORQUEDRIVER-06
Contextual Info: GHz QFN Socket User Manual Tel: 800 404-0204 Fax: (952) 229-8201 www.ironwoodelectronics.com GHz QFN Socket User Manual Selecting QFN socket: You need to have the IC package drawing ready to select the correct QFN socket. Go to www.ironwoodelectronics.com. Select “Products” link, then under “Browse” menu, select
|
Original
|
size 0204qfn pcb layout guidetl-torquedriver-05tl-torquedriver-06 |
PDF
|
TPS630
Abstract: TPS63000 TPS61130 TPS61170 TPS61175 TPS63 TPS63010 TPS63030
Contextual Info: Buck-Boost Converter – TPS63… 3.0A TPS61175 2.0A TPS63010 1.8A TPS63000 Buck-Boost Boost in SEPIC Conf. new or preview Vout smallest package Vin to 38V 3x3 QFN 1.2V to 5.5V 2.1x1.9 CSP 1.2 to 5.5V 3x3 QFN Vin to 38V 2x2 QFN 2.5 to 5.5V 4x4 QFN Switch Current
|
Original
|
tps63tps63000tps63010tps61175+5tps61170tps61130tps63030slvt160tps630
|
PDF
|
|
Contextual Info: PACKAGE OUTLINE 12,16,20,24L QFN THIN, 4x4x0.8 mm 21-0139 A PACKAGE OUTLINE 12,16,20,24L QFN THIN, 4x4x0.8 mm 21-0139 A
|
Original
|
|
PDF
|
|
Contextual Info: MPQ8636 High Efficiency, 10/20A, 18V Synchronous, Step-Down Converter FEATURES Part Number Package Input Voltage MPQ8636GLE10 QFN 3x4mm 4.5V to 18V Latch-off MPQ8636HGLE10 QFN(3x4mm) 4.5V to 18V NonLatch MPQ8636GVE20 QFN(5x4mm) 4.5V to 18V NonLatch OVP DESCRIPTION
|
Original
|
mpq863610/20ampq8636gle10mpq8636hgle10+3mpq8636gve200a/20amo-220
|
PDF
|
16L-QFN
Abstract: 21-0102
Contextual Info: PACKAGE OUTLINE, 12,16L QFN, 3x3x0.90 MM 21-0102 G 1 2 PACKAGE OUTLINE, 12,16L QFN, 3x3x0.90 MM 21-0102 G 1 2
|
Original
|
16l-qfn21-0102 |
PDF
|
QFN leadframe
Abstract: omnix 5000 nsmd smd qfn stencil
Contextual Info: AND8086/D Board Mounting Notes for Quad Flat-Pack No-Lead Package QFN http://onsemi.com APPLICATION NOTE INTRODUCTION Various ON Semiconductor components are packaged in an advanced Quad Flat–pack No–Lead Package (QFN). Because the QFN platform represents the latest in surface
|
Original
|
and8086/dr14525qfn leadframeomnix 5000+2nsmd smdqfn stencil
|
PDF
|
MPLAB PM3
Abstract: AC164322
Contextual Info: Part Number: AC164322 - MPLAB PM3 Socket Module for 28/44L QFN This MPLAB PM3 Socket Module allows programming of 28/44L QFN packages.
|
Original
|
ac16432228/44lmplab pm3 |
PDF
|
|
|
IPC-7095B
Abstract: IPC-7095 7095B IPC 7095B EN5312QI en5312 qfn stencil
Contextual Info: Enpirion, Inc. EN5312QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5312QI power converter packages are designed with a plastic leadframe package technology that utilizes copper leadframes and mold caps with System in Package SiP construction to form a Quad Flat No-lead (QFN) package. QFN package
|
Original
|
en5312qiipc-7095bipc-70957095b+3ipc 7095ben5312qfn stencil
|
PDF
|
JESD22-A113
Abstract: QFN-20 reflow ipc-SM-782 JESD47 JESD-47 QFN-20 JEDEC SMT reflow profile jstd for msl 3 qfn density metcal apr 5000
Contextual Info: Silicon Laboratories SMT Soldering Guidelines for MCU Products SCOPE: For all of the Silicon Laboratories Microcontroller Products in QFN, TQFP/LQFP, and PDIP packages. I. SMT Soldering Considerations for QFN Packages • See the CARSEM QFN application note, which can be found at http://www.carsem.com/.
|
Original
|
ipc-sm-782apr-5000qfn-24-qfn11+9jesd22-a113qfn-20 reflowjesd47jesd-47qfn-20jedec smt reflow profilejstd for msl 3qfn densitymetcal apr 5000
|
PDF
|
TB389
Contextual Info: Technical Brief 389 Authors: Mark Kwoka and Jim Benson PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently experiencing
|
Original
|
tb389 |
PDF
|
|
Contextual Info: QFN Flat Lids Al2O3 Barry Industries LID-XX-XXX* *See Chart for Specific Part Number The QFN Lid Series was designed for Barry’s C-QFN Al2O3 Air Cavity Family. There are several methods of attachment. Below are some of the more common methods. QFN Lid Attachment Options:
|
Original
|
lid-xx-000iso9001 |
PDF
|
J-STD-005
Abstract: nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 TB389 XQFN
Contextual Info: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief April 23, 2009 TB389.6 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently
|
Original
|
tb389j-std-005nozzle heatersoldering guidelines and smd footprint design+4technical brief tb389ipc-sm-782mo-220xqfn
|
PDF
|
EN5311Qi
Abstract: EN5311 IPC-7095 IPC-7095B QFN PACKAGE thermal resistance "exposed pad" PCB via qfn 32 land pattern qfn stencil
Contextual Info: Enpirion, Inc. EN5311QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5311QI power converter packages are designed with a plastic leadframe package technology that utilizes copper leadframes and mold caps with System in Package SiP construction to form a Quad Flat No-lead (QFN) package. QFN package
|
Original
|
en5311qien5311ipc-7095ipc-7095b+4qfn package thermal resistanceexposed pad" pcb viaqfn 32 land patternqfn stencil
|
PDF
|
22V10A
Abstract: LVCMOS33 LVCMOS18 QFN PACKAGE thermal resistance LVCMOS25 QFN footprint amkor mlf qfn
Contextual Info: Using the ispGAL22V10A in the QFN Package April 2003 Application Note AN8074 Introduction Lattice’s ispGAL 22V10A device in the QFN package provides several added capabilities to the standard 22V10 architecture. The QFN Quad Flat pack, No lead package, also known as the MLF (Micro Lead Frame) package, is
|
Original
|
ispgal22v10aan807422v10a22v10+9sizcmos25lvcmos181800adapter1-800-latticelvcmos33qfn package thermal resistancelvcmos25qfn footprintamkor mlf qfn
|
PDF
|
NX2837
Abstract: 24v to 5V 2A SW regulator NX2114 NX9415 nx211 nx2155 NX7101 QFN-32L 5X5 QFN32L NX2838
Contextual Info: Switching Regulators Part Number Package NX4108 SOT23-5L NX4110 SOT23-5L LX13088 3x3 DFN-10L LX1918 3x3 MLP-8L LX13045A 3x3 -MLP-6L LX3005 SOIC-8 NX7101 SOIC-8 NX7102 SOIC-8, EXP NX9415 4x4 QFN-24L NX9511B 5x5 QFN-32L NX9548 5X5 QFN-32L Description Iout Vin Range
|
Original
|
nx4108ot23-5lnx4110lx13088+14dfn-10llx1918lx13045alx3005nx7101nx283724v to 5v 2a sw regulatornx2114nx9415nx211nx2155qfn-32l 5x5qfn32lnx2838
|
PDF
|
22V10
Abstract: 22V10A LVCMOS25 LVCMOS33 ABEL plastron
Contextual Info: Using the ispGAL22V10A in the QFN Package November 2007 Application Note AN8074 Introduction Lattice’s ispGAL 22V10A device in the QFN package provides several added capabilities to the standard 22V10 architecture. The QFN Quad Flat pack, No lead package, also known as the MLF (Micro Lead Frame) package, is
|
Original
|
ispgal22v10aan807422v10a22v10+61800adapter1-800-latticelvcmos25lvcmos33abelplastron
|
PDF
|
XR1011-QH
Contextual Info: 4.5-10.5 GHz GaAs Receiver QFN, 4x4mm R1011-QH March 2008 - Rev 31-Mar-08 Features Integrated LNA, Mixer and LO Buffer Amplifier 1.8 dB Noise Figure 13.0 dB Conversion Gain 4x4mm QFN Package 100% RF, DC and NF Testing General Description Mimix Broadband’s 4.5-10.5 GHz QFN packaged receiver has
|
Original
|
31-mar-08r1011-qhxr1011-qh |
PDF
|
