QFN 80 PIN Search Results

qfn Package

Contextual Info: GHZ MLF/QFN Socket direct mount - hardware Page 1 of 2 Assembly Instructions Tooling holes have to be designed into the target PCB for this version of the GHz MLF/QFN socket 1. Install the socket base assembly on the target PCB with the hardware (0-80 screws and nuts) provided (see Detail A for

marking d9

Abstract: marking D9 diode ADS5282 TI QFN marking transistor marking D9 ADS5281 ADS5287 QFN-64 dALLAS MARKING CODE pnaz5
Contextual Info: ADS5281, ADS5282, and ADS5287 Errata SBAZ006B – MARCH 2006 – Revised OCTOBER 2007 Errata to ADS528x, Data Sheet Literature Number SBAS397 Revision Identification Figure 1 explains the ADS528x package marking for both the HTQFP-80 and QFN-64 packages for the

Contextual Info: TPA4411 TPA4411M www.ti.com SLOS430E – AUGUST 2004 – REVISED MARCH 2008 80-mW DIRECTPATH STEREO HEADPHONE DRIVER FEATURES 16 18 17 20 19 17 16 18 20 • Space Saving Packages – 20-Pin, 4 mm x 4 mm Thin QFN – TPA4411 – Thermally Optimized PowerPAD™ Package

Contextual Info: TPA4411 TPA4411M www.ti.com SLOS430E – AUGUST 2004 – REVISED MARCH 2008 80-mW DIRECTPATH STEREO HEADPHONE DRIVER FEATURES 16 18 17 20 19 17 16 18 20 • Space Saving Packages – 20-Pin, 4 mm x 4 mm Thin QFN – TPA4411 – Thermally Optimized PowerPAD™ Package

Contextual Info: TPA4411 TPA4411M www.ti.com SLOS430E – AUGUST 2004 – REVISED MARCH 2008 80-mW DIRECTPATH STEREO HEADPHONE DRIVER FEATURES 16 18 17 20 19 17 16 18 20 • Space Saving Packages – 20-Pin, 4 mm x 4 mm Thin QFN – TPA4411 – Thermally Optimized PowerPAD™ Package

Contextual Info: TPA4411 TPA4411M www.ti.com SLOS430E – AUGUST 2004 – REVISED MARCH 2008 80-mW DIRECTPATH STEREO HEADPHONE DRIVER FEATURES 16 18 17 20 19 17 16 18 20 • Space Saving Packages – 20-Pin, 4 mm x 4 mm Thin QFN – TPA4411 – Thermally Optimized PowerPAD™ Package

Contextual Info: TPA4411 TPA4411M www.ti.com SLOS430E – AUGUST 2004 – REVISED MARCH 2008 80-mW DIRECTPATH STEREO HEADPHONE DRIVER FEATURES 16 18 17 20 19 17 16 18 20 • Space Saving Packages – 20-Pin, 4 mm x 4 mm Thin QFN – TPA4411 – Thermally Optimized PowerPAD™ Package

TLV320AIC26

Abstract: TLV320AIC28 TPA2012D2 TPA4411 TPA4411M TPA4411RTJ TPA4411RTJR TPA4411YZH tlv320
Contextual Info: TPA4411 TPA4411M www.ti.com SLOS430E – AUGUST 2004 – REVISED MARCH 2008 80-mW DIRECTPATH STEREO HEADPHONE DRIVER FEATURES 16 18 17 20 19 17 16 18 20 • Space Saving Packages – 20-Pin, 4 mm x 4 mm Thin QFN – TPA4411 – Thermally Optimized PowerPAD™ Package

Contextual Info: TPA4411 TPA4411M www.ti.com SLOS430E – AUGUST 2004 – REVISED MARCH 2008 80-mW DIRECTPATH STEREO HEADPHONE DRIVER FEATURES 16 18 17 20 19 17 16 18 20 • Space Saving Packages – 20-Pin, 4 mm x 4 mm Thin QFN – TPA4411 – Thermally Optimized PowerPAD™ Package

Contextual Info: TPA4411 TPA4411M www.ti.com SLOS430E – AUGUST 2004 – REVISED MARCH 2008 80-mW DIRECTPATH STEREO HEADPHONE DRIVER FEATURES 16 18 17 20 19 17 16 18 20 • Space Saving Packages – 20-Pin, 4 mm x 4 mm Thin QFN – TPA4411 – Thermally Optimized PowerPAD™ Package

Contextual Info: TPA4411 TPA4411M www.ti.com SLOS430E – AUGUST 2004 – REVISED MARCH 2008 80-mW DIRECTPATH STEREO HEADPHONE DRIVER FEATURES 16 18 17 20 19 17 16 18 20 • Space Saving Packages – 20-Pin, 4 mm x 4 mm Thin QFN – TPA4411 – Thermally Optimized PowerPAD™ Package

Contextual Info: TPA4411 TPA4411M www.ti.com SLOS430E – AUGUST 2004 – REVISED MARCH 2008 80-mW DIRECTPATH STEREO HEADPHONE DRIVER FEATURES 16 18 17 20 19 17 16 18 20 • Space Saving Packages – 20-Pin, 4 mm x 4 mm Thin QFN – TPA4411 – Thermally Optimized PowerPAD™ Package

Contextual Info: TPA4411 TPA4411M www.ti.com SLOS430E – AUGUST 2004 – REVISED MARCH 2008 80-mW DIRECTPATH STEREO HEADPHONE DRIVER FEATURES 16 18 17 20 19 17 16 18 20 • Space Saving Packages – 20-Pin, 4 mm x 4 mm Thin QFN – TPA4411 – Thermally Optimized PowerPAD™ Package

Contextual Info: TPA4411 TPA4411M www.ti.com SLOS430D – AUGUST 2004 – REVISED DECEMBER 2007 80-mW DIRECTPATH STEREO HEADPHONE DRIVER FEATURES 16 18 17 20 19 17 16 18 20 • Space Saving Packages – 20-Pin, 4 mm x 4 mm Thin QFN – TPA4411 – Thermally Optimized PowerPAD™ Package

TLV320AIC26

Abstract: TLV320AIC28 TPA2012D2 TPA4411 TPA4411M TPA4411RTJ TPA4411RTJR TPA4411YZH
Contextual Info: TPA4411 TPA4411M www.ti.com SLOS430E – AUGUST 2004 – REVISED MARCH 2008 80-mW DIRECTPATH STEREO HEADPHONE DRIVER FEATURES 16 18 17 20 19 17 16 18 20 • Space Saving Packages – 20-Pin, 4 mm x 4 mm Thin QFN – TPA4411 – Thermally Optimized PowerPAD™ Package

Contextual Info: TPA4411 TPA4411M www.ti.com SLOS430E – AUGUST 2004 – REVISED MARCH 2008 80-mW DIRECTPATH STEREO HEADPHONE DRIVER FEATURES 16 18 17 20 19 17 16 18 20 • Space Saving Packages – 20-Pin, 4 mm x 4 mm Thin QFN – TPA4411 – Thermally Optimized PowerPAD™ Package

Contextual Info: TPA4411 TPA4411M www.ti.com SLOS430E – AUGUST 2004 – REVISED MARCH 2008 80-mW DIRECTPATH STEREO HEADPHONE DRIVER FEATURES 16 18 17 20 19 17 16 18 20 • Space Saving Packages – 20-Pin, 4 mm x 4 mm Thin QFN – TPA4411 – Thermally Optimized PowerPAD™ Package

Contextual Info: TPA4411 TPA4411M www.ti.com SLOS430E – AUGUST 2004 – REVISED MARCH 2008 80-mW DIRECTPATH STEREO HEADPHONE DRIVER FEATURES 16 18 17 20 19 17 16 18 20 • Space Saving Packages – 20-Pin, 4 mm x 4 mm Thin QFN – TPA4411 – Thermally Optimized PowerPAD™ Package

TPA4411

Abstract: TLV320AIC26 TLV320AIC28 TPA2012D2 TPA4411M TPA4411RTJ TPA4411RTJR TPA4411YZH tpa4411mrtjt
Contextual Info: TPA4411 TPA4411M www.ti.com SLOS430E – AUGUST 2004 – REVISED MARCH 2008 80-mW DIRECTPATH STEREO HEADPHONE DRIVER FEATURES 16 18 17 20 19 17 16 18 20 • Space Saving Packages – 20-Pin, 4 mm x 4 mm Thin QFN – TPA4411 – Thermally Optimized PowerPAD™ Package

Contextual Info: TPA4411 TPA4411M www.ti.com SLOS430D – AUGUST 2004 – REVISED DECEMBER 2007 80-mW DIRECTPATH STEREO HEADPHONE DRIVER FEATURES 16 18 17 20 19 17 16 18 20 • Space Saving Packages – 20-Pin, 4 mm x 4 mm Thin QFN – TPA4411 – Thermally Optimized PowerPAD™ Package

Contextual Info: TPA4411 TPA4411M www.ti.com SLOS430E – AUGUST 2004 – REVISED MARCH 2008 80-mW DIRECTPATH STEREO HEADPHONE DRIVER FEATURES 16 18 17 20 19 17 16 18 20 • Space Saving Packages – 20-Pin, 4 mm x 4 mm Thin QFN – TPA4411 – Thermally Optimized PowerPAD™ Package

Contextual Info: TPA4411 TPA4411M w w w .t i.c om SLOS430E – AUGUST 2004 – REVISED MARCH 2008 80-mW DIRECTPATH STEREO HEADPHONE DRIVER FEATURES 16 18 17 20 19 17 16 18 20 • Space Saving Packages – 20-Pin, 4 mm x 4 mm Thin QFN – TPA4411 – Thermally Optimized

pin compatible with maxim

Abstract: competition LM4864 MAX4364 MAX4365 MAX4366 MAX4367 MAX4368 umax8
Contextual Info: FIRST SOT23 330mW BTL AUDIO AMPLIFIERS DELIVER 0.02% THD+N Ideal for Cell Phones, PDAs, and Portable Audio Equipment CLICKLESS/ POPLESS CONTROL SHDN 1 VIN OUT+ -1 OUT- m PSRR dB SHDN QFN-8 SOT23-8 MSOP-8 (µMAX-8) 330mW into 32Ω Adj 2 80 Yes ✔ ✔ ✔

SST12CP11

Abstract: SST12LP14E SST25VF032B-80-4I-S2AF SST12CP11-QVCE SST12LP08-QX6E SST12LP19E-QX8E 12LP14 SST25VF064C-80-4I-Q2AE SST12LP08 SST25VF064C-80-4I-SCE
Contextual Info: Product Selection Guide Fall 2010 Silicon Storage Technology, Inc. THINK BEYOND FLASH. Think SuperFlash www.SST.com PARALLEL FLASH MEMORY 512 Kbit Ordering Number Description Spd. ns Voltage (V) Pin Count Package SST39VF512-70-4C-NHE 64K x8, 4 KB Sector