QFN "100 PIN" PACKAGE Search Results

MA240016-2

Abstract: PIC24HJ128GP504 QFN "100 pin" PACKAGE MA240016 PIC24HJ128G504
Contextual Info: MA240016-2 - PIC24HJ128GP504 Graphics Plug-In Module. This 100-pin Plug-in Module comes with a PIC24HJ128G504 device in a 44-pin QFN package. Use it as a plug-in module with the Explorer 16 board DM240001 for development of general purpose MCU control applications.

TQP3M9005

Abstract: JESD22-A114 N4000-13 using 7910 im3 1128 dbm qfn
Contextual Info: TQP3M9005 LNA Gain Block Applications • • • • Repeaters Mobile Infrastructure LTE / WCDMA General Purpose Wireless Product Features • • • • • • • • • • 16-pin 3x3 QFN package Functional Block Diagram Pin 1 Reference Mark 100-4000 MHz

DM240001

Contextual Info: MA330019-2 - dsPIC33FJ128GP804 Graphics Plug-In Module. This 100-pin Plug-in Module comes with a dsPIC33FJ128G804 device in a 44-pin QFN package. Use it as a plug-in module with the Explorer 16 board DM240001 for development of general purpose DSC control applications.

Contextual Info: ECP200D The Communications Edge TM 2 Watt, High Linearity InGaP HBT Amplifier • +5V Single Positive Supply • MTTF > 100 Years • 16-pin 4x4mm lead-free/green/ RoHS-compliant QFN Package Applications • Final stage amplifiers for Repeaters • Mobile Infrastructure

78q2123

Abstract: 78Q2123F 78q2123/f 78Q2133 78Q2123RF 78Q2123R ISO7816 QFN footprint 1080p video encoder IP
Contextual Info: 78Q2123/78Q2133 Product Brief 10/100 Fast Ethernet MicroPHY Description Housed in a 32 pin, 5 x 5mm QFN package, the MicroPHY is the smallest Fast Ethernet PHY available that provides a full 802.3 Media Independent Interface MII to the system Media Controller.

ECP200D

Abstract: ECP200D-G ECP200D-PCB1960 ECP200D-PCB2140 ECP200D-PCB900 JESD22-A114
Contextual Info: ECP200D The Communications Edge TM 2 Watt, High Linearity InGaP HBT Amplifier • +5V Single Positive Supply • MTTF > 100 Years • 16-pin 4x4mm Lead-free/Green/ RoHS-compliant QFN Package Applications • Final stage amplifiers for Repeaters • Mobile Infrastructure

Contextual Info: DATA SHEET SMP1325-087LF: Surface Mount PIN Diode Applications • Switches • Attenuators Features • Low-series resistance: 0.55 Ω maximum @ 100 mA • Low total capacitance: 0.6 pF maximum @ 20 V • QFN 2 x 2 mm package (MSL1, 260 °C per JEDEC J-STD-020)

SMP1325-087LF

Contextual Info: DATA SHEET SMP1325-087LF: Surface Mount PIN Diode Applications • Switches • Attenuators Features • Low-series resistance: 0.55 Ω maximum @ 100 mA • Low total capacitance: 0.6 pF maximum @ 20 V • Excellent thermal resistance: 13.6 °C/W typical • QFN 2 x 2 mm package (MSL1, 260 °C per JEDEC J-STD-020)

Contextual Info: PRELIMINARY DATA SHEET SMP1304-087LF: Surface Mount PIN Diode Applications • Los loss, high power switches • Low distortion attenuators Features • Low-series resistance: 2.0 Ω maximum @ 100 mA • Low total capacitance: 0.3 pF maximum @ 30 V • QFN 2 x 2 mm package (MSL1, 260 °C per JEDEC J-STD-020)

Contextual Info: DATA SHEET SMP1325-087LF: Surface Mount PIN Diode Applications • Switches • Attenuators Features • Low-series resistance: 0.55 Ω maximum @ 100 mA • Low total capacitance: 0.6 pF maximum @ 20 V • Excellent thermal resistance: 40 °C/W typical • QFN 2 x 2 mm package (MSL1, 260 °C per JEDEC J-STD-020)

Contextual Info: DATA SHEET SMP1325-087LF: Surface Mount PIN Diode Applications • Switches • Attenuators Features • Low-series resistance: 0.55 Ω maximum @ 100 mA • Low total capacitance: 0.6 pF maximum @ 20 V • Excellent thermal resistance: 40 °C/W typical • QFN 2 x 2 mm package (MSL1, 260 °C per JEDEC J-STD-020)

RS10

Abstract: RS100 SMP1325-087LF
Contextual Info: DATA SHEET SMP1325-087LF: Surface Mount PIN Diode Applications • Switches • Attenuators Features • Low-series resistance: 0.55 Ω maximum @ 100 mA • Low total capacitance: 0.6 pF maximum @ 20 V • Excellent thermal resistance: 40 °C/W typical • QFN 2 x 2 mm package (MSL1, 260 °C per JEDEC J-STD-020)

LC4064V

Abstract: Lattice ispmach LC4064V ispMACH 4A5 flip chip bga 0,8 mm OR3T80 LC4064 OR3C80 OR3T20 OR3T30 OR3T55
Contextual Info: Lattice Package Offering Packages shown actual size. All dimensions refer to package body size. 32-Pin QFN 5 x 5 mm 0.5 mm pitch 6 x 6 mm 0.5 mm pitch 23 x 23 mm 1.0 mm pitch 27 x 27 mm 1.27 mm pitch 100-Ball fpBGA 132-Ball csBGA 56-Ball csBGA 11 x 11 mm 1.0 mm pitch

Si5351

Abstract: Si5350 Si570 Si599 Synthesizers PLL for USB 4 pin MHz crystal CRYSTAL 20 mhZ DUAL XTAL OSCILLATOR IC Si5324 Si5356
Contextual Info: CLOCK AND OSCILLATOR PRODUCT SELECTOR GUIDE www.silabs.com Frequency Flexibility Engineered to support the widest frequency range for maximum design flexibility. Available in industry standard RoHS compliant packages. Ultra-Low Jitter Based on our patented DSPLL and MultiSynth technologies, these low jitter products improve

p-CHANNEL MOSFET

Contextual Info: 19-2711; Rev 1; 8/05 KIT ATION EVALU E L B A IL AVA Dual Low-Dropout Linear Regulators with RESET or Low-Noise Output in UCSP or QFN The MAX8530/MAX8531 offer the benefits of lowdropout voltage and ultra-low power regulation in subminiaturized UCSP and QFN packages with an integrated microprocessor reset circuit MAX8530 only .

Contextual Info: 19-2711; Rev 1; 8/05 KIT ATION EVALU E L B A IL AVA Dual Low-Dropout Linear Regulators with RESET or Low-Noise Output in UCSP or QFN The MAX8530/MAX8531 offer the benefits of lowdropout voltage and ultra-low power regulation in subminiaturized UCSP and QFN packages with an integrated microprocessor reset circuit MAX8530 only .

F QFN 3X3

Abstract: QFN "100 pin" PACKAGE thermal resistance AS1352 AS1352-7BC0-T AS1352-C0CF-T AS1352-T AS1352V-T QFN12
Contextual Info: AS1352 D a ta S he e t Programmable Quad LDO 1 General Description 2 Key Features The AS1352 is a high-performance quad CMOS lowdropout voltage regulator in a single QFN package. The efficient set of programmable power supplies is optimized to deliver the best compromise between quiescent current and regulator performance for mobile

QFN leadframe

Contextual Info: ACCUTEK Chip Scale Packages LLP, DFN, QFN, MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface

MAX853

Abstract: MAX8530 MAX8530EBT MAX8530EBTJ2 MAX8530EBTJO MAX8530ETT MAX8531 MAX8531EBT MAX8531ETT
Contextual Info: 19-2711; Rev 1; 8/05 KIT ATION EVALU E L B A IL AVA Dual Low-Dropout Linear Regulators with RESET or Low-Noise Output in UCSP or QFN The MAX8530/MAX8531 offer the benefits of lowdropout voltage and ultra-low power regulation in subminiaturized UCSP and QFN packages with an integrated microprocessor reset circuit MAX8530 only .

Contextual Info: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface

Contextual Info: ACCUTEK Chip Scale Packages LLP, DFN, QFN, MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface

cmos sensor 12-pin surface mount

Abstract: jedec 12pin bottom AS1352-7BC0-T
Contextual Info: a u s t ri a m i c r o s y s t e m s AS1352 D a ta S he e t Programmable Quad LDO 1 General Description 2 Key Features The AS1352 is a high-performance quad CMOS lowdropout voltage regulator in a single 4x4 package. The efficient set of programmable power supplies is optimized to deliver the best compromise between quiescent current and regulator performance for mobile

Contextual Info: 19-2711; Rev 1; 8/05 KIT ATION EVALU E L B A IL AVA Dual Low-Dropout Linear Regulators with RESET or Low-Noise Output in UCSP or QFN Features The MAX8530/MAX8531 offer the benefits of lowdropout voltage and ultra-low power regulation in subminiaturized UCSP and QFN packages with an integrated microprocessor reset circuit MAX8530 only .

QFN "100 pin" PACKAGE

Abstract: JEDEC qfn tape QFN 3x4 SOT23 JEDEC standard orientation MP transistor SOIC16 SOIC24 SOIC28 TSSOP16 TSSOP28
Contextual Info: Tape & Reel Packaging for Automated Handling The Future of Analog IC Technology General Overview Surface mount products are available in Tape & Reel packaging. Below is a table of standard Tape & Reel configurations. These packages conform to EIA-481-1/2/3 and JEDEC standards. All products are lead