| 14-24-NL-LOGIC-EVM |  | Texas Instruments | Generic 14 through 24 pin non-leaded package evaluation module |   |   | 
| 61082-142402LF |  | Amphenol Communications Solutions | BergStak® 0.80mm Pitch,  Receptacle, Vertical, Double Row, 140 Positions. | PDF |  | 
| 68031-424HLF |  | Amphenol Communications Solutions | BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 24 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail. | PDF |  | 
| 54122-114241450LF |  | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 24 position, 2.54mm (0.100in) pitch | PDF |  | 
| 54122-411142400LF |  | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 14 position, 2.54mm (0.100in) pitch | PDF |  |