POWER GRID CONTROL THROUGH PC Search Results

39K100

Abstract: 39K30 39K50
Contextual Info: Delta39K ISR™ CPLD Family PRELIMINARY CPLDs at FPGA Densities™ Features — Clock polarity control at each register • Carry-chain logic for fast and efficient arithmetic operations • Multiple I/O standards supported — LVCMOS 3.3/3.0/2.5/1.8V , LVTTL, 3.3V PCI, SSTL2

delta39k

Abstract: 39K100 39K30 39K50
Contextual Info: Delta39K ISR™ CPLD Family CPLDs at FPGA Densities™ Features • Carry-chain logic for fast and efficient arithmetic operations • Multiple I/O standards supported — LVCMOS 3.3/3.0/2.5/1.8V , LVTTL, 3.3V PCI, SSTL2 (I-II), SSTL3 (I-II), HSTL (I-IV), and GTL+

CY39100V484B-125BBI

Abstract: programmable slew rate control IO AT17LV010-10JI CY39030V256-125MBC IO1 5V 39K100 39K165 39K30 39K50 CY39100V208B-125NTC
Contextual Info: Delta39K ISR™ CPLD Family CPLDs at FPGA Densities™ Features • Carry-chain logic for fast and efficient arithmetic operations • Multiple I/O standards supported — LVCMOS 3.3/3.0/2.5/1.8V , LVTTL, 3.3V PCI, SSTL2 (I-II), SSTL3 (I-II), HSTL (I-IV), and GTL+

64 pin CERAMIC QUAD FLATPACK

Contextual Info: Standard Products RadHard Eclipse FPGA Advanced Data Sheet August, 2004 www.aeroflex.com/RadHardFPGA ‰ Comprehensive design tools include high quality Verilog/ VHDL synthesis and simulation ‰ QuickLogic IP available for microcontrollers, DRAM controllers, USART and PCI

CERAMIC QUAD FLATPACK CQFP 96

Contextual Info: Standard Products RadHard Eclipse FPGA Advanced Data Sheet September, 2004 www.aeroflex.com/RadHardFPGA ‰ Comprehensive design tools include high quality Verilog/ VHDL synthesis and simulation ‰ QuickLogic IP available for microcontrollers, DRAM controllers, USART and PCI

AN10897

Abstract: ES-3U5T-1B257-AA basics of wiring harness BV 3145 crystal washing machine service manual AA Class NXP antenna design guide emc design prtr5v0 EMC Guide for Printed Circuit Board 2002 Ford BAV99
Contextual Info: AN10897 A guide to designing for ESD and EMC Rev. 02 — 19 January 2010 Application note Document information Info Content Keywords ESD, EMC, PCB design Abstract An introductory approach to designing for ESD. Understanding the ESD pulse, how passive components react over frequency, and PCB layout

Contextual Info: Standard Products RadHard Eclipse FPGA Advanced Data Sheet September, 2004 www.aeroflex.com/RadHardFPGA ‰ Comprehensive design tools include high quality Verilog/ VHDL synthesis and simulation ‰ QuickLogic IP available for microcontrollers, DRAM controllers, USART and PCI

Contextual Info: Standard Products RadHard Eclipse FPGA Advanced Data Sheet November, 2004 www.aeroflex.com/RadHardFPGA ‰ Comprehensive design tools include high quality Verilog/ VHDL synthesis and simulation ‰ QuickLogic IP available for microcontrollers, DRAM controllers, USART and PCI

2.5 MVA transformer

Contextual Info: SMA Solar Technology AG Solar Inverters MLX Series Design Guide www.SMA.de Contents Contents 1 Introduction 3 1.1 Introduction 3 1.2 List of Abbreviations 3 2 Inverter Overview 5 2.1 Product Label 5 2.2 Mechanical Overview of the Inverter 5 2.3 Description of the Inverter

dc-ac inverter SERVICE MANUAL

Abstract: SOLAR INVERTER WITH MPPT PWM 3 phase dc-ac inverter three grid-connected inverter mppt mppt BASED DC TO DC CONVERTER MPPT Algorithm UM1016 STEVAL-ISV002V2 mppt circuit microcontroller
Contextual Info: UM1016 User manual Getting started with the STEVAL-ISV002V2, 3000 W photovoltaic converter for grid connected applications Introduction This document describes the procedure and steps to follow in order to correctly operate the 3 kW STEVAL-ISV002V2 photovoltaic converter. This system consists of an isolated DC-DC

Field-Programmable Gate Arrays

Abstract: MPC8260 MPC860
Contextual Info: Product Brief January 15, 2002 ORCA Series 4 Field-Programmable Gate Arrays Introduction • Traditional I/O selections: — LVTTL and LVCMOS 3.3 V, 2.5 V, and 1.8 V I/Os. — Per pin-selectable I/O clamping diodes provide 3.3 V PCI compliance. — Individually programmable drive capability:

5962-08228

Abstract: 292 CCGA PCIO Diode smd f6 leon3 SMD code V12 smd w20 UT699 array resistor 10k 603 y6 smd transistor
Contextual Info: Standard Products UT699 32-bit Fault-Tolerant SPARCTM V8/LEON 3FT Processor Data Sheet November 3, 2009 INTRODUCTION The UT699 is a pipelined monolithic, high-performance, faulttolerant SPARCTM V8/LEON 3FT Processor. The UT699 provides a 32-bit master/target PCI interface, including a 16 bit

AMBA ahb bus protocol

Abstract: Diode smd f6 UT699 AMBA APB bus protocol leon3 SMD code V12 smd w20 smd transistor w18 I-293 smd transistor 805 239
Contextual Info: Standard Products UT699 32-bit Fault-Tolerant SPARCTM V8/LEON 3FT Processor Data Sheet July 23, 2009 INTRODUCTION The UT699 is a pipelined monolithic, high-performance, faulttolerant SPARCTM V8/LEON 3FT Processor. The UT699 provides a 32-bit master/target PCI interface, including a 16 bit

UT699

Abstract: AMBA APB UART 2T912
Contextual Info: Standard Products UT699 32-bit Fault-Tolerant SPARCTM V8/LEON 3FT Processor Data Sheet March 28, 2011 INTRODUCTION The UT699 is a pipelined monolithic, high-performance, faulttolerant SPARCTM V8/LEON 3FT Processor. The UT699 provides a 32-bit master/target PCI interface, including a 16 bit

TM 401

Abstract: Geode GX1 300 MHz 300b Geode GX1-266P LM4545 SMM geode video display processor GX1-200B GX1-200P
Contextual Info: Geode GX1 Processor Technical Specifications Geode CS5530A Companion I/O General Features • Designed for use with the Geode GX1 processor • 352-Terminal Tape Ball Grid Array TBGA package • 3.3V or 5.0V PCI bus compatible • 5.0V tolerant I/O interfaces

Contextual Info: PCB CONNECTORS 802-PP-NNN-65-001101 Double row Solderless compliant press-fit, Pin Ø 0.76 mm SERIES 802 Pin connectors, press-fit With compliant pin for solderless mount in PCB plated through holes. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR

Contextual Info: PCB CONNECTORS 804-V3-NNN-6B-002101 Triple row 2.54 mm, Solderless compliant press-fit, Pin Ø 0.76 mm SERIES 804 Pin connectors, press-fit With compliant pin for solderless mount in PCB plated through holes. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR

Contextual Info: PCB CONNECTORS 800-PP-NNN-66-001101 Single row 2.54 mm, Solderless compliant press-fit, Pin Ø 0.76 mm SERIES 800 Pin connectors, press-fit With compliant pin for solderless mount in PCB plated through holes. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR

Contextual Info: PCB CONNECTORS 446-PP-2NN-41-036101 Double row 2.54 mm, Solderless compliant press-fit, Mating pin Ø 0.47 mm SERIES 446 Socket connectors, press-fit With compliant pin for solderless mount in PCB plated through holes. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR

PCB design

Abstract: thermal pcb guidelines SMT reflow profile LGA voiding
Contextual Info: APPLICATION NOTE PCB Design and SMT Assembly/Rework Guidelines for MCM-L Packages REVISION HISTORY Revision Level Date Description A August 2001 Initial Release B January 17, 2002 Revise: Sections 2.1, 2.2, 2.3, 3.1, 3.2, 3.3, 3.5, 4.0, 4.1, 4.2, 4.4, 5.0, 5.1,

Contextual Info: PCB CONNECTORS 456-V3-2NN-00-014101 Double row 2.54 mm, Solderless compliant press-fit, Pin Ø 0.47 mm SERIES 456 Pin connectors, press-fit With compliant pin for solderless mount in PCB plated through holes. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR

Contextual Info: PCB CONNECTORS 802-V3-NNN-6B-002101 Double row Solderless compliant press-fit, Pin Ø 0.76 mm SERIES 802 Pin connectors, press-fit With compliant pin for solderless mount in PCB plated through holes. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR

Contextual Info: PCB CONNECTORS 346-PP-1NN-41-036101 Single row 2.54 mm, Solderless compliant press-fit, Mating pin Ø 0.47 mm SERIES 346 Socket connectors, press-fit With compliant pin for solderless mount in PCB plated through holes. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR