POWER GRID CONTROL THROUGH PC Search Results

delta39k

Abstract: 39K100 39K30 39K50
Contextual Info: Delta39K ISR™ CPLD Family CPLDs at FPGA Densities™ Features • Carry-chain logic for fast and efficient arithmetic operations • Multiple I/O standards supported — LVCMOS 3.3/3.0/2.5/1.8V , LVTTL, 3.3V PCI, SSTL2 (I-II), SSTL3 (I-II), HSTL (I-IV), and GTL+

CY39100V484B-125BBI

Abstract: programmable slew rate control IO AT17LV010-10JI CY39030V256-125MBC IO1 5V 39K100 39K165 39K30 39K50 CY39100V208B-125NTC
Contextual Info: Delta39K ISR™ CPLD Family CPLDs at FPGA Densities™ Features • Carry-chain logic for fast and efficient arithmetic operations • Multiple I/O standards supported — LVCMOS 3.3/3.0/2.5/1.8V , LVTTL, 3.3V PCI, SSTL2 (I-II), SSTL3 (I-II), HSTL (I-IV), and GTL+

64 pin CERAMIC QUAD FLATPACK

Contextual Info: Standard Products RadHard Eclipse FPGA Advanced Data Sheet August, 2004 www.aeroflex.com/RadHardFPGA ‰ Comprehensive design tools include high quality Verilog/ VHDL synthesis and simulation ‰ QuickLogic IP available for microcontrollers, DRAM controllers, USART and PCI

CERAMIC QUAD FLATPACK CQFP 96

Contextual Info: Standard Products RadHard Eclipse FPGA Advanced Data Sheet September, 2004 www.aeroflex.com/RadHardFPGA ‰ Comprehensive design tools include high quality Verilog/ VHDL synthesis and simulation ‰ QuickLogic IP available for microcontrollers, DRAM controllers, USART and PCI

AN10897

Abstract: ES-3U5T-1B257-AA basics of wiring harness BV 3145 crystal washing machine service manual AA Class NXP antenna design guide emc design prtr5v0 EMC Guide for Printed Circuit Board 2002 Ford BAV99
Contextual Info: AN10897 A guide to designing for ESD and EMC Rev. 02 — 19 January 2010 Application note Document information Info Content Keywords ESD, EMC, PCB design Abstract An introductory approach to designing for ESD. Understanding the ESD pulse, how passive components react over frequency, and PCB layout

Contextual Info: Standard Products RadHard Eclipse FPGA Advanced Data Sheet November, 2004 www.aeroflex.com/RadHardFPGA ‰ Comprehensive design tools include high quality Verilog/ VHDL synthesis and simulation ‰ QuickLogic IP available for microcontrollers, DRAM controllers, USART and PCI

dc-ac inverter SERVICE MANUAL

Abstract: SOLAR INVERTER WITH MPPT PWM 3 phase dc-ac inverter three grid-connected inverter mppt mppt BASED DC TO DC CONVERTER MPPT Algorithm UM1016 STEVAL-ISV002V2 mppt circuit microcontroller
Contextual Info: UM1016 User manual Getting started with the STEVAL-ISV002V2, 3000 W photovoltaic converter for grid connected applications Introduction This document describes the procedure and steps to follow in order to correctly operate the 3 kW STEVAL-ISV002V2 photovoltaic converter. This system consists of an isolated DC-DC

Field-Programmable Gate Arrays

Abstract: MPC8260 MPC860
Contextual Info: Product Brief January 15, 2002 ORCA Series 4 Field-Programmable Gate Arrays Introduction • Traditional I/O selections: — LVTTL and LVCMOS 3.3 V, 2.5 V, and 1.8 V I/Os. — Per pin-selectable I/O clamping diodes provide 3.3 V PCI compliance. — Individually programmable drive capability:

5962-08228

Abstract: 292 CCGA PCIO Diode smd f6 leon3 SMD code V12 smd w20 UT699 array resistor 10k 603 y6 smd transistor
Contextual Info: Standard Products UT699 32-bit Fault-Tolerant SPARCTM V8/LEON 3FT Processor Data Sheet November 3, 2009 INTRODUCTION The UT699 is a pipelined monolithic, high-performance, faulttolerant SPARCTM V8/LEON 3FT Processor. The UT699 provides a 32-bit master/target PCI interface, including a 16 bit

AMBA ahb bus protocol

Abstract: Diode smd f6 UT699 AMBA APB bus protocol leon3 SMD code V12 smd w20 smd transistor w18 I-293 smd transistor 805 239
Contextual Info: Standard Products UT699 32-bit Fault-Tolerant SPARCTM V8/LEON 3FT Processor Data Sheet July 23, 2009 INTRODUCTION The UT699 is a pipelined monolithic, high-performance, faulttolerant SPARCTM V8/LEON 3FT Processor. The UT699 provides a 32-bit master/target PCI interface, including a 16 bit

UT699

Abstract: AMBA APB UART 2T912
Contextual Info: Standard Products UT699 32-bit Fault-Tolerant SPARCTM V8/LEON 3FT Processor Data Sheet March 28, 2011 INTRODUCTION The UT699 is a pipelined monolithic, high-performance, faulttolerant SPARCTM V8/LEON 3FT Processor. The UT699 provides a 32-bit master/target PCI interface, including a 16 bit

L16 eeprom

Abstract: socket M vid pinout
Contextual Info: TSPC750IP Processor and Cache Module DESCRIPTION The Processor and Cache Module PCM is a 17 x 17 pin grid array (PGA) circuit assembly which combines a PowerPCt microprocessor and SRAM components into a CPU subsystem. The PCM provides a standard mechanical, electrical, and

Contextual Info: PCB CONNECTORS 802-PP-NNN-65-001101 Double row Solderless compliant press-fit, Pin Ø 0.76 mm SERIES 802 Pin connectors, press-fit With compliant pin for solderless mount in PCB plated through holes. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR

Contextual Info: PCB CONNECTORS 804-V3-NNN-6B-002101 Triple row 2.54 mm, Solderless compliant press-fit, Pin Ø 0.76 mm SERIES 804 Pin connectors, press-fit With compliant pin for solderless mount in PCB plated through holes. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR

PCB design

Abstract: thermal pcb guidelines SMT reflow profile LGA voiding
Contextual Info: APPLICATION NOTE PCB Design and SMT Assembly/Rework Guidelines for MCM-L Packages REVISION HISTORY Revision Level Date Description A August 2001 Initial Release B January 17, 2002 Revise: Sections 2.1, 2.2, 2.3, 3.1, 3.2, 3.3, 3.5, 4.0, 4.1, 4.2, 4.4, 5.0, 5.1,

Contextual Info: PCB CONNECTORS 456-V3-2NN-00-014101 Double row 2.54 mm, Solderless compliant press-fit, Pin Ø 0.47 mm SERIES 456 Pin connectors, press-fit With compliant pin for solderless mount in PCB plated through holes. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR

Contextual Info: PCB CONNECTORS 802-V3-NNN-6B-002101 Double row Solderless compliant press-fit, Pin Ø 0.76 mm SERIES 802 Pin connectors, press-fit With compliant pin for solderless mount in PCB plated through holes. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR

Contextual Info: PCB CONNECTORS 800-V3-NNN-6B-002101 Single row 2.54 mm, Solderless compliant press-fit, Pin Ø 0.76 mm SERIES 800 Pin connectors, press-fit With compliant pin for solderless mount in PCB plated through holes. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR

Field-Programmable Gate Arrays

Abstract: 416-PIN content addressable memory
Contextual Info: Product Brief June 2001 ORCA Series 4 Field-Programmable Gate Arrays Introduction • Traditional I/O selections: — LVTTL and LVCMOS 3.3 V, 2.5 V, and 1.8 V I/Os. — Per pin-selectable I/O clamping diodes provide 3.3 V PCI compliance. — Individually programmable drive capability:

2138F

Abstract: CBGA360 MPC7400 PC745 PC755 ATMEL 745 PCX755
Contextual Info: Features • • • • • • • • • • • • • • • 18.1SPECint95, Estimates 12.3 SPECfp95 at 400 MHz PC755 15.7SPECint95, 9SPECfp95 at 350 MHz (PC745) 733 MIPS at 400 MHz (PC755) at 641 MIPS at 350 MHz (PC745) Selectable Bus Clock (12 CPU Bus Dividers up to 10x)

cga motorola

Abstract: PowerPC755 PC755B 2138F CBGA360 MPC7400 PC745 PC755 PCX755
Contextual Info: Features • • • • • • • • • • • • • • • 18.1SPECint95, Estimates 12.3 SPECfp95 at 400 MHz PC755 15.7SPECint95, 9SPECfp95 at 350 MHz (PC745) 733 MIPS at 400 MHz (PC755) at 641 MIPS at 350 MHz (PC745) Selectable Bus Clock (12 CPU Bus Dividers up to 10x)

Contextual Info: Female Right-Angle Solder-to-Board 4-rows Signal Connectors ♦ ♦ ♦ ♦ For use on daughtercard to backplane/mothercard Mounting on the PCB with Hot Riveting Coding parts fit into the housing 3 performance classes; Telecom, IEC PL1 and IECPL2 ♦ Variants for different PCB thickness

ECP88

Abstract: driver circuit to drive electromagnetic relay ferrite antenna abstract for can bus of pic on dash board emi ferrite pi filter
Contextual Info: PCB Design Guidelines For Reduced EMI SZZA009 November 1999 1 IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest

thick bga tray size

Abstract: K179 PEAK TRAY bga K180 PEAK tray drawing TRAY JEDEC BGA DRAWING Datum Electronics type 121 HASL summit
Contextual Info: Application Specification 114- 13101 STEP- Z* Printed Circuit PC Board Connectors NOTE i 12 AUG 09 Rev H All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters. Unless otherwise specified, dimensions have a tolerance of +0.13 and angles have a tolerance of +2_. Figures and