POP PACKAGE TESTING Search Results

NS6040

Abstract: amkor DS814A pop sheet DS814 PoP PACKAGE TESTING contactor
Contextual Info: data sheet TEST CONTACTOR PoP Dual Sided Test Contactor Features: • • • • • Benefits: • Single socketing for testing both sides of package • Improved test coverage Stacked Package Amkor PoP Package on Package Dual Sided Test Contactor: Amkor Technology is now offering the PoP

JEDEC Jc-11 free

Abstract: PSVFBGA FCCSP 0.3mm pitch csp package Amkor Technology amkor flip Amkor CSP mold compound Amkor Wafer level mold compound 0.65mm pitch BGA mold cap
Contextual Info: LAMINATE data sheet Package on Package PoP Family Bottom PoP Technologies: Features: After three years of development in package stacking technology and infrastructure, Amkor launched the multiple award winning PSvfBGA platform in the 4th quarter of 2004. The next four years saw many new

JEDEC Jc-11 free

Abstract: PSVFBGA Amkor Wafer level mold compound 1415B jedec package standards Amkor CSP mold compound PoP PACKAGE TESTING Die B3
Contextual Info: LAMINATE data sheet Package on Package PoP Family PSvfBGA Package Stackable Very Thin Fine Pitch BGA (PSvfBGA): After 3 years of development in package stacking technology and infrastructure, Amkor launched the multiple award winning PSvfBGA (base PoP) platform during the 4th quarter of 2004. The next two years saw

MT29F4G08ABA

Abstract: MT29F4G08A MT29F8G08A MT29F4G08AB MT29F4G08ABAD MT29C MT29F16G08A Micron MT29F8G08
Contextual Info: Micron Confidential and Proprietary 168-Ball NAND Flash and LPDDR PoP TI OMAP MCP Features NAND Flash and Mobile LPDDR 168-Ball Package-on-Package (PoP) MCP Combination Memory (TI OMAP ) MT29C4G48MAYBAAKQ-5 WT, MT29C4G48MAZBAAKQ-5 WT, MT29C4G96MAYBACJG-5 WT, MT29C4G96MAZBACJG-5 WT,

MT29C4G48MAZAPAKQ-5

Abstract: MT29C4G96MAZAPCJG-5 MT29C4G96M MT29C4G96MAZAPCJG-5IT MT29C4G48mazapakq MT29F8G16 lpddr2 mcp lpddr2 nand mcp MT29C8G96 samsung* lpddr2* pop package
Contextual Info: Micron Confidential and Proprietary 168-Ball NAND Flash and LPDDR PoP TI OMAP MCP Features NAND Flash and Mobile LPDDR 168-Ball Package-on-Package (PoP) MCP Combination Memory (TI OMAP ) MT29C4G48MAYAPAKQ-5 IT, MT29C4G48MAZAPAKQ-5 IT, MT29C4G48MAZAPAKQ-6 IT, MT29C4G96MAZAPCJG-5 IT,

MT29F4G08ABA

Abstract: MT29C4G48 ELPIDA LPDDR2 POP MT29C4G48MAZBAAKQ-5
Contextual Info: Micron Confidential and Proprietary 168-Ball NAND Flash and LPDDR PoP TI OMAP MCP Features NAND Flash and Mobile LPDDR 168-Ball Package-on-Package (PoP) MCP Combination Memory (TI OMAPŒ) MT29C4G48MAYBAAKQ-5 WT, MT29C4G48MAZBAAKQ-5 WT, MT29C4G96MAYBACJG-5 WT, MT29C4G96MAZBACJG-5 WT,

MT29F4G08ABA

Abstract: MT29F8G08A MT29F4G08ABAD MT29C4G96MAZ MT29F4G08ABB mt29f4g16aba MT29C4G96M MT29F4G08AB smd transistor marking BA1 MT29C8G96
Contextual Info: Preliminary‡ Micron Confidential and Proprietary 168-Ball NAND Flash and LPDDR PoP TI OMAP MCP Features NAND Flash and Mobile LPDDR 168-Ball Package-on-Package (PoP) MCP Combination Memory (TI OMAP ) MT29C4G48MAYAPAKQ-5 IT, MT29C4G48MAZAPAKQ-5 IT, MT29C4G48MAZAPAKQ-6 IT, MT29C4G96MAZAPCJG-5 IT,

MT29C4G48MAZBBAKQ-48 IT

Abstract: MT29C8G96MAZBBDJV-48 IT MT29C4G96MAZBBCJG-48 mt29c4g96
Contextual Info: Micron Confidential and Proprietary 168-Ball NAND Flash with LPDDR PoP Features NAND Flash and Mobile LPDDR 168-Ball Package-on-Package PoP Combination Memory (TI OMAP ) MT29C4G48MAZBBAKQ-48 IT: 4Gb x16 (NAND) with 2Gb x32 (LPDDR) MT29C4G96MAZBBCJG-48 IT: 4Gb x16 (NAND) with 4Gb x32 (LPDDR)

OMAP4

Abstract: LASER based Four ZONE security system water filling station circuit diagram Senju eco solder paste mobile nokia circuit diagram eco solder paste primavera OMAP35xx lf4300 solder dipping pop
Contextual Info: Application Report SPRAAV2 – April 2008 PCB Assembly Guidlines for 0.4mm Package-On-Package PoP Packages, Part II Keith Gutierrez and Gerald Coley .

CU-106A

Abstract: 0.4mm pitch BGA IPC-6012A beagleboard 0.4mm pitch BGA routing IPC-6012 IPC-D-317 NAND FLASH LGA reflow profile CU-106A shelf life CBB Capacitor Selection Guide
Contextual Info: Application Report SPRAAV1B – May 2009 PCB Design Guidelines for 0.4mm Package-On-Package PoP Packages, Part I Keith Gutierrez and Gerald Coley . ABSTRACT

Contextual Info: COVER DATA SHEET 16Gb DDR3 Mobile RAMTM PoP 15.0mm  15.0mm, 216-ball FBGA EDFA164A1PB Specifications Features • Density: 16Gb • Organization — 4 pieces of 4Gb (16M words  32 bits  8 banks) in one package — Independent 2-channel bus • Package

Contextual Info: COVER DATA SHEET 16Gb DDR3 Mobile RAMTM PoP 15.0mm  15.0mm, 216-ball FBGA EDFA164A1PK Specifications Features • Density: 16Gb • Organization — 4 pieces of 4Gb (16M words  32 bits  8 banks) in one package — Independent 2-channel bus • Package

Contextual Info: COVER DATA SHEET 16Gb DDR3 Mobile RAMTM PoP 14.0mm x 14.0mm, 220-ball FBGA EDFA164A1PF Specifications Features • Density: 16Gb • Organization — 4 pieces of 4Gb (16M words × 32 bits × 8 banks) in one package — Independent 2-channel bus • Package

EDB4432BAPA

Contextual Info: DATA SHEET 4G bits DDR2 Mobile RAM PoP 12mm x 12mm, 168-ball FBGA EDB4432BAPA Specifications Features • Density: 4G bits • Organization — 16M words × 32 bits × 8 banks • Data rate: 1066Mbps (max.) • Package: 168-ball FBGA — Package size: 12.0mm × 12.0mm

Contextual Info: DATA SHEET 2G bits DDR2 Mobile RAM PoP 12mm x 12mm, 168-ball FBGA EDB2432BCPE Specifications Features • Density: 2G bits • Organization — 8M words × 32 bits × 8 banks • Data rate: 800Mbps (max.) • Package: 168-ball FBGA — Package size: 12.0mm × 12.0mm

Contextual Info: PRELIMINARY DATA SHEET 4G bits DDR2 Mobile RAM PoP 12mm x 12mm, 216-ball FBGA EDB4432BAPC Specifications Features • Density: 4G bits • Organization — 16M words × 32 bits × 8 banks • Data rate: 1066Mbps (max.) • Package: 216-ball FBGA — Package size: 12.0mm × 12.0mm

Contextual Info: COVER DATA SHEET 16G bits DDR2 Mobile RAMTM PoP 14.0mm  14.0mm, 220-ball FBGA EDBA164B1PM Specifications Features • Density: 16G bits • Organization: — 4 pieces of 4Gb (16M words 32 bits  8 banks) in one package — Independent 2-channel bus

Contextual Info: COVER PRELIMINARY DATA SHEET 12G bits DDR2 Mobile RAMTM PoP 14.0mm x 14.0mm, 220-ball FBGA EDBM164B1PD Specifications Features • Density: 12G bits • Organization: — 3 pieces of 4Gb (16M words × 32 bits × 8 banks) in one package — Independent 2-channel bus

MAX9890

Abstract: MAX9890A MAX9890AEBL-T MAX9890AETA MAX9890BEBL-T MAX9890BETA
Contextual Info: 19-2932; Rev 0; 8/03 Audio Click-Pop Suppressor The MAX9890 is available in a miniature 1.5mm ✕ 1.5mm ✕ 0.6mm 9-bump chip-scale package (UCSP ), as well as an 8-pin TDFN package (3mm ✕ 3mm ✕ 0.8mm), and is specified for operation over the -40°C to +85°C extended temperature range.

Contextual Info: TPA152 75-mW STEREO AUDIO POWER AMPLIFIER SLOS210A – JUNE 1998 – REVISED MARCH 2000 D D D D D D D D D PACKAGE TOP VIEW High-Fidelity Line-Out/HP Driver 75-mW Stereo Output PC Power Supply Compatible Pop Reduction Circuitry Internal Mid-Rail Generation

TPA152

Abstract: TPA152D TPA152DR TPA152DRG4 TPA302
Contextual Info: TPA152 75-mW STEREO AUDIO POWER AMPLIFIER SLOS210A – JUNE 1998 – REVISED MARCH 2000 D D D D D D D D D PACKAGE TOP VIEW High-Fidelity Line-Out/HP Driver 75-mW Stereo Output PC Power Supply Compatible Pop Reduction Circuitry Internal Mid-Rail Generation

TPA152

Abstract: TPA152D TPA152DR TPA302
Contextual Info: TPA152 75-mW STEREO AUDIO POWER AMPLIFIER SLOS210 – JUNE 1998 D D D D D D D D D PACKAGE TOP VIEW High-Fidelity Line-Out/HP Driver 75-mW Stereo Output PC Power Supply Compatible Pop Reduction Circuitry Internal Mid-Rail Generation Thermal and Short-Circuit Protection

LM4881

Abstract: MO-187 TPA102 TPA6100A2 TPA6100A2D TPA6100A2DGK
Contextual Info: TPA6100A2 50-mW STEREO AUDIO POWER AMPLIFIER SLOS269 – JUNE 2000 D D D D D D D D D D PACKAGE TOP VIEW 50 mW Stereo Output Low Supply Current . . . 0.75 mA Low Shutdown Current . . . 50 nA Pin Compatible With LM4881 and TPA102† Pop Reduction Circuitry

Contextual Info: TPA152 75-mW STEREO AUDIO POWER AMPLIFIER SLOS210A – JUNE 1998 – REVISED MARCH 2000 D D D D D D D D D PACKAGE TOP VIEW High-Fidelity Line-Out/HP Driver 75-mW Stereo Output PC Power Supply Compatible Pop Reduction Circuitry Internal Mid-Rail Generation