PLCC 32 INTEL PACKAGE DIMENSIONS Search Results

diode A14A

Abstract: BIOS 32 Pin PLCC 845 bios chip PLCC 32 intel package dimensions amd 29f040 thermal resistance INTEL FLASH MEMORY DATA SHEET transistor ap 431 tsop 28-LEAD Footprints picture in picture chip psop 1
Contextual Info: E AP-623 APPLICATION NOTE Multi-Site Layout Planning with Intel's Boot Block Flash Memory CHARLES ANYIMI SENIOR TECHNICAL MARKETING ENGINEER December 1995 Order Number: 292178-002 Information in this document is provided solely to enable use of Intel products. Intel assumes no liability whatsoever, including

PLCC 32 intel package dimensions

Abstract: 845 bios chip intel 845 circuit diagram all chip TSOP 48 thermal resistance TSOP 48 LAYOUT ap623 am 28f040 AP-623 PCB Layout tsop 48 PIN SOCKET
Contextual Info: E AP-623 APPLICATION NOTE Multi-Site Layout Planning with Intel’s Boot Block Flash Memory December 1996 Order Number: 292178-003 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of

MIL-STD-81705

Abstract: tsop Shipping Trays JEDEC TRAY PLCC L-273 PGA JEDEC tray TQFP Shipping Trays transport media and packing JEDEC TRAY mQFP intel tray mechanical drawings LD 273
Contextual Info: CHAPTER 10 TRANSPORT MEDIA AND PACKING TRANSPORT MEDIA Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment Standard tubes for most package types are translucent and allow visual inspection of units within the tube Carbon-impregnated black conductive tubes

MIL-STD-81705

Abstract: JEDEC TRAY PLCC transport media and packing tsop Shipping Trays JEDEC TRAY DIMENSIONS INTEL PLCC 68 dimensions tray bga PLCC 44 intel package dimensions AZ 2535 PLCC JEDEC tray
Contextual Info: 2 10 Transport Media and Packing 1/16/97 5:51 PM CH10WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 10 TRANSPORT MEDIA AND PACKING 10.1. TRANSPORT MEDIA 10.1.1. Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride (PVC) with an

80C251

Abstract: PLCC 32 intel package dimensions 80C31BH 80C51BH 87C51 ASTM-B16-85 MIL-T-10727 83C652 87C51 40 pin PLCC 44 intel package dimensions
Contextual Info: Part No. 1109342 - PLCC to DIP Adapter for Intel 80C31BH, 80C51BH, 87C51, 80/83C652 ,80C251 and other Microprocessors FEATURES: • Designed specifically for use with Intel 80/83C652 and 80C251 microprocessors. • Allows user to switch package styles and avoid shortage problems.

PLCC 32 intel package dimensions

Abstract: PLCC 44 intel package dimensions
Contextual Info: Part No. 1109342 - PLCC to DIP Adapter for Intel 80C31BH, 80C51BH, 87C51, 80/83C652 ,80C251 and other Microprocessors FEATURES: • Designed specifically for use with Intel 80/83C652 and 80C251 microprocessors. • Allows user to switch package styles and avoid shortage problems.

Contextual Info: Part No. 97-80C251 DIP to PLCC Adapter for Intel 80/83C652 and 80C251 Microprocessors FEATURES: •Designed specifically for use with Intel 80/83C652 and 80C251 microprocessors. •Allows user to switch package styles and avoid shortage problems. •Designed to plug directly into your 44 pin PLCC socket.

Motorola SMD code

Abstract: PSB21525-N
Contextual Info: SIEMENS High-Level Serial Communications Controller Extended HSCX-TE PSB 21525 Version 2.1 1 CMOS Features Package Besides P-LCC-44-1 and P-MQFP-44-2, the HSCX-TE PSB 21525 is available also in P-TQFP-64-1 package. Type Ordering Code Package PSB 21525 N Q67100-H6672

MQFP Shipping Trays

Abstract: TSOP32 Package 28F320B3 bga Shipping Trays D 2498 MIL-STD-81705 tray datasheet bga transport media and packing peak tray transistor databook
Contextual Info: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are

JEDEC TRAY DIMENSIONS

Abstract: tray bga JEDEC tray standard MIL-STD-81705 transport media and packing 100L PGA JEDEC tray JEDEC TRAY PGA MATERIALS MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs JEDEC tray standard tsop
Contextual Info: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are

allmax

Abstract: PROGRAMMING ADAPTER ep-1140 323201P600-YAM programmers 1890a minato 1890A sprint plus 48 aval pkw 3000 bytek EZ 932 promax
Contextual Info: M1677 Specification Number: _ PROGRAMMING ADAPTER SPECIFICATION Item: Description: 323201P600-YAM AS-32-32-01P-6YAM-LN REPLACEMENT SOCKET: S-PCC-00-032-C Call Emulation Technology for a replacement socket price and delivery quote. TYPICAL DIMENSIONS:

Contextual Info: IA82527 CAN Serial Communications Controller Data Sheet March 27, 2009 IA82527 Serial Communications Controller—CAN Protocol Data Sheet IA211080504-03 Page 1 of 53 http://www.Innovasic.com Customer Support: 888 824-4184 IA82527 CAN Serial Communications Controller

WJLXT905LC.C2

Abstract: B536 LXT905LC lxt905pc WJLXT905LE.C2 document number 248991 LXT905PC.C2 EELXT905PC 248991 lxt905le c2
Contextual Info: Intel LXT905 Universal 10BASE-T Transceiver with 3.3 V Support Datasheet The Intel® LXT905 Universal 10BASE-T Transceiver is designed for IEEE 802.3 physical layer applications. It provides, in a single CMOS device, all of the active circuitry for interfacing most

AS82527

Contextual Info: IA82527 CAN Serial Communications Controller Data Sheet April 29, 2009 IA82527 Serial Communications Controller—CAN Protocol Data Sheet IA211080504-04 Page 1 of 52 http://www.Innovasic.com Customer Support: 888 824-4184 IA82527 CAN Serial Communications Controller

Contextual Info: l p 13« PIMMMGT [PIF3EWEW in te l. 80L188EA8 16-BIT HIGH INTEGRATION EMBEDDED PROCESSOR • 3V Operation, Vcc = 2.7V-5.5V ■ Full Static Operation ■ True CMOS Inputs and Outputs Integrated Feature Set — Static 186 CPU Core — Power Save, Idle and Powerdown

Migration Guide for Intel StrataFlash Memory J

Abstract: Intel StrataFlash Memory j3 Intel Stacked CSP 1997 28F008B3 28F008S5 28F016B3 28F128W18 28F160B3 28F320B3 28F800B3
Contextual Info: PRODUCT SELECTION MATRIX P Intel 1.8V Wireless Flash W18/W30 R O D Intel StrataFlash® Memory (J3) U C T S Synchronous Intel StrataFlash® Memory (K3/K18) Advanced+ Boot Block (C3) X8 Organization X16 8 Mb 16 Mb 32 Mb Density 64 Mb 128 Mb 256 Mb Burst

AN82527F8

Abstract: intel 82527 EN210 82527 IA82527 IA82527-PLC44A IA82527-PLC44A-R IA82527-PTQ44A InnovASIC AN82527
Contextual Info: 04 May 2007 IA82527 CAN Serial Communications Controller As of Production Ver. 00 PRELIMINARY IA82527 Serial Communications Controller ▪ CAN Protocol Data Sheet Document Version 1.0 Copyright  2007 EN21070504-00 Page 1 of 45 www.Innovasic.com Customer Support:

PLCC 32 intel package dimensions

Abstract: PLCC 44 intel package dimensions 80c251 80C31BH 80C51BH 87C51 AMS-QQ-N-290
Contextual Info: P/N 1109342 for Intel 80C31BH, 80C51BH, 87C51, 80/83C652, 80C251 and Other Microprocessors PLCC-to-DIP Adapter FEATURES • Designed specifically for use with Intel 80/83C652 and 80C251 microprocessors. • Allows user to switch package styles and avoid shortage problems.

siemens Package Outlines P-LCC

Abstract: PLCC 44 intel package dimensions GPM05247 HSCX-TE P-TQFP-64
Contextual Info: ICs for Communications High-Level Serial Communications Controller Extended HSCX-TE PSB 21525 Version 2.1 Delta Sheet 02.96 T2152-5V21-D1-7600 PSB 21525 Revision History: Current Version: 02.96 Previous Version: none Page Page in previous (in new Version

Contextual Info: PA51GB-68 Z Data Sheet 68 pin PLCC socket/40 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction Using this adapter, the Intel 87C51GB microcontroller in either PLCC or CLCC package can be programmed on 40 pin DIP programmers capable of programming an 87C52.

TN82527

Abstract: EN82527
Contextual Info: 04 May 2008 IA82527 CAN Serial Communications Controller As of Production Ver. 00 IA82527 Serial Communications Controller ▪ CAN Protocol Data Sheet Document Version 1.0 Copyright 2007 EN21080504-01 Page 1 of 46 www.Innovasic.com Customer Support:

intel PLCC packaging draw

Abstract: PLCC 68 intel package dimensions 80C186 intel end 80C187 80L188EA13 INTEL PLCC 68 dimensions 0000110w
Contextual Info: Intel 80C186EA/80C188EA AND 80L186EA/80L188EA 16-Bit High-Integration Embedded Processors Datasheet • ■ ■ Intel® 80C186 Upgrade for Power Critical Applications Fully Static Operation True CMOS Inputs and Outputs Product Features ■ ■ Integrated Feature Set

Contextual Info: H HP 64767 Series Emulators for 25 MHz Intel 80C186/C188EA/EB/EC/XL, Processors Product Overview Description Features •Real-time, zero-wait-state operation to 20 MHz •Active probe includes one megabyte of emulation memory that covers the entire processor address space

LEAPER-3

Abstract: 74189 7489 sram 4N34 89C51 interfacing with lcd display ic 74192 pin configuration interfacing 20x4 LCD with 89c51 IC 74189 DATA LEAP-U1 LEAPER-10 driver
Contextual Info: COMPANY PROFILE 1 Leap Electronic was established in 1980 located in Taipei Taiwan. With great experienced employees, Leap has dedicated on test equipment and provided a whole and perfect environment of development. Additional, the Company has been qualified by major IC manufacturer such as ATMEL, AMD, MICROCHIP, WINBOND,etc.