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Contextual Info: leading edge Multilevel signaling technology boosts peak transfer bandwidth eliability, cost, and availability concerns R continue to swirl around DRDRAM Direct Rambus DRAM , but they haven’t stopped Ram- Figure 1 bus from pursuing next-generation, high-speedinterface development. Last December, Rambus

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Contextual Info: Intel My WiFi Technology Interoperability Test Passed Consumer Devices Report Revision 1.2 May 26, 2009 Intel® My WiFi Technology Interoperability Test Passed Consumer Devices Report, Rev. 1.2 Legal Disclaimer This document is provided “as is” with no warranties whatsoever, including any warranty of merchantability, noninfringement fitness for any particular purpose, or any warranty otherwise arising out of any proposal, specification

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Contextual Info: HDMI 1.3 Position Paper Protect Your Product Line with VastLane HDMI 1.3 If you’re building HD devices without HDMI 1.3, you may be putting your product’s competitive future at risk. DTVs and PC displays, DVD and high-definition disc players, A/V receivers, set-top boxes, gaming consoles, even

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Contextual Info: Terrain Rendering Engine TRE : Cell Broadband Engine Optimized Real-time Ray-caster Barry Minor, IBM 11501 Burnet Rd. Austin, TX 78758 bminor@us.ibm.com Gordon Fossum, IBM 11501 Burnet Rd. Austin, TX 78758 fossum@us.ibm.com Abstract The development of the Cell Broadband Engine

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Contextual Info: W H I T E P A P E R By Clay D. Montgomery, Graphics Software Engineer Media & Applications Processor Platforms Texas Instruments Introduction to Graphics Software Development for OMAP 2/3 Executive Summary Introduction The latest OMAP devices offer break-

Contextual Info: Qwik Connect GLENAIR n o c t o b er 2 0 1 1 n VOLUME 15 n NUMBER 4 QwikConnect G lenair continues to make significant inroads into the ruggedized high speed interconnect market. This evolution began the late 1980s with pioneering fiber-optic solutions for the Mil-Aero

Contextual Info: Qwik Connect GLENAIR n o c t o b er 2 0 1 1 n VOLUME 15 n NUMBER 4 QwikConnect G lenair continues to make significant inroads into the ruggedized high speed interconnect market. This evolution began the late 1980s with pioneering fiber-optic solutions for the Mil-Aero

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Contextual Info: The concern for product reliability with respect to Electrostatic Discharge ESD continues to increase.Whether at the IC foundry, the board assembler, or in the field, ESD is a threat to product survivability. However, a circuit that survives HBM/MM/CDM events is not guaranteed