PLATING MICROINCH Search Results
PLATING MICROINCH Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
|---|---|---|---|---|---|
| 91911-31615LF | Amphenol Communications Solutions | Conan® 1.00mm Pitch, Board To Board Connector, Vertical Header,15 microinch GXT plating, Surface Mount, 15 Positions,5.5mm mating height | |||
| CN-ACPRREDAA0 | Amphenol Cables on Demand | RCA Male Plug Cable Connector (Red) - Amphenol ACPR-RED - Gold Plated Diecast Shell | |||
| 75967-113 | Amphenol Communications Solutions | CTW MALE PIN, PLATED | |||
| 10058831-110LF | Amphenol Communications Solutions | Connector PF version, 0.76 um Gold plating | |||
| 10058835-1000LF | Amphenol Communications Solutions | Surface Mount version, 0.76 um Gold plating |
PLATING MICROINCH Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
|
Contextual Info: NOTES: 1. MATERIALS AND FINISHES PLATING THICKNESS IN MICROINCHES : BODY ASSEMBLY - BRASS, GOLD PLATING (50 MIN THICK) CAP - BRASS, GOLD PLATING (50 MIN THICK) LOOSE CONTACT - BeCu, GOLD PLATING (50 MIN THICK) & ASSEMBLED CONTACT GASKET - SILICONE RUBBER |
Original |
m39012/56-450212-aug-1309-jul-80rg-400/u+1 | |
PSM05Contextual Info: SELECTIVE PLATING CHART CODE PLATING: SEE SELECTIVE PLATING CHART CONTACT AREA C-PRESS COMPLIANT SECTION & TAIL 192 .000030 .000050 MICROINCHES MIN. .000050 MIN GOLD OVER 0.00076 0.00127 NICKEL UNDERPLATE 0.00127 MIN. TIN-LEAD 195 .000030 .000050 MICROINCHES MIN. |
Original |
psm05 | |
|
Contextual Info: NOTES: REV 1. MATERIALS AND FINISHES PLATING THICKNESS IN MICROINCHES : OUTER & INNER FERRULE - COPPER, BRIGHT ACID TIN (200 MIN THICK) OUTER & INNER BODY - BeCu, GOLD PLATING (50 MIN THICK) CONTACT - BeCu, GOLD PLATING (50 MIN THICK) WASHER - PTFE INSULATOR |
Original |
1290-001p08-aug-1314-nov-91aa2325 | |
94HB led
Abstract: E107337
|
Original |
e107337e1456139400pf32unef+1 | |
|
Contextual Info: NOTES: 1. REVISIONS THIRD ANGLE PROJ. REV MATERIALS AND FINISHES PLATING THICKNESS IN MICROINCHES : OUTER & INNER FERRULE - COPPER, BRIGHT ACID TIN (200 MIN THICK) OUTER & INNER BODIES - BeCu, GOLD PLATING (50 MIN THICK) CONTACT - BeCu, GOLD PLATING (50 MIN THICK) |
Original |
st5m1289st5m132st5m1290-001s08-aug-13+2 | |
g060Contextual Info: NOTES: 1. MATERIALS AND FINISHES PLATING THICKNESS IN MICRO-INCHES : BODY - BERYLLIUM COPPER, WHITE BRONZE PLATING CONTACT -BERYLLIUM COPPER, GOLD PLATING INSULATORS - DELRIN k TEFLON FERRULE - COPPER, WHITE BRONZE PLATING 2 . ELECTRICAL: A. IMPEDANCE: 50 OHM |
OCR Scan |
919-nm122p-51asiz6au-5029-jurg-178+3 | |
MCX6252
Abstract: 919-NM
|
OCR Scan |
919-nm119j-51amcx6252b1-004-3gt30g-50\dwg\cnpd\919\nm+3 | |
|
Contextual Info: 10 PLATING 6 7 4 9 0 -9 2 2 0 GOLD FLASH 6 7 4 9 0 -9 2 2 1 30 MICROINCH GOLD PLATING 6 7 4 9 0 -9 2 2 5 15 MICROINCH GOLD PLATING 6 7 4 9 0 -9 2 3 0 GOLD FLASH 6 7 4 9 0 -9 2 3 1 3 0 MICROINCH GOLD PLATING 6 7 4 9 0 -9 2 3 5 15 MICROINCH GOLD PLATING 6 7 4 9 0 -9 2 4 0 |
OCR Scan |
5mmx15sd-67490-002 | |
JM4001
Abstract: J 5027 636-3427 636-1027 transistor c9018 JM40
|
OCR Scan |
22-apr-96jm4001j 5027636-3427+3 | |
|
Contextual Info: 10 PLATING 6 7 4 9 0 -9 2 2 0 GOLD FLASH 6 7 4 9 0 -9 2 2 1 30 MICROINCH GOLD PLATING 6 7 4 9 0 -9 2 2 5 15 MICROINCH GOLD PLATING 6 7 4 9 0 -9 2 3 0 GOLD FLASH 6 7 4 9 0 -9 2 3 1 3 0 MICROINCH GOLD PLATING 6 7 4 9 0 -9 2 3 5 15 MICROINCH GOLD PLATING 6 7 4 9 0 -9 2 4 0 |
OCR Scan |
5mmx15sd-67490-002 | |
U3-16Contextual Info: / REVISIONS 919-NM104P-51A NOTES: 1. MATERIALS AND FINISHES PLATING THICKNESS IN MICRO-INCHES : BODY AND CAP - BERYLLIUM COPPER , WHITE BRONZE PLATING (COPPER-TIN-ZINC) CONTACT -BERYLLIUM COPPER , GOLD PLATING INSULATORS - DELRIN & TEFLON FERRULE - COPPER , WHITE BRONZE PLATING (COPPER-TIN-ZINC) |
OCR Scan |
919-nm104p-51aoa-aug-0588a/u316/u+2 | |
919-NM101P-51SContextual Info: REVISIONS 919—NM101P—51S NOTES: 1 . MATERIALS AND FINISHES PLATING THICKNESS IN MICRO-INCHES : BODY - BERYLLIUM COPPER , WHITE BRONZE PLATING (COPPER -T IN -Z IN C ) CONTACT - BERYLLIUM COPPER , GOLD PLATING INSULATOR - TEFLON FERRULE - COPPER , WHITE BRONZE PLATING (COPPER -TIN -Z IN C ) |
OCR Scan |
919--nm101p--51smcx1121a919-nm101p-51s | |
|
Contextual Info: NOTES: 1. MATERIALS AND FINISHES PLATING THICKNESS IN MICRO-INCHES : HOUSING - BRASS, GOLD PLATING BODY - BERYLLIUM COPPER, GOLD PLATING CONTACT - BRASS, GOLD PLATING INSULATOR - PTFE 2 . ELECTRICAL: A. IMPEDANCE: 50 OHM B. FREQUENCY RANGE: DC 0 - 6 GHz C. DIELECTRIC WITHSTANDING VOLTAGE: 1000 VRMS, MIN. |
OCR Scan |
changed\rd--dm89011401b1040601r3cx1181a11181aaa45ge5f+2 | |
|
Contextual Info: | NOTES: 1. MATERIALS AND FINISHES PLATING THICKNESS IN MICRO-INCHES : BODY - STAINLESS STEEL, GOLD PLATING CONTACT - BERYLLIUM COPPER, GOLD PLATING LOCK WASHER,HEX NUT - BRASS, GOLD PLATING INSULATOR - PTFE 2. ELECTRICAL: A. IMPEDANCE: 50 OHM B. FREQUENCY RANGE: DC 0 - 1 2 . 4 GHz |
OCR Scan |
116251aasa1fv5f | |
|
|
|||
|
Contextual Info: Product Number: 999-11-230-10-000000 Description: Jumper Male Shorting 10 Microinches Gold Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel # Of Pins B Mill-Max Part Number 2 0.300 999-11-230-10-000000 |
Original |
||
|
Contextual Info: Product Number: 999-11-112-10-000000 Description: Jumper Male Shorting 10 Microinches Gold Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel # Of Pins B Mill-Max Part Number 2 0.200 999-11-112-10-000000 |
Original |
||
|
Contextual Info: Product Number: 999-11-210-10-000000 Description: Jumper Male Shorting 10 Microinches Gold Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel # Of Pins B Mill-Max Part Number 2 0.100 999-11-210-10-000000 |
Original |
420-seoul94v-0vrms/150 | |
|
Contextual Info: Product Number: 999-11-210-10-000000 Description: Jumper Male Shorting 10 Microinches Gold Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel # Of Pins B Mill-Max Part Number 2 0.100 999-11-210-10-000000 |
Original |
||
|
Contextual Info: Product Number: 999-11-113-10-000000 Description: Jumper Male Shorting 10 Microinches Gold Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel # Of Pins B Mill-Max Part Number 2 0.300 999-11-113-10-000000 |
Original |
||
|
Contextual Info: Product Number: 999-11-110-10-000000 Description: Jumper Male Shorting 10 Microinches Gold Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel # Of Pins B Mill-Max Part Number 2 0.100 999-11-110-10-000000 |
Original |
||
|
Contextual Info: ECN REV 4032 4368 5742 - A B ELFH ASSEM B LY PART NU M B ER IN G SC H EM E ELFH G 1 1G = = = = BLACK, TIN PLATING GREEN, TIN PLATING BLACK, SELECTIVE GOLD PLATING GREEN, SELECTIVE GOLD PLATING STYLE 0 - HORIZONTAL 7 - VERTICAL CONTACT SPACING = .200"- |
OCR Scan |
e83421-j----08-22lr69703elfh08200 | |
|
Contextual Info: NOTES: 1. MATERIALS AND FINISHES PLATING THICKNESS IN MICRO-INCHES : BODY - BRASS, NICKEL PLATING CONTACT - BERYLLIUM COPPER, GOLD PLATING INSULATOR - PTFE 2. ELECTRICAL: A. IMPEDANCE: 50 OHM B. DIELECTRIC WITHSTANDING VOLTAGE: 1000 VRMS, MIN. 3. MECHANICAL: |
OCR Scan |
15-feb-0701-mar-07101-mar-07\dwg\sma\1251a2\004\50\nt50g-5sz+2 | |
|
Contextual Info: NOTES: 1. MATERIALS AND FINISHES PLATING THICKNESS IN MICRO-INCHES : BODY - BERYLLIUM COPPER, WHITE BRONZE PLATING (COPPER-TIN-ZINC) CONTACT - BERYLLIUM COPPER, GOLD PLATING INSULATOR - TELFON FERRULE - SEAMLESS COPPER, WHITE BRONZE 2. ELECTRICAL: A. IMPEDANCE: 50 OHM |
OCR Scan |
903-nm291p-51a-291p07-sep-06\dwg\cnpd\903\nm291p\51-bsz+1 | |
48675
Abstract: 8241F
|
OCR Scan |
8241fjul--11\dwg\cnpd\31\00-afsz+1 | |