PLASTIC QUAD FLAT PACK Search Results

TQFP 144 PACKAGE

Abstract: transistor A144 A101 TQFP 32 PACKAGE a101 transistor TQFP Package 44 lead A101 Package A144 transistor data sheet A64 Package pdf A101 datasheet
Contextual Info: Package Diagram Thin Quad Flat Packs 32-Lead Thin Plastic Quad Flatpack 7 x 7 x 1.0mm A32 1 Package Diagram 44-Lead Thin Plastic Quad Flat Pack A44 64-Pin Thin Quad Flat Pack A64 2 Package Diagram 64-Lead Thin Plastic Quad Flat Pack A65 3 Package Diagram 80-Pin Thin Plastic Quad Flat Pack A80

A64 Package

Contextual Info: 3.14 Package Diagrams 64-Pin Thin Quad Flat Pack A64 3-148 Package Diagrams 100-Pin Plastic Thin Quad Flat Pack TQFP A100 3-149 Package Diagrams 64-Lead Plastic Thin Quad Flatpack N65 3-150

TB389

Contextual Info: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L16.5x5 16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VHHB ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80

MO-220-VHHC

Abstract: TB389 MO-220VHHC 0758N
Contextual Info: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L20.5x5 20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80 0.90 1.00 - A1 - 0.02 0.05 - A2 - 0.65

Contextual Info: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L56.8x8A 56 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VLLD-2 ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A

TB389

Contextual Info: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L20.6x6B 20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VJJB ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80

Technical Brief TB389

Abstract: MO-220VJJC TB389
Contextual Info: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L28.6x6 28 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VJJC ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80

MO-220-WGGD-1

Abstract: Technical Brief TB389 TB389
Contextual Info: Plastic Packages for Integrated Circuits Thin Quad Flat No-Lead Plastic Package TQFN Thin Micro Lead FramePlastic Package (TMLFP) L20.4x4A 20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220WGGD-1 ISSUE I) MILLIMETERS SYMBOL MIN NOMINAL

jedec package MO-220

Abstract: l38 transistor MO-220
Contextual Info: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L38.5x7B (One of 10 Packages in MDP0046) 38 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220) A MILLIMETERS D N (N-1)

MO-220

Abstract: ne 002
Contextual Info: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L32.5x6B (One of 10 Packages in MDP0046) 32 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220) A MILLIMETERS D N (N-1)

MO-220-WJJD

Abstract: MO-220-WJJD-1 TB389 21NX MO-220WJJD-1
Contextual Info: Plastic Packages for Integrated Circuits Thin Quad Flat No-Lead Plastic Package TQFN Thin Micro Lead Frame Plastic Package (TMLFP) L32.5x5A 2X 0.15 C A D A 32 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220WJJD-1 ISSUE C) D/2 MILLIMETERS

LL110

Abstract: land pattern for QFN 7x7 QFN 7X7 NX 38 TB389 455e
Contextual Info: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) 2X L32.7x7 32 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VKKC ISSUE C) 0.15 C A MILLIMETERS D A 9 D/2 D1 D1/2 2X

TB389

Abstract: LL110
Contextual Info: Plastic Packages for Integrated Circuits Thin Quad Flat No-Lead Plastic Package TQFN Thin Micro Lead Frame Plastic Package (TMLFP) ) 2X L16.3x3A 0.15 C A D A 16 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE 9 MILLIMETERS D/2 D1 D1/2 2X N 6 INDEX AREA 0.15 C B

MO-255 16-lead

Abstract: Technical Brief TB389 MO-255 TB389 3ne4 NE43
Contextual Info: Plastic Packages for Integrated Circuits Ultra Thin Quad Flat No-Lead Plastic Package UTQFN D L16.2.6x1.8A B 16 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE MILLIMETERS 6 INDEX AREA 2X A N SYMBOL E 0.10 C 1 2 2X MIN NOMINAL MAX NOTES A 0.45 0.50 0.55

TB389

Abstract: TIP 06
Contextual Info: Plastic Packages for Integrated Circuits Ultra Thin Quad Flat No-Lead Plastic Package UTQFN D 6 INDEX AREA A L10.2.1x1.6A B N 10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE MILLIMETERS E SYMBOL 2X MIN NOMINAL MAX 1 2X 2 0.10 C TOP VIEW C A 0.05 C SEATING PLANE

jedec package MO-220

Abstract: MO-220 jedec package MO-220 for qfn jedec package MO-220 QFN 20
Contextual Info: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN A 20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220) B N (N-1) (N-2) D 1 2 3 L20.5x5C MILLIMETERS SYMBOL PIN #1 I.D. MARK E (2X) 0.075 C TOP VIEW (2X) (N/2)

Contextual Info: 3.3 VOLT CMOS SyncFlFO7 512x36,1,024x36 and 2,048 x 36 Integrated D evice T echnology, Inc. FEATURES: • Available in 132-pin plastic quad flat package PQFP or space-saving 120-pin thin quad flat package (TQFP) • Pin and functionally compatible versions of the 5V

FPT-64P-M06

Abstract: QFP064-P-1420-3
Contextual Info: QUAD FLAT L-LEADED PACKAGE 64 PIN PLASTIC FPT-64P-M06 EIAJ code : ∗QFP064-P-1420-3 64-pin plastic QFP Lead pitch 1.00mm Package width x package length 14 × 20mm Lead shape Gullwing Sealing method Plastic mold Length of flat portion of pins 1.20mm FPT-64P-M06

C4658

Abstract: IC51-1324-828 IDT72V3631 IDT72V3641 IDT72V3651
Contextual Info: 3.3 VOLT CMOS SyncFIFOTM 512 x 36, 1,024 x 36, and 2,048 x 36 FEATURES: • Available in 132-pin plastic quad flat package PQFP or spacesaving 120-pin thin quad flat package (TQFP) • Pin and functionally compatible versions of the 5V operating IDT723631/723641/723651

IC51-1324-828

Abstract: IDT723631 IDT723641 IDT723651
Contextual Info: CMOS SyncFIFO 512 x 36 1,024 x 36 2,048 x 36 FEATURES: IDT723631 IDT723641 IDT723651 • Output Ready OR and Almost-Empty (AE) flags synchronized by CLKB • Available in 132-pin plastic quad flat package (PQFP) or spacesaving 120-pin thin quad flat package (TQFP)

B17C

Contextual Info: CMOS SyncFlFO 512x36,1024x36, 2048 x 36 IDT723631 IDT723641 IDT723651 Integrated D evice Technology, Inc. • Supports clock frequencies up to 67 Mhz • Fast access times of 11 ns • Available in 132-pin plastic quad flat package PQF or space-saving 120-pin thin quad flat package (TQFP)

TQFP100

Abstract: TQFP-100
Contextual Info: Philips Semiconductors Package outlines TQFP100: plastic thin quad flat package; 100 leads; body 14 x 14 x 1.0 mm 1997 Aug 04 639 SOT386-1

IC51-1324-828

Abstract: IDT723612 B18-B26 TMDV
Contextual Info: IDT723612 CMOS SyncBiFIFO 64 x 36 x 2 Integrated Device Technology, Inc. • • • • Low-power advanced CMOS technology Supports clock frequencies up to 67 MHz Fast access times of 10ns Available in 132-pin plastic quad flat package PQF or space-saving 120-pin thin quad flat package (TQFP)

LQFP44

Contextual Info: Philips Semiconductors Package outlines LQFP44: plastic low profile quad flat package; 44 leads; body 10 x 10 x 1.4 mm 1997 Aug 04 1 SOT389-1