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    PIN GRID ARRAY PPM Search Results

    PIN GRID ARRAY PPM Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-DSDMDB09MM-015
    Amphenol Cables on Demand Amphenol CS-DSDMDB09MM-015 9-Pin (DB9) Deluxe D-Sub Cable - Copper Shielded - Male / Male 15ft PDF
    CS-DSDMDB15MM-002.5
    Amphenol Cables on Demand Amphenol CS-DSDMDB15MM-002.5 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Male 2.5ft PDF
    CS-DSDMDB25MF-025
    Amphenol Cables on Demand Amphenol CS-DSDMDB25MF-025 25-Pin (DB25) Deluxe D-Sub Cable - Copper Shielded - Male / Female 25ft PDF
    CS-DSDMDB37MF-010
    Amphenol Cables on Demand Amphenol CS-DSDMDB37MF-010 37-Pin (DB37) Deluxe D-Sub Cable - Copper Shielded - Male / Female 10ft PDF
    CS-DSDMDB50MF-002.5
    Amphenol Cables on Demand Amphenol CS-DSDMDB50MF-002.5 50-Pin (DB50) Deluxe D-Sub Cable - Copper Shielded - Male / Female 2.5ft PDF

    PIN GRID ARRAY PPM Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Contextual Info: PGA / BGA / PLCC SOCKETS 558-10-NNNMXX-XXX101 PGA 1.27 mm grid, Interconnect pin solder tail SERIES 558 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, interconnect pin. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability


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    558-10-nnnmxx-xxx101cuzn36pb3c3600026x26+1ch-2800 PDF

    Contextual Info: PGA / BGA / PLCC SOCKETS 518-77-NNNMXX-XXX106 PGA 1.27 mm grid socket, Surface mount SERIES 518 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability


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    518-77-nnnmxx-xxx106cuzn36pb3c36000c17200+1ch-2800 PDF

    BGA PACKAGE thermal profile

    Abstract: 225-pin BGA X3365 fine BGA thermal profile XC73108 TEXTOOL zif capacitance in BGA package
    Contextual Info: Ball Grid Array Packaging The Cost Effective, High Density EPLD Solution  November 1993 White Paper Introduction profile than conventional PQFPs 1.9 mm versus 3.7 mm which makes the package ideal for high pin count portable applications. The ball grid array (BGA) package is the latest in a series


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    xc73108bga package thermal profile225-pin bgax3365+3fine bga thermal profiletextool zifcapacitance in bga package PDF

    Contextual Info: PGA / BGA / PLCC SOCKETS 550-10-NNNMXX-XXX166 BGA 1.27 mm grid, BGA pin-adapter, SMD SERIES 550 Ball grid array adapters, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 New attribute UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life


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    550-10-nnnmxx-xxx166cuzn36pb3c3600020x20+2514-83-256m20-001148ch-2800 PDF

    Contextual Info: PGA / BGA / PLCC SOCKETS 518-77-NNNMXX-XXX105 PGA 1.27 mm grid socket, Solder tail SERIES 518 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, solder tail. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-O


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    518-77-nnnmxx-xxx105cuzn36pb3c36000c17200+1ch-2800 PDF

    Contextual Info: PGA / BGA / PLCC SOCKETS 550-PP-NNN-XX-XXX135 PGA Interstitial interconnect pin socket, solder tail SERIES 550 Pin grid array sockets with intersitial contact rows, interconnect pin. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability


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    550-pp-nnn-xx-xxx135pct-gf30-frcuzn36pb3c36000+219x19ch-2800 PDF

    Contextual Info: PGA / BGA / PLCC SOCKETS 550-PP-NNN-XX-XXX101 PGA Interconnect pin solder tail SERIES 550 Pin grid array sockets, interconnect pin TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life


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    550-pp-nnn-xx-xxx101pct-gf30-frcuzn36pb3c36000+217x17ch-2800 PDF

    Contextual Info: PGA / BGA / PLCC SOCKETS 614-PP-NNN-XX-XXX144 PGA Interstitial carrier socket SERIES 614 Pin grid array sockets with intersitial contact rows, carriers with disposable plastic body. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR


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    614-pp-nnn-xx-xxx144pct-gf30-frcuzn36pb3c36000+2c17200ch-2800 PDF

    Contextual Info: PGA / BGA / PLCC SOCKETS 514-PP-NNN-XX-XXX154 PGA Interstitial socket, Surface mount SERIES 514 Pin grid array sockets with interstitial contact rows, surface mount floating contacts. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR


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    514-pp-nnn-xx-xxx154pct-gf30-frcuzn36pb3c36000+2c17200ch-2800 PDF

    Contextual Info: PGA / BGA / PLCC SOCKETS 546-PP-NNN-XX-XXX147 PGA Interstitial socket, Solderless compliant press-fit SERIES 546 Pin grid array sockets with interstitial contact rows, solderless compliant pins. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR


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    546-pp-nnn-xx-xxx147pct-gf30-frc54400c17200+1ch-2800 PDF

    Contextual Info: PGA / BGA / PLCC SOCKETS 614-PP-NNN-XX-XXX112 PGA Carrier SERIES 614 Pin grid array sockets, carriers with disposable plastic body. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability UL 94V-O Sleeve Brass CuZn36Pb3 C36000 Contact


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    614-pp-nnn-xx-xxx112pct-gf30-frcuzn36pb3c36000+2c17200ch-2800 PDF

    Contextual Info: PGA / BGA / PLCC SOCKETS 517-PP-NNN-XX-XXX111 PGA Interstitial socket, Solder tail SERIES 517 Pin grid array sockets with interstitial contact rows, solder tails. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability UL 94V-O Sleeve


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    517-pp-nnn-xx-xxx111pct-gf30-frcuzn36pb3c36000+2c17200ch-2800 PDF

    Contextual Info: PGA / BGA / PLCC SOCKETS 514-PP-NNN-XX-XXX117 PGA Surface mount SERIES 514 Pin grid array sockets, surface mount with floating contacts. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability UL 94V-O Sleeve Brass CuZn36Pb3 C36000


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    514-pp-nnn-xx-xxx117pct-gf30-frcuzn36pb3c36000+2c17200ch-2800 PDF

    Contextual Info: PGA / BGA / PLCC SOCKETS 546-PP-NNN-XX-XXX136 PGA Solderless compliant press-fit SERIES 546 Pin grid array sockets, with compliant press-fit terminations. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability UL 94V-O Sleeve Bronze CuSn4Pb4Zn4 C54400


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    546-pp-nnn-xx-xxx136pct-gf30-frc54400c17200+1ch-2800 PDF

    Contextual Info: PGA / BGA / PLCC SOCKETS 510-PP-NNN-XX-XXX101 PGA Solder tail SERIES 510 Pin grid array sockets, standard solder version. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability UL 94V-O Sleeve Brass CuZn36Pb3 C36000 Contact Clip (6 finger): Beryllium copper (C17200)


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    510-pp-nnn-xx-xxx101pct-gf30-frcuzn36pb3c36000+2c17200ch-2800 PDF

    Contextual Info: PGA / BGA / PLCC SOCKETS 510-PP-NNN-XX-XXX101 PGA Solder tail SERIES 510 Pin grid array sockets, standard solder version. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability UL 94V-O Sleeve Brass CuZn36Pb3 C36000 Contact Clip (6 finger): Beryllium copper (C17200)


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    510-pp-nnn-xx-xxx101pct-gf30-frcuzn36pb3c36000+2c17200ch-2800 PDF

    35x35 bga

    Abstract: C17200 C54400 540-88-084-17-400 CuSn4Pb4Zn4 MO-052 footprint 157 BGA socket 51877
    Contextual Info: PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount 156 161 165 166 169


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    prec6835x35 bgac17200c54400+5540-88-084-17-400cusn4pb4zn4mo-052 footprint157 bga socket51877 PDF

    PCT-GF30

    Abstract: precidip C5440 SMD ic catalogue C17200 C54400 60352-5 footprint pga 84 BGA 23X23 0.8 540-88-044
    Contextual Info: PGA / BGA / PLCC SOCKETS PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount


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    pct-gf30precidipc5440smd ic catalogue+6c17200c5440060352-5footprint pga 84bga 23x23 0.8540-88-044 PDF

    Preci-Dip Durtal SA

    Abstract: CH-2800 C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148
    Contextual Info: Quick Selector Chart PGA / BGA / PLCC PGA Grid 2.54 mm BGA Interstitial 1.27 mm Sockets Solder tail 1.27 mm PLCC 1 mm See page 126 131 135 143 Surface mount 126 131 135 136 139 142 Solderless compliant press-fit Carrier Interconnect pin solder tail Interconnect pin


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    ch-2800540-pp-020-24-000-1540-pp-028-24-000-1540-pp-032-24-000-1+13540-pp-044-24-000-1540-pp-052-24-000-1540-pp-068-24-000-1540-pp-084-24-000-1preci-dip durtal sac17200510-91-168-17pga 132 packagingcusn4pb4zn494vo fr4durtalsmd 2.54 90 header514-pp-nnnmxx-xxx148 PDF

    60068-2-14Na

    Abstract: 13x13 C17200 pin grid array ppm IEC, cyclic moisture resistance test 510-PP-NNN-XX-XXX101 17x17 bga thermal resistance
    Contextual Info: PGA / BGA / PLCC GENERAL SPECIFICATIONS WWW.PRECIDIP.COM TEL +41 32 421 04 00 SALES@PRECIDIP.COM The values listed below are general specs applying for Preci-Dip PGA, BGA and PLCC sockets. Please see individual catalog page for additional and product specific technical data.


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    e17444216x1619x1920x20+760068-2-14na13x13c17200pin grid array ppmiec, cyclic moisture resistance test510-pp-nnn-xx-xxx10117x17 bga thermal resistance PDF

    Actel a1280

    Abstract: VKS FPGA CQFP 172 actel 1020 A1020 smd TRANSISTOR 5962-9215601MXA 5962-9096503MTC equivalent transistor A1020 y 7 b Actel A1020 ACTEL A1010 actel 1020 datasheet
    Contextual Info: Military Field Programmable Gate Arrays Features ACT 3 Features • Highly Predictable Performance with 100 Percent Automatic Placement and Routing • Device Sizes from 1200 to 10,000 gates up to 25,000 PLD equivalent gates • Up to 4, Fast, Low-Skew Clock Networks


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    20-pinactel a1280vks fpga cqfp 172actel 1020+7a1020 smd transistor5962-9215601mxa5962-9096503mtcequivalent transistor a1020 y 7 bactel a1020actel a1010actel 1020 datasheet PDF

    XC68307

    Abstract: toshiba Motherboards laptop layout MC68230P XC68834 B47K PPC860 XC68836 XC68040 XCF5102 XPC604
    Contextual Info: High-Performance Internal Product Portfolio Overview Issue 10 Fourth Quarter, 1995 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and


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    mos11mos13br729/dxc68307+9toshiba motherboards laptop layoutmc68230pxc68834b47kppc860xc68836xc68040xcf5102xpc604 PDF

    IPC-D-275 Design standard for Rigid Printed Boards and Rigid Printed Board Assemblies

    Abstract: entek Cu-56 CCGA Kester 953 Flux PEAK TRAY bga IBM ccga 23n50 Cu-56 APD-SBSC-101 T- 200x thinner
    Contextual Info: Ceramic Column Grid Array Assembly and Rework User’s Guide July 25, 2002  Copyright International Business Machines Corporation 2002. Copyright and Disclaimer All Rights Reserved Printed in the United States of America July 25, 2002. The following are trademarks of International Business Machines Corporation in the United States, or other countries, or


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    ipc-d-275 design standard for rigid printed boards and rigid printed board assembliesentek cu-56ccgakester 953 flux+6peak tray bgaibm ccga23n50cu-56apd-sbsc-101t- 200x thinner PDF

    Contextual Info: BALL GRID ARRAYS For 0.8mm Grid Male Pin Adapters & Female Socket Series 5XX • BGA adapter/socket systems are a reliable way to make BGAs pluggable, they may also be used as a high density board-to-board interconnect. • The BGA device is soldered to a 9929


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