PIN GRID ARRAY PPM Search Results
PIN GRID ARRAY PPM Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
---|---|---|---|---|---|
MG80C196KB |
![]() |
80C196KB - Microcontroller, 16-bit, MCS-96, 68-pin Pin Grid Array (PGA) |
![]() |
||
CS-DSDMDB09MF-002.5 |
![]() |
Amphenol CS-DSDMDB09MF-002.5 9-Pin (DB9) Deluxe D-Sub Cable - Copper Shielded - Male / Female 2.5ft | |||
CS-DSDMDB09MM-025 |
![]() |
Amphenol CS-DSDMDB09MM-025 9-Pin (DB9) Deluxe D-Sub Cable - Copper Shielded - Male / Male 25ft | |||
CS-DSDMDB15MM-005 |
![]() |
Amphenol CS-DSDMDB15MM-005 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Male 5ft | |||
CS-DSDMDB25MF-50 |
![]() |
Amphenol CS-DSDMDB25MF-50 25-Pin (DB25) Deluxe D-Sub Cable - Copper Shielded - Male / Female 50ft |
PIN GRID ARRAY PPM Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
---|---|---|---|
Contextual Info: PGA / BGA / PLCC SOCKETS 558-10-NNNMXX-XXX101 PGA 1.27 mm grid, Interconnect pin solder tail SERIES 558 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, interconnect pin. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability |
Original |
558-10-NNNMXX-XXX101 CuZn36Pb3 C36000) 26x26 CH-2800 | |
Contextual Info: PGA / BGA / PLCC SOCKETS 518-77-NNNMXX-XXX106 PGA 1.27 mm grid socket, Surface mount SERIES 518 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability |
Original |
518-77-NNNMXX-XXX106 CuZn36Pb3 C36000) C17200) CH-2800 | |
BGA PACKAGE thermal profile
Abstract: 225-pin BGA X3365 fine BGA thermal profile XC73108 TEXTOOL zif capacitance in BGA package
|
Original |
XC73108. BGA PACKAGE thermal profile 225-pin BGA X3365 fine BGA thermal profile XC73108 TEXTOOL zif capacitance in BGA package | |
Contextual Info: PGA / BGA / PLCC SOCKETS 550-10-NNNMXX-XXX166 BGA 1.27 mm grid, BGA pin-adapter, SMD SERIES 550 Ball grid array adapters, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 New attribute UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life |
Original |
550-10-NNNMXX-XXX166 CuZn36Pb3 C36000) 20x20 514-83-256M20-001148. CH-2800 | |
Contextual Info: PGA / BGA / PLCC SOCKETS 518-77-NNNMXX-XXX105 PGA 1.27 mm grid socket, Solder tail SERIES 518 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, solder tail. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-O |
Original |
518-77-NNNMXX-XXX105 CuZn36Pb3 C36000) C17200) CH-2800 | |
Contextual Info: PGA / BGA / PLCC SOCKETS 550-PP-NNN-XX-XXX135 PGA Interstitial interconnect pin socket, solder tail SERIES 550 Pin grid array sockets with intersitial contact rows, interconnect pin. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability |
Original |
550-PP-NNN-XX-XXX135 PCT-GF30-FR CuZn36Pb3 C36000) 19x19 CH-2800 | |
Contextual Info: PGA / BGA / PLCC SOCKETS 550-PP-NNN-XX-XXX101 PGA Interconnect pin solder tail SERIES 550 Pin grid array sockets, interconnect pin TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life |
Original |
550-PP-NNN-XX-XXX101 PCT-GF30-FR CuZn36Pb3 C36000) 17x17 CH-2800 | |
Contextual Info: PGA / BGA / PLCC SOCKETS 614-PP-NNN-XX-XXX144 PGA Interstitial carrier socket SERIES 614 Pin grid array sockets with intersitial contact rows, carriers with disposable plastic body. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR |
Original |
614-PP-NNN-XX-XXX144 PCT-GF30-FR CuZn36Pb3 C36000) C17200) CH-2800 | |
Contextual Info: PGA / BGA / PLCC SOCKETS 514-PP-NNN-XX-XXX154 PGA Interstitial socket, Surface mount SERIES 514 Pin grid array sockets with interstitial contact rows, surface mount floating contacts. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR |
Original |
514-PP-NNN-XX-XXX154 PCT-GF30-FR CuZn36Pb3 C36000) C17200) CH-2800 | |
Contextual Info: PGA / BGA / PLCC SOCKETS 546-PP-NNN-XX-XXX147 PGA Interstitial socket, Solderless compliant press-fit SERIES 546 Pin grid array sockets with interstitial contact rows, solderless compliant pins. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR |
Original |
546-PP-NNN-XX-XXX147 PCT-GF30-FR C54400) C17200) CH-2800 | |
Contextual Info: PGA / BGA / PLCC SOCKETS 614-PP-NNN-XX-XXX112 PGA Carrier SERIES 614 Pin grid array sockets, carriers with disposable plastic body. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability UL 94V-O Sleeve Brass CuZn36Pb3 C36000 Contact |
Original |
614-PP-NNN-XX-XXX112 PCT-GF30-FR CuZn36Pb3 C36000) C17200) CH-2800 | |
Contextual Info: PGA / BGA / PLCC SOCKETS 517-PP-NNN-XX-XXX111 PGA Interstitial socket, Solder tail SERIES 517 Pin grid array sockets with interstitial contact rows, solder tails. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability UL 94V-O Sleeve |
Original |
517-PP-NNN-XX-XXX111 PCT-GF30-FR CuZn36Pb3 C36000) C17200) CH-2800 | |
Contextual Info: PGA / BGA / PLCC SOCKETS 514-PP-NNN-XX-XXX117 PGA Surface mount SERIES 514 Pin grid array sockets, surface mount with floating contacts. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability UL 94V-O Sleeve Brass CuZn36Pb3 C36000 |
Original |
514-PP-NNN-XX-XXX117 PCT-GF30-FR CuZn36Pb3 C36000) C17200) CH-2800 | |
Contextual Info: PGA / BGA / PLCC SOCKETS 546-PP-NNN-XX-XXX136 PGA Solderless compliant press-fit SERIES 546 Pin grid array sockets, with compliant press-fit terminations. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability UL 94V-O Sleeve Bronze CuSn4Pb4Zn4 C54400 |
Original |
546-PP-NNN-XX-XXX136 PCT-GF30-FR C54400) C17200) CH-2800 | |
|
|||
Contextual Info: PGA / BGA / PLCC SOCKETS 510-PP-NNN-XX-XXX101 PGA Solder tail SERIES 510 Pin grid array sockets, standard solder version. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability UL 94V-O Sleeve Brass CuZn36Pb3 C36000 Contact Clip (6 finger): Beryllium copper (C17200) |
Original |
510-PP-NNN-XX-XXX101 PCT-GF30-FR CuZn36Pb3 C36000) C17200) CH-2800 | |
Contextual Info: PGA / BGA / PLCC SOCKETS 510-PP-NNN-XX-XXX101 PGA Solder tail SERIES 510 Pin grid array sockets, standard solder version. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability UL 94V-O Sleeve Brass CuZn36Pb3 C36000 Contact Clip (6 finger): Beryllium copper (C17200) |
Original |
510-PP-NNN-XX-XXX101 PCT-GF30-FR CuZn36Pb3 C36000) C17200) CH-2800 | |
35x35 bga
Abstract: C17200 C54400 540-88-084-17-400 CuSn4Pb4Zn4 MO-052 footprint 157 BGA socket 51877
|
Original |
PREC68 35x35 bga C17200 C54400 540-88-084-17-400 CuSn4Pb4Zn4 MO-052 footprint 157 BGA socket 51877 | |
PCT-GF30
Abstract: precidip C5440 SMD ic catalogue C17200 C54400 60352-5 footprint pga 84 BGA 23X23 0.8 540-88-044
|
Original |
||
Preci-Dip Durtal SA
Abstract: CH-2800 C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148
|
Original |
CH-2800 540-PP-020-24-000-1 540-PP-028-24-000-1 540-PP-032-24-000-1 540-PP-044-24-000-1 540-PP-052-24-000-1 540-PP-068-24-000-1 540-PP-084-24-000-1 Preci-Dip Durtal SA C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148 | |
60068-2-14Na
Abstract: 13x13 C17200 pin grid array ppm IEC, cyclic moisture resistance test 510-PP-NNN-XX-XXX101 17x17 bga thermal resistance
|
Original |
E174442. 16x16 19x19 20x20 60068-2-14Na 13x13 C17200 pin grid array ppm IEC, cyclic moisture resistance test 510-PP-NNN-XX-XXX101 17x17 bga thermal resistance | |
Actel a1280
Abstract: VKS FPGA CQFP 172 actel 1020 A1020 smd TRANSISTOR 5962-9215601MXA 5962-9096503MTC equivalent transistor A1020 y 7 b Actel A1020 ACTEL A1010 actel 1020 datasheet
|
Original |
20-pin Actel a1280 VKS FPGA CQFP 172 actel 1020 A1020 smd TRANSISTOR 5962-9215601MXA 5962-9096503MTC equivalent transistor A1020 y 7 b Actel A1020 ACTEL A1010 actel 1020 datasheet | |
XC68307
Abstract: toshiba Motherboards laptop layout MC68230P XC68834 B47K PPC860 XC68836 XC68040 XCF5102 XPC604
|
Original |
MOS11 MOS13 BR729/D, XC68307 toshiba Motherboards laptop layout MC68230P XC68834 B47K PPC860 XC68836 XC68040 XCF5102 XPC604 | |
IPC-D-275 Design standard for Rigid Printed Boards and Rigid Printed Board Assemblies
Abstract: entek Cu-56 CCGA Kester 953 Flux PEAK TRAY bga IBM ccga 23n50 Cu-56 APD-SBSC-101 T- 200x thinner
|
Original |
||
Contextual Info: BALL GRID ARRAYS For 0.8mm Grid Male Pin Adapters & Female Socket Series 5XX • BGA adapter/socket systems are a reliable way to make BGAs pluggable, they may also be used as a high density board-to-board interconnect. • The BGA device is soldered to a 9929 |
Original |