PIN GOLD PLATTED Search Results

Contextual Info: Amphenol RF Interconnects MCX 919 Series Materials Electrical Body/Metal parts Contacts Centre MALE Centre FEMALE Insulator Gasket Crimp Ferrules* *Metal finishes Durability – Brass* – *30µ” Gold platted – Brass* – Beryllium Copper* – Teflon – Silicone Rubber

"mini usb connector"

Abstract: AMP connector amphenol usb connector USB connector
Contextual Info: Amphenol Mini USB Connector 1. Material: Contact: Alloy copper Shell: Alloy copper l Insulator: High temperature. Thermoplastic, UL94V-0, 30%glass-filled. 2. Finish : Contact:gold plated at mating area. Gold flash on solder tails. Shell:1.25 micron Matte Tin platted overall.

Contextual Info: document to tho proparty of Ampliami Corporation and b doftared « «•proto eendRfen that It to not to b t d M to td , rtpreducod or uttd, In I t or In part, fer manufactura or «ala by amena othtr than Ami ' " “tout Ha prior eencart, ft that no right it granted to

Contextual Info: 1 2 R EV ISIO N S jondMon S o f f io not to bo dbdoood, raproducod or u n d , tn •hoi* o r In port, fo r monufsoturo o r oolo by onpon* othor than Amptanol Corporation vKhout Ro prior concord ft that no right b granted to dbetaoo or to um ony Information In tht» docunwnt

FTCF

Contextual Info: Thia documwt ta th* proporty of Amptanel Oorporatton and to cMhtrtd on the wpr«M condWan that It b not to bo dtacloaed, raareducod or used, in « M o or In part, for manufactura or oalo by aiyono o m r than Amphonal C w g fo Uon without t e s ter eonoort. It that no right ta gronUd to dtaetoao

Contextual Info: l i ttw proport* ef Amchonol Corporation and t i d d M u d e tho «p raM eondMan that R k not to Im d M o M d , reproduced or uMd. «tato or in port, for monufoctur* or «oto by « q n n * ottwr tl . CwiMMuliun without 111 prior concert, A that no right It granted to d

Contextual Info: MODULAR JACK CONNECTORS MAXCONN A MEMBER OF THE ERNI GROUP MJH-R Series Single Cavity, Standard Height, Non-Shielded, Shielded Performance Specifications Materials and Finish Housing: Glass filled poyester, Zytel FR50, UL 94V-0 rated, black Contacts: 0.45mm Phosphor bronze, gold plated round wire

sd card Amphenol

Contextual Info: Thto doeuriMnt to tho prnearty of Amptanol Corporation and to ctaMwnd a th* w p r m condWen that It to m. wholo or In part for manufacture 1 R EV ISIO N S SYM UformotloflTn thto d ECN HK4434 A CUSTOMER DRAWING DESCRIPTION 1,30 1,20 0,70 , DATE RELEASE TO CUSTOMER

zytel fr50

Contextual Info: MODULAR JACK CONNECTORS MAXCONN MJH-R Series Single Cavity, Standard Height, Non-Shielded, Shielded Performance Specifications Materials and Finish Housing: Glass filled poyester, Zytel FR50, UL 94V-0 rated, black Contacts: 0.45mm Phosphor bronze, gold plated round wire

Contextual Info: TM» dooumont k tho bproMrhr of Amphonol Corporation and te < . aw l K It not to to dtacloeod, npraduced whoto or In part, tar manutactura or oab ty anyono othar than CwuMulIun without to prior concert, ft that no right h granted to or to u m any Information In thto dot

S-SN-002

Abstract: ut04 DAT20
Contextual Info: Thto dooumont to th* property of Amphtnol Corporation and to W h w aJ on . that it to not to ba dtodoMd, naraduaad or und, In whoto or in part, for manufacture or aato by anjwna othar than Amphtnal CwuuuUun without Ito prior conew t A th at no right to granted to dtodoa*

6P1P

Abstract: WP 9P pin gold platted sd card Amphenol
Contextual Info: Thb docurrwnt to ttw praparhr of . . . . . _ . fiw t H to not to b# dtoeteaad. reproduced « M a or In part, for manufactura or aoto by anyone' other • than Corporation atthaut Ito prior concert, ft that no right to granted to dtadoee or to u m any informât*» In tNa document

trw RF POWER TRANSISTOR

Abstract: trw rf transistor trw transistors LT 9228 trw 131* RF POWER TRANSISTOR trw rf semiconductors 2023-12 TRW 52604 TP 9382 trw hybrid
Contextual Info: TR W RF SEMICONDUCTORS CATALOG 1981 EUROPEAN EDITION TABLE OF CONTENTS Pages • • • • INTRODUCTION. Q U A LITY .

mc4 connector

Abstract: sd card Amphenol
Contextual Info: Ulto document h Ih* property of Amahonal Corporation and to dtfwwd a tiw «9KM eondHen thottt to not te bo dtoeloMd. raproduood „ - «twto or in part tar manufactura ra or M w it to jjy by a anyav nyav ca n r than Corporation «Mtout Ha prior eoncart, A that no right to granted to

Contextual Info: 8 7 6 4 5 3 2 1 REVISIONS THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF L-COM, INC. ANY REPRODUCTION IN PART OR WHOLE WITHOUT THE WRITTEN PERMISSION OF L-COM, INC. IS PROHIBITED. REV 1.55 D DESCRIPTION DATE APPROVED A APPROVED FOR PRODUCTION

SFP Connectors and Cages

Abstract: SFP CONNECTOR SMT CONNECTOR UL 94v-0 board XSFP-N-SSM0-2002
Contextual Info: C O N NE C T O R F E AT U RE S 20-Position SFP SMT Connector All cages are compatible with XSFP Surface Mount Connectors Made of UL 94V-0 high temperature thermoplastic XSFP SFP Surface Mount Connectors The XSFP-N-SSM0-2002 is a SMT SFP connector which is manufactured in compliance with the

PB001

Contextual Info: 2 Urto document It tho ETPL' 1 < and b doftorad o REVISIONS •holt or in part fo r manufactura or oalo by anyono Corporation without Ha prior concort, ft that no right b granted to dtadooo or to y » any WWmaWon In W » docMBWWt _ SYM A CUSTOMER DRAWING

smd diode code 33-16

Abstract: transistor smd code marking 431 UT025RHD20 ut025rhd qml-38535 transistor smd marking 431 RAD SMD MARKING CODE
Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Add total dose rate for design dependent in 1.5 Radiation features. - phn 05-11-01 Thomas M. Hess B Change footnote 7/ on table I. Correct the wording “Accelerated annealing testing” in section 4.4.4.1.1 for RHA device testing. - phn

6N134

Abstract: HP optocoupler
Contextual Info: Whpì mL'fimHEWLETT P A CK AR D Dual Channel High CMR High Speed Hermetically Sealed Optocouplers Technical Data Level B testing 6N134/883B or Each channel contains a GaAsP from the DESC Drawing 81028 light emitting diode which is as (8102801EC). All three

Contextual Info: Preliminary Product Specification Data Sheet Product: MicroRAM Output Ripple Attenuation Module Model Numbers: µRAM2xxx 20 Amp µRAM3xxx (30 Amp) Patents Pending Features • • • • • • • • >40dB ripple attenuation from 60Hz to 1MHz Integrated OR’ing diode supports N+1 redundancy

Contextual Info: Preliminary Product Specification Data Sheet Product: MicroRAM Output Ripple Attenuation Module Model Numbers: µRAM2xxx 20 Amp µRAM3xxx (30 Amp) Patents Pending Features • • • • • • • • >40dB ripple attenuation from 60Hz to 1MHz Integrated OR’ing diode supports N+1 redundancy

Contextual Info: PRELIMINARY 45 Features Data Sheet MicroRAM TM Output Ripple Attenuation Module • >40dB ripple attenuation from 60Hz to 1MHz • Integrated OR’ing diode supports N+1 redundancy • Significantly improves load transient response • Efficiency up to 98%

Contextual Info: PRELIMINARY 45 Features Data Sheet MicroRAM TM Output Ripple Attenuation Module • >40dB ripple attenuation from 60Hz to 1MHz • Integrated OR’ing diode supports N+1 redundancy • Significantly improves load transient response • Efficiency up to 98%

245481

Abstract: relais STPI 245482 245.481 schema power double 300 cenelec relay relais 5 pins va 245 schema led table relay 220v 4 contact
Contextual Info: RELAIS INSTANTANÉ INSTANTANEOUS RELAY SÉRIE 245 4 RT - 4 PU T CARACTÉRISTIQUES GÉNÉRALES GENERAL CHARACTERISTICS Intensité nominale suivant le type 3 ou 5 A Endurance mécanique 30.106 manoeuvres Tension nominale d'isolement 250 V Rigidité diélectrique entre :