PIN CONFIGURATION IC 8203 IC Search Results

D8202A

Abstract: intel 8288 intel 8202 8203 8085A L8202A intel 2116 Intel 2164 8202 intel 8202A
Contextual Info: in t e i APPLICATION NOTE AP-97A Aprii 1982 6-1 ORDER NUMBER: 2103S»001 AP-97A INTRODUCTION Table 1. Comparison of Intel Static and Dynamic RAMs Introduced during 1981 T he designer o f a m icroprocessor-based system has two basic types o f devices available to im plem ent a ran d o m

lt 8202

Abstract: 1/DIODE lt 8202 DAPC M8203 ip52 61P52
Contextual Info: SM 8202/SM 8203 8-B it Microcomputer VCR System Controller SM8202/SM8203 • (VCR System Controller) Description T h e S M 8 2 0 2 / S M 8 2 0 3 is an 8 ~ b it m ic ro c o m p u ­ t e r w h ic h in te g r a t e s an 8 ~ b it CPU core, a ROM, a RAM, s e r ia l I / O p o rts , a tim er, a n A / D c o n v e r t e r

INTEL 2118 DRAM

Abstract: intel 8288 bus controller intel 8203 Intel AP-75 2118 16k intel 8288 INTEL application notes Intel AP-92A Intel 2118 crt terminal interfacing in 8086
Contextual Info: APPLICATION NOTE AP-133 Aprii 1982 V * * < # v <5 V INTELCORPORATION, 1982 y s ¿ ss r O rd*r Number: 210431-001 3-70 PREFACE This application note has been developed to provide the m em ory system designer with a detailed description o f m icroprocessor m emory system design using Intel

2164 dynamic ram

Abstract: 8203 diagram of IC 8203 pin diagram of intel IC 8203 pin diagram of 18 pin IC 8203 pin configuration IC 8203 ic intel 8203 pin diagram of RAM IC 8203 8202a intel microprocessor pin diagram pin diagram of 8203
Contextual Info: inteT 8203 64K DYNAMIC RAM CONTROLLER • Provides All Signals Necessary to Control 64K 2164 and 16K (2117,2118) Dynamic Memories ■ Fully Compatible with Intel 8080A , 8085A, iAPX 88, and iAPX 86 Family Micro­ processors ■ Directly Addresses and Drives Up to 64

diagram of IC 8203

Abstract: 2164 dynamic ram intel 8203 memory ic 2118
Contextual Info: intei 8203 64K DYNAMIC RAM CONTROLLER • Provides All Signals Necessary to Control 64K 2164 and 16K (2117, 2118) Dynamic Memories ■ Fully Com patible with Intel 8080A, 8085A, iAPX 88, and iAPX 86 Family Micro­ processors ■ Directly Addresses and Drives Up to 64

ic 7483 BCD adder

Abstract: 9N01 ic 7483 full adder IC 7490 pin configuration function of ic 7490 9N03 7401 ic configuration TIC 8213 pin configuration of ic 7492 Fairchild 9311
Contextual Info: SELECTOR GUIDE/FUNCTIONAL INDEX MSI ARITHMETIC OPERATORS ADDERS, A.L.U.'S, COMPARATORS, MULTIPLIERS Type No. Function Number of Bits Description t pd Power Dissipation Page No ns mW A d d itio n 9380 9304 93H183 9382 9383 Single 1-B it Full Adder Dual 1-B it Full Adder

power supply 5 Volt

Abstract: LF9502 32 bit barrel shifter circuit diagram using mux 77346 LT4420 LF3304 lf3370 LMU08 functional diagram of basic ALU using mux LF3312
Contextual Info: LOGIC Devices Incorporated Providing Chip Solutions Product Guide June 2001 www.logicdevices.com LOGIC DEVICES INCORPORATED DEVELOPS AND MARKETS HIGH PERFORMANCE INTEGRATED CIRCUITS THAT ARE UTILIZED IN A WIDE RANGE OF VIDEO AND MEDICAL IMAGE PROCESSING, TELECOMMUNICATIONS, COMPUTING, AND MILITARY

intel 8288

Abstract: 8203 intel dram 2164 8203A
Contextual Info: intei ARTICLE REPRINT AR-197 JANUARY, 1982 e < $ c p < A <F ? * <f/ C opyright b y C om puter D e sig n PubJtshmg Co. C January, 1962 All Righ ts R e se rve d Reprinted b y Perm ission <C - V 3-176 ORDER N UM BER: 210378 BETTER PROCESSOR PERFORMANCE VIA GLOBAL MEMORY

Contextual Info: Advance Data Sheet March 1994 m A T& T ^ ^ ^ M ic ro e le c tro n ic s JC100-Series Power Modules: 18 Vdc to 36 Vdc Input; 100 W Features • Small size: 2.40 in. x 2.28 in. x 0.50 in. ■ High power density 37 W/in.3 ■ High efficiency: 84% typical ■ Low output noise

Contextual Info: s AT&T Advance Data Sheet July 1994 ; ’^ ^ ^ M ic ro e le c tro n ic s FW300-Series Power Modules: 36 Vdc to 75 Vdc Input; 300 W Features • Size: 2.40 in. x 4.60 in. x 0.5 in. ■ Operating case temperature range: -4 0 °C t o +100 °C ■ Remote sense

MM8203

Abstract: SOIC 8 pin package D22A1
Contextual Info: CMOS Oscillator MM8203 PRELIMINARY DATA SHEET General Desription Features Using the IDT CMOS Oscillator technology, originally developed by Mobius Microsystems, the MM8203 replaces quartz crystal based resonators and oscillators with a monolithic CMOS IC at the thinnest

Contextual Info: Advance Data Sheet September 1994 : js A T & T '^ ^ ^ 'M ic ro e lec tro n ic s FC250-Series Power Modules: 18 Vdc to 36 Vdc Input: 250 W Features • Size: 2.40 in. x 4.60 in. x 0.5 in. ■ Operating case temperature range: -4 0 °C to +90 °C ■ Remote sense

FC250A

Abstract: FC250B FC250C FC250F
Contextual Info: Advance Data Sheet September 1994 : js A T & T '^ ^ ^ 'M ic ro e lec tro n ic s FC250-Series Power Modules: 18 Vdc to 36 Vdc Input: 250 W Features • Size: 2.40 in. x 4.60 in. x 0.5 in. ■ Operating case temperature range: -4 0 °C to +90 °C ■ Remote sense

MM8203

Contextual Info: CMOS Oscillator MM8203 PRELIMINARY DATA SHEET General Desription Features Using the IDT CMOS Oscillator technology, originally developed by Mobius Microsystems, the MM8203 replaces quartz crystal based resonators and oscillators with a monolithic CMOS IC at the thinnest

MM8203

Abstract: diagram of IC 8203 350um
Contextual Info: CMOS Oscillator MM8203 PRELIMINARY DATA SHEET General Desription Features Using the IDT CMOS Oscillator technology, originally developed by Mobius Microsystems, the MM8203 replaces quartz crystal based resonators and oscillators with a monolithic CMOS IC at the thinnest

pin diagram of 18 pin IC 8203

Abstract: FC250C1
Contextual Info: Advance Data Sheet December 1996 m ic ro e le c tr o n ic s group Lucent Technologies Bell Labs Innovations FC250-Series Power Modules: 18 Vdc to 36 Vdc Input; 250 W Features • Size: 61.0 mm 2.40 in. x 116.8 mm (4.60 in.) x 13.5 mm (0.5 in.) ■ Operating case temperature range:

lucent DC-DC POWER MODULE fc250

Contextual Info: Advance Data Sheet December 1996 m i c r o e le c t r o n ic s group Lucent Technologies B ell L ab s In n o v a tio n s FC250-Series Power Modules: 18 Vdc to 36 Vdc Input; 250 W Features • Size: 61.0 mm 2.40 in. x 116.8 mm (4.60 in.) x 13.5 mm (0.5 in.)

MK4027

Abstract: wenf 4027 ram IM7027 IM7027-1CJE K4027 MK4027P-3 MK4027P-4
Contextual Info: IM 7027/M K4027 D y n a m ic RAM 4 0 9 6 B it 4 K x 1 DMÜ^OIL FEA T U R ES G E N E R A L D ESCRIPTIO N • • • • • T h e IM 7 0 2 7 is a 4 0 9 6 X 1 b it d yn a m ic random access m em ory w h ich is packaged in 16 pin D IP . T h e cell a rra y is organized

Contextual Info: LAT T IC E S E M I C O N D U C T O R bflE D • 5 3 0 ^ 4 = ] DDDSTtiM 177 « L A T GAL6002 Lattice High Performance E2CMOS FPLA Generic Array Logic FEATURES FUNCTIONAL BLOCK DIAGRAM • HIGH PERFORMANCE EJCMOS* TECHNOLOGY — 15ns Maximum Propagation Delay

infineon sp35

Abstract: KP12x TLE4990 Programming Guide TLE4927 TLE4941-1C TLE5010 KTY temperature sensor TLE4941C TLE4942-1C TPMS MEMS BASED PRESSURE SENSORS
Contextual Info: Magnetic Sensors–Temperature Sensors–Pressure Sensor ICs–Wireless Control ICs Sharpen Your Senses Sense & Control The Smart Choice in Automotive Sensors www.infineon.com/sensors T H I S B R O C H U R E L O O K S in brief at several areas where Infineon delivers

Contextual Info: Advance Data Sheet February 1995 ; mAT&T Microelectronics Economy Series JW050A1-E, JW075A1-E Power Modules: dc-dc Converters; 36 Vdc to 72 Vdc Input; 50 W to 75 W Features • Small size: 2.40 in. x 2.28 in. x 0.50 in. ■ High power density ■ High efficiency: 83% typical

GAL6001-30P

Abstract: ic 8155 block diagram GAL6001-30J
Contextual Info: Lattice GAL6002B High Performance E2CMOS FPLA Generic Array Logic FUNCTIONAL BLOCK DIAGRAM FEATURES • HIGH PERFORMANCE E*CMOS* TECHNOLOGY — 15ns Maximum Propagation Delay — 75MHz Maximum Frequency — 6.5ns Max. Clock to Output Delay — TTL Compatible 16mA Outputs

Contextual Info: L A T T IC E S E M I C O N D U C T O R L a • bfiE » ■ SaflbTMI 0 Ü Q2 T4 7 GTÖ t t i H R I H W G A L 6 0 0 1 W Uink D arfAm aniui C2^MrkC CDI A High Performance E2CMOS FPLA Generic Array Logic FUNCTIONAL BLOCK DIAGRAM FEATURES • HIGH PERFORMANCE E2CMOS TECHNOLOGY

Contextual Info: GAL6001 Lattice High Performance E2CMOS FPLA Generic Array Logic Semiconductor • ■ ■ ■ Corporation FEATURES FUNCTIONAL BLOCK DIAGRAM • HIGH PERFORMANCE E2CMOS TECHNOLOG Y — 30ns Maxim um Propagation Delay — 27MHz Maxim um Frequency — 12ns Maxim um Clock to Output Delay