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68031-401HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 1 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail. |
PDF
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10131319-222220ULF
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Amphenol Communications Solutions
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Minitek®Pwr 4.2 High Current Connector System, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin plating, Black Color, 22 Positions, Non GW Compatible LCP, Tape and Reel without cap. |
PDF
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10131319-22222G0LF
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Amphenol Communications Solutions
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Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Black Color, 22 Positions, LCP, GW Compatible, Tray Packing. |
PDF
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68022-222HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 22 Positions, 2.54 mm (0.100in)Pitch. |
PDF
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10131319-2222200LF
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Amphenol Communications Solutions
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Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Black Color, 22 Positions, LCP, Non GW Compatible, Tray Packing. |
PDF
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