PCN0515
Abstract: sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC
Contextual Info: PROCESS CHANGE NOTIFICATION PCN0515 MOLD COMPOUND CHANGE FOR FBGA PACKAGES Change Description: Altera is adopting the Sumitomo G770 series mold compound as the standard mold material on Altera FineLine BGA® FBGA device packages. Devices in FBGA packages currently
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pcn0515hc-100ul-941x1011+9sumitomo g770g770* sumitomog770 mold compoundg770 sumitomounbiased hast 130, 85 rh, 100 hrsg770g770* g770 mold compound sumitomo 1000thermal conductivity of sumitomo g770g770 hc
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