PCB WARPAGE SPEC Search Results

LGA 1207 socket F

Abstract: pcb warpage after reflow pcb warpage* in smt reflow amd socket 1207 MMC socket Socket-F Tyco LGA 1207 socket F datasheet SN63 PB37 THERMO PROFILES transistor 1207 PEAK tray drawing
Contextual Info: SOCKET F 1207 Application Specification 114-5383 7 MAY ‘07 Rev.C 1. INTRODUCTION This specification covers the requirements for application of lever-actuated Socket F 1207 position onto printed circuit (pc) boards. These sockets accept 1207-position LGA package

DNP1105W

Abstract: pcb warpage DNP1102F PS1191RA LED Tr 1105W AN1101W AN1102F ps1101wa AN1105W
Contextual Info: SMT SHAPE - INFRARED LED n Infrared LED Shape Part No. Ta=25°C Features Peak Wavelength lP TYP. IF Radiant Intensity IE MIN. TYP. IF Output Power Po Cut-Off Frequency Fc TYP. MIN. TYP. IF Spatial Distribution The typical distribution example of each shape is shown below

TRANSISTOR DNH

Abstract: PS5022 PS1191RA PP1101W PS1101RA PS1101WA PS1102HA PS1192FA PS1192HA peak spectral response 900 nm photo detector
Contextual Info: CHARACTERISTICS AND ABSOLUTE MAXIMUM RATING BY MATERIAL n Photo Transistor Through-Hole Shape Absolute Maximum Ratings Collector-Emitter Emitter-Collector Breakdown Collector Breakdown Collector Operating Voltage Dissipation Voltage Current Temp. Part Number

LGA1366

Abstract: 1981467-1 LGA-1366 LGA rework Socket 1366 reflow profiles MMC socket socket LGA 1366 PEAK tray drawing X-1981837-X pcb warpage* in smt reflow
Contextual Info: Lever Actuated Land Grid Array LGA1366 Socket Application Specification 114-5432 24 Sep ’08 Rev.A 1. INTRODUCTION This specification covers the requirements for application of lever-actuated LGA1366 Socket position onto printed circuit board PCB . The socket accepts 1366-position LGA

DIODE PP602

Abstract: pp602 PP701 pp601 40 PP601 PP1101W PS1101RA PS1101WA PS1102HA PS1191RA
Contextual Info: CHARACTERISTICS AND ABSOLUTE MAXIMUM RATING BY MATERIAL n Photo Transistor Through-Hole Shape Absolute Maximum Ratings Collector-Emitter Emitter-Collector Breakdown Collector Breakdown Collector Operating Voltage Dissipation Voltage Current Temp. Part Number

Lead Free reflow soldering profile BGA

Abstract: XAPP425 C-150 reflow temperature bga reflow soldering profile BGA BGA PROFILING BGA PACKAGE thermal profile
Contextual Info: Application Note: Packaging R Optimizing Solder Reflow Process for Xilinx BGA Packages XAPP425 v1.0 December 9, 2002 Summary The primary purpose of solder reflow process is to wet the surfaces to be joined to form a strong metallurgical bond between the component and the PC board.

WS609

Abstract: BGA heatsink compressive force solder paste alpha WS609 pcb warpage after reflow BGA PROFILING XAPP426 Alpha WS609 Alpha WS609 solder C-145 FF1152
Contextual Info: Application Note: Packaging R Implementing Xilinx Flip-Chip BGA Packages XAPP426 v1.3 March 3, 2006 Summary Xilinx flip-chip BGA package is offered for Xilinx high-performance FPGA products. Unlike traditional packaging in which the die is attached to the substrate face up and the connection is

MOLEX 24 pin right angle connector

Abstract: right angle 20 pin pcb header connector Molex 87667 right angle 40 pin male connector
Contextual Info: PowerPlus SSI Expandable Power & Signal PowerPlusTM (SSI) Expandable Power & Signal Connectors INTRODUCTION Molex’s successfully introduced a new series of power connectors that conform to Server System Infrastructure (SSI) open specification (http://www.ssiforum.org). The DPS and MPS offer a standard

pcb warpage in ipc standard

Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
Contextual Info: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)

80021

Abstract: 100C Sirenza AN-21
Contextual Info: APPLICATION NOTE-AN054 Detailed Installation Instructions for Power Modules Introduction This document provides useful guidance on the installation of the Sirenza Microdevices’ SDM series of LDMOS high power amplifier modules. Mechanical Considerations

iso 7810 warpage

Abstract: iso 7810 LTL2651 connector pcb mounted strain smart AMP Micro-MaTch Miniature Connector Tyco Electronics IDC
Contextual Info: 108 – 15238 Product Specification 21/FEB/05 Rev. C Smart Card Connectors, Top Mount “The product may not perform according to the product specification if precautions have not been taken in the application to provide mechanical stability of the connector in relation to its mating parts”.

Intel reflow soldering profile BGA

Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
Contextual Info: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems

Contextual Info: Application Note December 1999 JAHW-S-Series Surface-Mount Power Modules WARNING: This application note is intended to provide the user with the best information to date regarding the end application PCB mounting and assembly process of Lucent JAHW-S Surface-Mountable modules. It reflects the known considerations of Surface-Mount Technology based on the testing of a limited number of samples and applications. Users are

Contextual Info: Circular Connectors 1.27mm pitch 8 byte DIMM socket SX4 Series Features Coaxial Connectors Rectangular Connectors ● Compliant with “8Byte DIMM” standardized at JEDEC. ● The applicable module board is a 1.27mm pitch 168 pins type for doublesided connection.

iso 7810

Abstract: IEC 60512-1 iso 7810 warpage
Contextual Info: 108 – 15202 Product Specification 09/JUL/09 Rev. D SMART CARD READER SINGLE THICKNESS THRU HOLE “The product may not perform according to the product specification if precautions have not been taken in the application to provide mechanical stability of the connector in relation to its mating parts”.

TB389

Abstract: dap 6a DAP 015 DAP 08 MO-229
Contextual Info: Plastic Packages for Integrated Circuits Ultra Thin Dual Flat No-Lead Plastic Package UTDFN A A E 6 B 6 LEAD ULTRA THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE 4 MILLIMETERS D PIN 1 REFERENCE 2X 0.15 C 1 2X L6.1.6x1.6A 3 MIN NOMINAL MAX NOTES A 0.45 0.50 0.55

Contextual Info: ACACONNECTOR Board-to-wire Features ●High Soldering Quality by Auto Coplanarity Technology ¡Auto Coplanarity Technology *1 achieves stable mounting to PCB. ¡Self Alignment Effects(*2) enable soldering parts to perform better. ●Terminal Construction

Contextual Info: ACACONNECTOR Board-to-wire Features ●High Soldering Quality by Auto Coplanarity Technology ¡Auto Coplanarity Technology *1 achieves stable mounting to PCB. ¡Self Alignment Effects(*2) enable soldering parts to perform better. ●Terminal Construction

Contextual Info: m o le x DIN 41612/IEC 603-2 C-PIN C-PIN PRESS-FIT CONTACT Press-fit technology was originally introduced to allow makers of multi-layer back panels a way to interconnect multiple connectors without wave soldering. Various designs have been developed to provide a reliable, gas-tight contact to work with

Senju M705-GRN360-K2-V

Abstract: Senju M705-GRN360-K2-V solder paste solder paste M705-GRN360-K2-V Senju oz 221 pcb warpage after reflow M705-GRN360 senju M705-GRN360-K2 fh4219
Contextual Info: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. 0.3 mm Pitch, 0.65 mm above the board, Top Contact, Back-Flip actuator Flexible Printed Circuit ZIF Connectors

KJR9022E

Abstract: KJR4013E GTO thyristor driver KJR651 KJR9061E silicone low volatile potting G1821 KJR-9010E KJR651E KJR9060E
Contextual Info: Shin-Etsu Liquid Coating Materials for Electronic Devices KJR Series Junction Coating Resins Liquid Type Silicone & Polyimide Silicone for Electronic, Electric and Optical Devices Main Features ●Ultra High Purity ●High Thermal Stability ●High Electrical Stability

heller 1700

Abstract: BGA reflow guide reflow hot air BGA BGA PACKAGE thermal profile pcb warpage after reflow BGA Solder Ball collapse
Contextual Info: APPLICATION NOTE Mobile Pentium II Processor Mini-Cartridge 240-Pin BGA Connector Assembly Development Guide April 1998 Order Number: 243759-001 Mobile Pentium ® II Processor Mini-Cartridge 240-Pin BGA Connector Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any

Contextual Info: Multilayer Organic MLOTM 0805 WLAN/BT Diplexer MLOTM TECHNOLOGY APPLICATIONS The 0805 MLO diplexer is best in class low profile multilayer organic passive device that is based on AVX’s patented multilayer organic high density interconnect technology. The

Contextual Info: Multilayer Organic MLOTM 0805 WLAN/BT Diplexer MLOTM TECHNOLOGY APPLICATIONS The 0805 MLO diplexer is best in class low profile multilayer organic passive device that is based on AVX’s patented multilayer organic high density interconnect technology. The