PCB DIMENSION OF SMA Search Results

846 g dpdt pushbutton panel

Abstract: AT4170 UB215 UB2-15
Contextual Info: Low Profile Pushbuttons Series UB2 Distinctive Characteristics Combination of PCB mountability and short body allows use in compact applications. Small behind panel dimension for snap-in mounting in tight spaces. Snap-acting contact mechanism provides sensitive actuation

land pattern ssop28

Abstract: SO18W IPC-SM-782 SSOP-20 land pattern so18w SSOP20 LAND PATTERN
Contextual Info: SOLDER PAD RECOMMENDATIONS FOR SURFACE-MOUNT DEVICES By Wm. P. Klein, P.E. Factors to consider when determining the dimensions of the solder pads include part dimension tolerances, PCB production tolerances, and accuracy-of-placement tolerances. Figure 2 shows how placement accuracy can affect solder

CRS5001-4401F

Abstract: CRC9001-6701F CRS5001 CRC9
Contextual Info: RF Coaxial Connectors RF Coaxial Connectors with Switch SMT , TS-11 Series <6GHz> ● Receptacle CRS5001-4401F 2.4 2.4 0.95 (1.1MAX.) 0.4 • P.C. Board Dimension 1.35 ■ Specification Grouhd(shell) Nornal close contact Prohibition area of PCB pattern 0.75

C3600 brass

Contextual Info: JBX Series Key features JBX Series • Mechanically keyed : ensures correct polarisation and alignment. • Contact layouts from 2 to 30 contacts. • Wire gauges range from 30 AWG to 12 AWG. • High contact density in a small space. • Contact termination in either crimp, solder or PCB

a7m-1 omron

Abstract: Omron A7M A7MA-106 A7MA-106-P2 A7MA-107 A7MA-107-P2 A7MA-206 A7MA-206-1 A7MA-206-P2 A7MD-106-P-09
Contextual Info: Thumbwheel Switch A7MD/A7MA Refer to Warranty and Application Considerations page 1 and Safety Precautions (page 3). Ultra-small Thumbwheel-operated Switches • High reliability achieved with gold contacts. • Select from screw mounting or snap-in mounting as the

EPF10K50E

Contextual Info: Designing with FineLine BGA Packages November 1999, ver. 1.03 Introduction Application Note 114 6 As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues to grow. Ball-grid array (BGA) packages are an ideal solution because the

bandit TIE-DEX

Abstract: NEM-QTSB-67PGNS-B
Contextual Info: Cannon Cover headline Cover headline Nemesis Series 2 Nemesis Series By choosing the Nemesis range you will be reassured you are working with a partner who has more than 90 years of experience of connector design and manufacturing excellence. The Nemesis range is the most comprehensive small plan

EPF10K50E

Abstract: BGA and QFP Package mounting
Contextual Info: Designing with FineLine BGA Packages August 2001, ver. 1.1 Introduction Application Note 114 6 As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues to grow. Ball-grid array (BGA) packages are an ideal solution because the

Contextual Info: DATA SHEET WIRELESS COMPONENTS PCB type antenna ANTX200P001B24003 Product Specification – January 29, 2013 V.0 2.45 GHz Product specification Wireless Components FEATURES & BENEFITS  The smallest PCB antenna in the market  Miniature design allows users

micro fineline BGA

Abstract: Epoxy, glass laminate EPC16U88
Contextual Info: Designing With Fineline BGA Packages for APEX, FLEX, ACEX, MAX 7000 & MAX 3000 Devices Application Note 114 October 2005, ver. 3.0 Introduction As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues

Contextual Info: DATA SHEET WIRELESS COMPONENTS PCB type antenna ANTX100P001B24553 Product Specification – May 31, 2013 V.0 2.40 ~ 2.50GHZ / 5.150 ~ 5.875 GHZ Product specification Wireless Components FEATURES & BENEFITS  The smallest PCB antenna in the market  Miniature design allows users

TT6P3-0860T

Abstract: SMT GPS band stop filter 1030 mhz filter D9000
Contextual Info: DATA SHEET Introduction and Applications for Ceramic Band Pass Filters Features High Q ceramic Rugged ● Temperature compensated ● Custom designs ● Available lead Pb -free, RoHS-compliant, and Green ● ● Benefits Low insertion loss Small compact design

SMD MARKING code 3G

Abstract: SMD MARKING CODE 501 LDH33A252B CG01-J LDH25A302L LDH33 A2 SMD CODE MARKING smd diode code B2 smd mark code Transistors smd mark code
Contextual Info: MULTILAYER DEVICES DELAY LINES, CHIP MULTILAYER WIRELESS BASE STATION LDH Series This delay line has been developed by utilizing advanced multilayer technology. It is comprised of a copper line and temperature compensated dielectric NPO 0 ± 60ppm/°C and includes a metal shield. This results in a very small

T2140

Abstract: SMT GPS band stop filter R3575 TT6P10-R1950-T2140 TT6P4-0770P0-1240 coaxial resonator, skyworks TT6P5-0765P0-11225 TT4P4-R1227.6-T1575.42 TT8N4-0840P0-0440 1575.42 resonator trans-tech
Contextual Info: DATA SHEET Introduction and Applications for Ceramic Band Pass Filters Features High Q ceramic Rugged ● Temperature compensated ● Custom designs ● ● Benefits Low insertion loss Small compact design ● Frequency stability ● Mechanical stability ●

Contextual Info: Designing With High-Density BGA Packages for Altera Devices Application Note 114 January 2014, ver. 5.2 Introduction As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues

GSM11-11

Abstract: c4381 CECC00802 CCM04-5111 CCM04-5112 CCM04-5116 CCM04-5137 iso 7816-2 r192
Contextual Info: CCM04 MK III Miniature Connectors Introducing a new range of CCM04 connectors designed to interface with either full or SIM/SAM smart cards and designed to minimize space usage on the PCB . Features • Available with 6 or 8 contacts. • The contact area is spooned to reduce

Contextual Info: \ 11 _ 12 J | 10 | 9 | 8 | | 7 6 | 5 | 4 | 3 | 2 74441 SALES ASSEMBLY DRAWINGS FOR SMALL FORM-FACTOR AND Z AXIS PLUGGABLE CONNECTORS CKT SIZE 20 PART NUMBER 74 441-0001 7 4 4 4 1 -0 0 0 4 74441-001 0 74441-001 4 74441-002 1 74441-003 1 7 4 4 4 1 -0 0 0 7

Contextual Info: Surface Mount Detection Switch D3SH The smallest detection switch in the world. OMRON’s data as of June 2006. • Ultra small size and ultra low profile contributing to down-sizing of sets devices. (3.0 x 3.4 x 0.9 mm (W x D x H) • A unique mechanism enables high contact reliability and

G8FE-1Af

Abstract: G8FE-1AP g8fe-1ap-l G8FE under frequency relay relay 15A 125 v
Contextual Info: G8FE Automotive PCB relay Power Small but double terminal design achieved 15A current-carrying.(High heat resistance) (Surface mount type is available) • Small size and high heat resistance enable its use in engine room. • Can be used for module design (SJB) as a replacement for existing plug-in relay.

Contextual Info: Freescale Semiconductor Application Note AN2409 Rev. 2.0, 4/2013 Small Outline Integrated Circuit Fine Pitch Package SOIC 1.0 Purpose This Application Note provides general package information including package dimensions, guidelines for printed circuit board (PCB) layout,

DO-214A sma

Abstract: CD1005-S01575 CD214A-B320 B360 schottky barrier B140L D 214A CD0603-S01575 CD0603-S0180 CD0603-S0180R CD0805-S01575 CD0805-S0180
Contextual Info: Bourns Chip Diode Short Form Catalog Reliable Electronic Solutions Small Signal Switching Diodes Selection Guide Application Size Part No Features Applications • Leadless • Lead free • High-speed • Desktop PCs & Notebooks • PDAs • Cellular Phones

Contextual Info: OBSOLETE PRODUCT HMC224MS8 / 224MS8E v02.0805 SWITCHES - SPDT T/R - SMT GaAs MMIC T/R SWITCH 5 - 6 MHz Typical Applications Features The HMC224MS8 / HMC224MS8E is ideal for: Low Cost 5-6 GHz Switch • UNII & HiperLAN Ultra Small Package: MSOP8 • PCMCIA WirelessLAN

Contextual Info: Data Sheet FUJITSU Component Connector FCN-118X FUJITSU Component Connector FCN-118X series Grounding Springs Fujitsu grounding springs for mobile devices Overview Fujitsu Components' grounding spring FCN-118X provides secure frame grounding between pc board and frame of smart phones. Its unique side-wing structure increases

G8FE-1AP

Abstract: G8FE-1AP-L G8FE G8FE relay g8fe-1af omron g8fe Double contact automotive relay MARK S2 G8FE 1AP
Contextual Info: G8FE Small PCB relay for automobile use high-wattage Available surface-mount Double terminal improves solder reliability • Capable of usage in an engine compartment due to small size, high wattage, and high heat resistance. • Good for module design as a replacement for a