PCB BOARD 0.035MM Search Results

transmission lines Twisted Pair spice model

Abstract: APP4168 AN4168
Contextual Info: Maxim > App Notes > AUTOMATIC TEST EQUIPMENT ATE HIGH-SPEED INTERCONNECT Keywords: transmission line, line impedance, high-speed signal, lossless, lossy, transmission path, source impedance, load, printed circuit board, PCB, micro-strip, coaxial, twisted pair, TDR, Time Domain Reflectometry

Pb95Sn5

Abstract: pcb warpage in ipc standard ROSIN FLUX TYPE ROL0 EIA-746 IPC-6012A MAXIM Assembly Locations OF CODE underfill dispense needle FR4 substrate height and thickness DS2761X J-STD-004 sn63pb37
Contextual Info: Maxim > App Notes > GENERAL ENGINEERING TOPICS PROTOTYPING AND PC BOARD LAYOUT Keywords: Wafer Level Package, WLP, Flip Chip, Flip-Chip, CSP, Chip Scale Package, PCB Assembly, PCBA, Die Product, Silicon Circuit, Silicon Die Circuit Oct 18, 2004 APPLICATION NOTE 3377

JEP140

Abstract: JESD51-9 pcb board 0.035mm JESD51-10 JEP-140 PCB 1.2mm FR4 1oz cu JESD51-11 JESD51-X jesd51 6 JESD51-7
Contextual Info: Thermal Characterization of Packaged Semiconductor Devices Technical Brief December 2002 TB379.3 Author: Jim Benson Introduction With the continuing industry trends towards smaller, faster, and higher power devices, thermal management is becoming increasingly important. After all, higher device

JESD51-9

Abstract: JEP140 JEP-140 JESD51-10 JEDEC JESD51-8 conductivity meter circuit Reliability Test Methods for Packaged Devices thermal resistance standards JESD51-1 JESD51-3
Contextual Info: Thermal Characterization of Packaged Semiconductor Devices Technical Brief December 2002 TB379.3 Author: Jim Benson Introduction With the continuing industry trends towards smaller, faster, and higher power devices, thermal management is becoming increasingly important. After all, higher device

Contextual Info: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM2195C2A331JB12_ 0805, C0G, 330pF, 100Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency

Contextual Info: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM22M5C2H820FB01_ 1111, C0G, 82pF, 500Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency

Contextual Info: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM1875C2E9R0BB12_ 0603, C0G, 9pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency

Contextual Info: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM1875C2ER30CB12_ 0603, C0G, 0.3pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency

Contextual Info: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM1875C2E8R2BB12_ 0603, C0G, 8.2pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency

Contextual Info: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM1875C2E120FB12_ 0603, C0G, 12pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency

Contextual Info: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM1875C2E330FB12_ 0603, C0G, 33pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency

Contextual Info: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM1875C2E6R8BB12_ 0603, C0G, 6.8pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency

Contextual Info: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM2195C2A201JB12_ 0805, C0G, 200pF, 100Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency

Contextual Info: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM1875C2E820GB12_ 0603, C0G, 82pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency

Contextual Info: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM1875C2E560GB12_ 0603, C0G, 56pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency

Contextual Info: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM2195C2E121JB12_ 0805, C0G, 120pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency

Contextual Info: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM22M5C2H680FB01_ 1111, C0G, 68pF, 500Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency

Contextual Info: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM22M5C2H180FB01_ 1111, C0G, 18pF, 500Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency

Contextual Info: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM2195C2E151JB12_ 0805, C0G, 150pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency

Contextual Info: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM22M5C2HR75BB01_ 1111, C0G, 0.75pF, 500Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency

Contextual Info: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM1875C2E7R0BB12_ 0603, C0G, 7pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency

Contextual Info: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM2195C2E2R0WB12_ 0805, C0G, 2pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency

Contextual Info: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM2195C2E151GB12_ 0805, C0G, 150pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency

Contextual Info: RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR GQM1875C2E1R2WB12_ 0603, C0G, 1.2pF, 250Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency