PB SN SOLDER Search Results

lcd-displays

Contextual Info: Series 317 / 350 PCB connectors 1.778 and 1.8 mm Single row Solder tail Receptacles and pin connectors, solder tail With reduced grid spacing 1.778 and 1.8 mm Platings 91 93 97 99 10 90 Sleeve 5 µm Sn Pb 5 µm Sn Pb 5 µm Sn Pb 5 µm Sn Pb Clip 0,25 µm Au

FPC copper alloy

Abstract: EC10
Contextual Info: FPC Connector EC-10 Series 1.0mm Spacing Easy Flip Lock Type ● CFP84 - 3 Finish x×× Contact Soldering Mechanical locking system of FPC 0 : With 5 : Without ＊ （ No. of Pins 極数 Au Sn Au Sn-Pb 52F 91F 51G 70G Au Sn Sn-Pb Sn-Pb ） A+8.6=B × FPC / FFC Connectors

PCB connectors 2.54

Abstract: Preci-Dip UM 72 PROFILE
Contextual Info: Series 311 / 411 / 315 / 415 PCB connectors 2.54 mm Single row / double row Solder tail Receptacles, solder tail Accept pins ∅ 0.40–0.56 mm For corresponding pin connectors see pages 43 to 46 Platings 91 93 97 99 Sleeve 5 µm Sn Pb 5 µm Sn Pb 5 µm Sn Pb

6 pin. 1 single row receptacle

Abstract: Preci-Dip
Contextual Info: Series 310 / 410 PCB connectors 2.54 mm Single row / double row Solder tail 36 Receptacles, solder tail Accept pins ∅ 0.40–0.56 mm For corresponding pin connectors see pages 43 to 46 Platings 13 91 93 97 99 Sleeve 0.25 µm Au 5 µm Sn Pb 5 µm Sn Pb 5 µm Sn Pb

Pb and Pb-free Reflow Soldering Temperature Profiles

Abstract: TB493 JEP-140
Contextual Info: Technical Brief 493 Sn/Pb and Pb-free Reflow Soldering Temperature Profiles TABLE 1. REFLOW PROFILES PROFILE FEATURE SN-PB EUTECTIC ASSEMBLY PB-FREE ASSEMBLY Temperature Min TSMIN 100°C 150°C Temperature Max (TSMAX) 150°C 200°C Preheat/Soak Time (tS) from (TSMIN to TSMAX)

Contextual Info: 75 Amp Ultrafast Rectifier UFRG75120 Dim. Inches Millimeter Minimum Maximum Minimum Maximum Notes Gd | R C (A) ^ 1 -8 Lead frame plating — 85%Sn/15%Pb, 3 00 —800 micro inches Leads solder dipped with 63%Sn/37%Pb solder. Microsemi Catalog Number Industry

Contextual Info: 30 Amp Ultrafast Rectifier UES3005S - UES3015S Dim. Inches Millimeter Minimum Maximum Minimum Maximum Notes Gd | - R C (A) ^ 1 -8 Lead frame plating — 85%Sn/15%Pb, 3 00 —800 micro inches Leads solder dipped with 63%Sn/37%Pb solder. Microsemi Catalog

Contextual Info: 75 Amp Ultrafast Rectifier UFRG75120 Dim. Inches Millimeter Minimum Maximum Minimum Maximum Notes Gd | - R C (A) ^ 1 -8 Lead frame plating — 85%Sn/15%Pb, 3 00 —800 micro inches Leads solder dipped with 63%Sn/37%Pb solder. Microsemi Catalog Number Industry

Contextual Info: 30 Amp Ultrafast Rectifier UFRG30120 Dim. Inches Millimeter Minimum Maximum Minimum Maximum Notes Gd | - R C (A) ^ 1 -8 Lead frame plating — 85%Sn/15%Pb, 3 00 —800 micro inches Leads solder dipped with 63%Sn/37%Pb solder. Microsemi Catalog Number Industry

Contextual Info: 30 Amp Ultrafast Rectifier UFRG30120 Dim. Inches Millimeter Minimum Maximum Minimum Maximum Notes Gd | - R C (A) ^ 1 -8 Lead frame plating — 85%Sn/15%Pb, 3 00 —800 micro inches Leads solder dipped with 63%Sn/37%Pb solder. Microsemi Catalog Number Industry

F1206SB5000V032

Abstract: marking p-8a F1206SB4000V032 F1206SB2000V063 EIA1206 slow blow glass fuses
Contextual Info: Rev. Oct. 08 SolidMatrix 1206 Slow Blow Surface Mount Fuses Sn/Pb Terminations Features: • • • • • • High inrush current withstanding capability Multilayer monolithic structure with glass ceramic body and silver fusing element Silver termination with nickel and Sn/Pb solder plating, providing

Contextual Info: 30 Amp U ltraso ft Rectifier SSUM301 20 Dim. Inches Minimum C (A) Lead fram e plating — 85%Sn/15%Pb, 300—800 m icro inches Leads solder dipped with 63%Sn/37%Pb solder. Microsemi Catalog Number Industry Part Number Working Peak Reverse Voltage SSUM30120

Contextual Info: 75 Amp U ltraso ft Rectifier SSUM751 20 Dim. Inches Minimum C (A) Lead fram e plating — 85%Sn/15%Pb, 300—800 m icro inches Leads solder dipped with 63%Sn/37%Pb solder. Microsemi Catalog Number Industry Part Number Working Peak Reverse Voltage SSUM75120

CFC-PW001ME3-50

Contextual Info: MATERIAL HOUSING: HIGH TEMPERATURE THERMOPLASTIC. CONTACT: COPPER ALLOY. PED: BRASS. PLATING CONTACT: UNDERPLATED: 50 u” MIN Ni. CONTACT AREA: SELECT GOLD OVER Ni PLATED. SOLDER TAIL: 100 u” MIN Sn/Pb OVER Ni PLATED. PED: 100 u’ MIN Sn/Pb OVER 50 u" MIN Ni PLATED.

499-93-216-10-003

Abstract: PCB connectors 2.54
Contextual Info: Series 399 / 499 PCB connectors 2.54 mm Single row / double row Solder tail Right angle receptacles, solder tail Receptacles accept pins ∅ 0.40–0.56 mm For corresponding connectors see pages 43 to 46 Platings 91 93 Sleeve 5 µm Sn Pb 5 µm Sn Pb Clip 0,25 µm Au

200UA

Abstract: SSUM10060
Contextual Info: 100 Amp U ltrafast Rectifier SSUM10 0 6 0 Dim. Inches M illim eter Minimum A (A) Lead fram e plating — 85%Sn/15%Pb, 300—800 m icro inches Leads solder dipped with 63%Sn/37%Pb solder. Microsemi Catalog Number Industry Part Number SSUM10060 Working Peak

10125

Abstract: smartcard substrate HPC0402A
Contextual Info: HPC0402B/C Vishay High Performance, High Precision Wire-Bondable 0402 Capacitor for Smartcard, High-Frequency and Substrate-Embedded Applications FEATURES • Terminations are RoHS compliant in Au JEDEC “e4” . Sn/Ag/Cu (JEDEC “e1”) & Sn/Pb Pb-free

803-91-016-10-003

Contextual Info: Series 800 PCB connectors 2.54 mm Single row / double row Solder tail 24 Receptacles, solder tail Accept square pins • 0.635 mm and round pins ∅ 0.70–0.80 mm For corresponding pin connectors see pages 30 to 35 Platings 91 93 99 Sleeve 5 µm Sn Pb 5 µm Sn Pb

eia0603

Abstract: E232989
Contextual Info: Rev. Oct. 08 SolidMatrix 0603 Slow Blow Surface Mount Fuses Sn/Pb Terminations Features: • • • • • • High inrush current withstanding capability Ceramic Monolithic structure Silver fusing element and silver termination with nickel and Sn/Pb

Contextual Info: Mini-Circuits - Specification for Power Splitter - SBTC-2-10 Power Splitter Notes: • Internal load dissipation: 0.125 Watt. • Power Input as splitter 0.5W max. • Reflow Solder Assembly Silver-bearing solder (Sn/Pb/Ag 62/36/2%) is recommended; however, tin-lead eutectic (Sn/Pb 63/37%) may be used.

Contextual Info: Mini-Circuits - Specification for Power Splitter - SBTC-2-20 Power Splitter Notes: • Internal load dissipation: 0.125 Watt. • Power Input as splitter 0.5W max. • Reflow Solder Assembly Silver-bearing solder (Sn/Pb/Ag 62/36/2%) is recommended; however, tin-lead eutectic (Sn/Pb 63/37%) may be used.

Contextual Info: Mini-Circuits - Specification for Power Splitter - SBTC-2-25 Power Splitter Notes: • Internal load dissipation: 0.125 Watt. • Power Input as splitter 1W max. • Reflow Solder Assembly Silver-bearing solder (Sn/Pb/Ag 62/36/2%) is recommended; however, tin-lead eutectic (Sn/Pb 63/37%) may be used.

Contextual Info: Mini-Circuits - Specification for Power Splitter - SBTC-2-15-75 Power Splitter Notes: • Internal load dissipation: 0.125 Watt. • Power Input as splitter 0.5W max. • Reflow Solder Assembly Silver-bearing solder (Sn/Pb/Ag 62/36/2%) is recommended; however, tin-lead eutectic (Sn/Pb 63/37%) may be used.

CFC-PW001MX3-50

Contextual Info: MATERIAL HOUSING: HIGH TEMPERATURE THERMOPLASTIC. CONTACT: COPPER ALLOY. PED: BRASS. 49 PLATING 46.0 CONTACT: UNDERPLATED: 50 u” MIN Ni. CONTACT AREA: SELECT GOLD OVER Ni PLATED. SOLDER TAIL: 100 u’ MIN Sn/Pb OVER Ni PLATED. PED: 100 u” MIN Sn/Pb OVER 50 u’ MIN Ni PLATED.