PB SN SOLDER Search Results

lcd-displays

Contextual Info: Series 317 / 350 PCB connectors 1.778 and 1.8 mm Single row Solder tail Receptacles and pin connectors, solder tail With reduced grid spacing 1.778 and 1.8 mm Platings 91 93 97 99 10 90 Sleeve 5 µm Sn Pb 5 µm Sn Pb 5 µm Sn Pb 5 µm Sn Pb Clip 0,25 µm Au

FPC copper alloy

Abstract: EC10
Contextual Info: FPC Connector EC-10 Series 1.0mm Spacing Easy Flip Lock Type ● CFP84 - 3 Finish x×× Contact Soldering Mechanical locking system of FPC 0 : With 5 : Without ＊ （ No. of Pins 極数 Au Sn Au Sn-Pb 52F 91F 51G 70G Au Sn Sn-Pb Sn-Pb ） A+8.6=B × FPC / FFC Connectors

PCB connectors 2.54

Abstract: Preci-Dip UM 72 PROFILE
Contextual Info: Series 311 / 411 / 315 / 415 PCB connectors 2.54 mm Single row / double row Solder tail Receptacles, solder tail Accept pins ∅ 0.40–0.56 mm For corresponding pin connectors see pages 43 to 46 Platings 91 93 97 99 Sleeve 5 µm Sn Pb 5 µm Sn Pb 5 µm Sn Pb

Contextual Info: Solid tantalum capacitors - For power supplies and converters Molded cases SMD - Surface mount Sn-Pb or Sn plated - Polarized types Molded cases SMD - Surface mount Sn-Pb or Sn Plated - Polarized types STANDARD RATINGS - ELECTRICAL CHARACTERISTICS ELECTRICAL AND ENVIRONMENTAL CHARACTERISTICS

6 pin. 1 single row receptacle

Abstract: Preci-Dip
Contextual Info: Series 310 / 410 PCB connectors 2.54 mm Single row / double row Solder tail 36 Receptacles, solder tail Accept pins ∅ 0.40–0.56 mm For corresponding pin connectors see pages 43 to 46 Platings 13 91 93 97 99 Sleeve 0.25 µm Au 5 µm Sn Pb 5 µm Sn Pb 5 µm Sn Pb

CFP64

Contextual Info: FPC Connector EC-05 Series 0.5mm Spacing Easy Flip Lock Type ● CFP64 - 3 Finish Mechanical locking system of FPC 0 : With 5 : Without 52F 51G 70G Contact Soldering Au Au Sn-Pb Au Sn-Pb Sn-Pb FPC / FFC Connectors No. of Pins • Features 1. The wire-fixation lever is of our own easy flip lock

Pb and Pb-free Reflow Soldering Temperature Profiles

Abstract: TB493 JEP-140
Contextual Info: Technical Brief 493 Sn/Pb and Pb-free Reflow Soldering Temperature Profiles TABLE 1. REFLOW PROFILES PROFILE FEATURE SN-PB EUTECTIC ASSEMBLY PB-FREE ASSEMBLY Temperature Min TSMIN 100°C 150°C Temperature Max (TSMAX) 150°C 200°C Preheat/Soak Time (tS) from (TSMIN to TSMAX)

Contextual Info: Technical Data Sheet MP200 December-2011 PRODUCT DESCRIPTION MP200 provides the following product characteristics: Technology Application Solder paste Sn/Pb soldering MP200 solder pastes have been formulated as no-clean, Sn/Pb solder paste for high speed printing and reflow in both

Contextual Info: 75 Amp Ultrafast Rectifier UFRG75120 Dim. Inches Millimeter Minimum Maximum Minimum Maximum Notes Gd | R C (A) ^ 1 -8 Lead frame plating — 85%Sn/15%Pb, 3 00 —800 micro inches Leads solder dipped with 63%Sn/37%Pb solder. Microsemi Catalog Number Industry

Contextual Info: 30 Amp Ultrafast Rectifier UES3005S - UES3015S Dim. Inches Millimeter Minimum Maximum Minimum Maximum Notes Gd | - R C (A) ^ 1 -8 Lead frame plating — 85%Sn/15%Pb, 3 00 —800 micro inches Leads solder dipped with 63%Sn/37%Pb solder. Microsemi Catalog

Contextual Info: 75 Amp Ultrafast Rectifier UFRG75120 Dim. Inches Millimeter Minimum Maximum Minimum Maximum Notes Gd | - R C (A) ^ 1 -8 Lead frame plating — 85%Sn/15%Pb, 3 00 —800 micro inches Leads solder dipped with 63%Sn/37%Pb solder. Microsemi Catalog Number Industry

Contextual Info: 30 Amp Ultrafast Rectifier UFRG30120 Dim. Inches Millimeter Minimum Maximum Minimum Maximum Notes Gd | - R C (A) ^ 1 -8 Lead frame plating — 85%Sn/15%Pb, 3 00 —800 micro inches Leads solder dipped with 63%Sn/37%Pb solder. Microsemi Catalog Number Industry

Contextual Info: 30 Amp Ultrafast Rectifier UFRG30120 Dim. Inches Millimeter Minimum Maximum Minimum Maximum Notes Gd | - R C (A) ^ 1 -8 Lead frame plating — 85%Sn/15%Pb, 3 00 —800 micro inches Leads solder dipped with 63%Sn/37%Pb solder. Microsemi Catalog Number Industry

SSUM75120

Contextual Info: 75 Amp Ultrasoft Rectifier SSUM751 20 Dim. Inches Millimeter Minimum Maximum Minimum Maximum Notes Gd | - R C (A ) ^ 1 -8 Lead frame plating — 85%Sn/15%Pb, 300—800 micro inches Leads solder dipped with 63%Sn/37%Pb solder. Microsemi Catalog Number Industry

F1206SB5000V032

Abstract: marking p-8a F1206SB4000V032 F1206SB2000V063 EIA1206 slow blow glass fuses
Contextual Info: Rev. Oct. 08 SolidMatrix 1206 Slow Blow Surface Mount Fuses Sn/Pb Terminations Features: • • • • • • High inrush current withstanding capability Multilayer monolithic structure with glass ceramic body and silver fusing element Silver termination with nickel and Sn/Pb solder plating, providing

Contextual Info: 30 Amp U ltraso ft Rectifier SSUM301 20 Dim. Inches Minimum C (A) Lead fram e plating — 85%Sn/15%Pb, 300—800 m icro inches Leads solder dipped with 63%Sn/37%Pb solder. Microsemi Catalog Number Industry Part Number Working Peak Reverse Voltage SSUM30120

Contextual Info: 75 Amp U ltraso ft Rectifier SSUM751 20 Dim. Inches Minimum C (A) Lead fram e plating — 85%Sn/15%Pb, 300—800 m icro inches Leads solder dipped with 63%Sn/37%Pb solder. Microsemi Catalog Number Industry Part Number Working Peak Reverse Voltage SSUM75120

8240-0287

Contextual Info: REVISIONS REV. 01 PART NUMBER SOLDER CONTENT 824-00287 Sn/Pb 824-00287F Sn/Ag/Cu WARNING ! DESCRIPTION ECN NO. DATE N/A 09/08/04 FIRST RELEASE PART DESCRIPTION TITLE TRANSFORMER, 100BASE-T, DUAL, SOIC, 40 PIN Standard version, containing lead Lead Pb -Free version

CFC-PW001ME3-50

Contextual Info: MATERIAL HOUSING: HIGH TEMPERATURE THERMOPLASTIC. CONTACT: COPPER ALLOY. PED: BRASS. PLATING CONTACT: UNDERPLATED: 50 u” MIN Ni. CONTACT AREA: SELECT GOLD OVER Ni PLATED. SOLDER TAIL: 100 u” MIN Sn/Pb OVER Ni PLATED. PED: 100 u’ MIN Sn/Pb OVER 50 u" MIN Ni PLATED.

1754-3

Contextual Info: Mini-Circuits - Specification for Power Splitter - SBTCJ-1W Power Splitter Notes: • Power Input as splitter 0.5W max. • Internal Dissipation 0.125W max. • Reflow Solder Assembly Silver-bearing solder (Sn/Pb/Ag 62/36/2%) is recommended; however, tin-lead eutectic (Sn/Pb 63/37%) may be used.

499-93-216-10-003

Abstract: PCB connectors 2.54
Contextual Info: Series 399 / 499 PCB connectors 2.54 mm Single row / double row Solder tail Right angle receptacles, solder tail Receptacles accept pins ∅ 0.40–0.56 mm For corresponding connectors see pages 43 to 46 Platings 91 93 Sleeve 5 µm Sn Pb 5 µm Sn Pb Clip 0,25 µm Au

Contextual Info: MATERIAL HOUSING: HIGH TEMPERATURE THERMOPLASTIC. CONTACT: COPPER ALLOY. PED: BRASS. PLATING CONTACT: UNDERPLATED: 50 u" MIN Nl. CONTACT AREA: SELECTED GOLD OVER Ni PLATED. SOLDER TAIL 100 u’ MIN Sn/Pb OVER Ni PLATED. PED: 100 u’ MIN Sn/Pb OVER 50 u” MIN Ni PLATED.

200UA

Abstract: SSUM10060
Contextual Info: 100 Amp U ltrafast Rectifier SSUM10 0 6 0 Dim. Inches M illim eter Minimum A (A) Lead fram e plating — 85%Sn/15%Pb, 300—800 m icro inches Leads solder dipped with 63%Sn/37%Pb solder. Microsemi Catalog Number Industry Part Number SSUM10060 Working Peak

200UA

Abstract: SSUM10060
Contextual Info: 100 Amp Ultrafast Rectifier SSUM10 0 6 0 Dim. Inches Minimum A (A) Lead fram e plating — 85%Sn/15%Pb, 3 00 —800 m icro inches Leads solder dipped with 63%Sn/37%Pb solder. Microsemi Catalog Number Industry P art Number Working Peak Reverse Voltage SSUM10060