PASTE PROFILE Search Results

DM4030LD

Abstract: diemat thermal conductivity
Contextual Info: DM4030LD Data Sheet DM4030LD THERMOPLASTIC ADHESIVE PASTE PRODUCT DATA SHEET I. DESCRIPTION The DM4030LD is a silver-loaded thermoplastic paste designed specifically for wet paste attach of large devices, heat sinks, and/or substrates. DM4030LD provides a low stress, resilient bond for large-area, highly-mismatched materials. Due to a patented polymer/

215C

Abstract: solder paste
Contextual Info: Recommended Re-Flow Profile for SO8 Package Recommended solder paste is industry standard 60/40 Pb/Sn with built in ‘no clean’ flux. 215°C 179°C solder paste flows 140 – 160 secs 60 – 80 secs

Contextual Info: S O L D E R IN G A N D C L E A N IN G PROCESSES 1 — Solder Paste Printing Roflow GENERAL Use the optimum solder paste for the pattern, printing pi-ocess, solderpaste density and solder joint quality. RECOMMENDED Use Sn 63% Pb 37% solder paste. Use 8 to 10 mil thickness for

c 6090

Abstract: IPC-A-610 k type thermocouple Thermocouple Type K oven 65psi
Contextual Info: Lead Free Solder Reflow Profile - SMD Trimpot Products Process Description Materials 1. Apply solder paste to test board 8 - 10 mil thick Temperature Time Interval • Sn 96.5 / Ag 3.0 / Cu 0.5 Room temperature Alloy water soluble or no clean solder paste

C 6090

Abstract: g10 smd transistor SMD g10 Water soluble water soluble cleaning reflow profile 245 solder paste
Contextual Info: Lead Free Solder Reflow Profile - SMD Trimmers Process Description 1. Apply solder paste to test board 8 - 10 mil thick Materials Time Interval Temperature • Sn 96.5 / Ag 3.0 / Cu 0.5 Room temperature Alloy water soluble or no clean solder paste (see note 1)

Contextual Info: Dat asheet Design Recommendation Application notes PCB Components To guarantee the best soldering result in the reflow processes the required paste volume and paste filling level must be optimized for the paste printing process. P C B p i n h e a d e r s f o r t h e S M T p ro c e s s

GR-78-CORE

Contextual Info: Technical Data Sheet WS200 June-2009 WS200™ is a water washable solder paste for printing and reflow in air or nitrogen atmospheres where process yield is critical. WS200™ solder paste offers excellent open time and good soldering activity over a wide range of reflow profiles and

Kester 197

Contextual Info: R560 Water-Soluble Solder Paste Product Description Physical Properties Data given for Sn63Pb37, 90% metal, -325+500 mesh Kester R560 is an organic acid, water-soluble solder paste formula specifically designed to reduce voiding in Ball Grid Array (BGA) solder

Contextual Info: Technical Data Sheet MP200 December-2011 PRODUCT DESCRIPTION MP200 provides the following product characteristics: Technology Application Solder paste Sn/Pb soldering MP200 solder pastes have been formulated as no-clean, Sn/Pb solder paste for high speed printing and reflow in both

MLF3216C150K

Abstract: MLF1608K-100K MLF3216E-6R8K MLF1608D-R18K MLF3216A-3R9 MLF2012E120K MLF1608D-R68K MLF3216A1R0K MLF3216DR15K MLF3216DR27K
Contextual Info: Page: 1 Thursday, May 22, 1997 4b3b.html MLF SERIES Shielded Inductor TDK's MLF Multilayer Chip Inductor combines high performance with the most compact design available today. MLF Inductor's multilayer technology utilizes ferrite paste and electric conductor paste layered in a monolithic structure.

Soldering guidelines pin in paste

Abstract: TA-893 connectors Shrouded Header, 8 Pin, 2mm fci minitek idc shrouded header pin in paste BUS-12-055 LR46923 right angle 14 pin pcb connector 2mm pitch
Contextual Info: COMMUNICATIONS, DATA, CONSUMER DIVISION TM QUICKIE Cable-to-board Connectors for Pin-in-Paste Processes Quickie Cable-to-board Connectors for Pin-in-Paste Processes Description Quickie™ is FCI’s brand for cable-to-board connectors in 2.54mm pitch. The Quickie™ product range

Soldering guidelines pin in paste

Abstract: TA-895 idc shrouded header minitek pin in paste LR46923 right angle 5 pin pcb connector
Contextual Info: Products for solder-to-board applications MINITEK Headers for Pin-in-Paste Processes MINITEK™ Pin-in-Paste DESCRIPTION Minitek is FCI’s brand for board-to-board and wire/cable-to-board connectors in 2.00 mm pitch. The Minitek product range includes PCB Card Connectors,

s601a

Abstract: mmz1608 R601A Y-102-B S102A Y601B 601 045 mmz tdk
Contextual Info: Page: 1 Thursday, May 22, 1997 4b1e.html MMZ SERIES High Impedance Low DC Resistance Multilayer Chip Bead TDK Multilayer Chip Beads use ferrite materials and multilayer technology to produce revolutionary beads which are the smallest high impedance beads available. Ferrite paste and electric conductor paste

GR-78-CORE

Abstract: J-STD-005 multicore solder paste GR78-CORE GR-78-CORE PCB solder powder J-STD-004 paste J-STD-004 MSDS bellcore GR-78 MCF800
Contextual Info: Technical Data Sheet MP200 Solder Paste February 2005 HIGH-SPEED PRINTING, NO-CLEAN SOLDER PASTE PRODUCT DESCRIPTION Multicore MP200 solder pastes have been formulated as no-clean solder pastes for high speed printing and reflow in both air and nitrogen. The products were specifically formulated to have increased

Contextual Info: Automotive and Anti-Sulfuration Chip Resistor 0603 Description The resistors are constructed in a high grade ceramic body aluminium oxide . Internal metal electrodes are added at each end and connected by a resistive paste that is applied to the top surface of the substrate. The composition of the paste is adjusted to give the

all ic data

Abstract: EIAJ SO 8 solder heating profile intel 80486 DX4 INTEL DX4 paste profile SMT Process dx4 208 SQFP 80c196kb 1988 diode databook intel 80486
Contextual Info: Board Solder Reflow Process Recommendations - Leaded SMT 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables including the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile

all ic data

Abstract: land pattern for TSOP 2 pace craft 100 82425EX intel 80486 80486 DX4 80c196kb 1988 QFP PACKAGE thermal resistance 55A5 TSOP infrared
Contextual Info: CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS INTRODUCTION In reflowed board assemblies the solder joint quality is affected by several variables such as board design SMT Surface Mount Technology assembly equipment solder paste component and reflow profile

Intel reflow soldering profile BGA

Abstract: all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment
Contextual Info: Board Solder Reflow Process Recommendations 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables such as the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile and board design.

sn63pb37 solder wire

Abstract: SN63PB37 ROSIN FLUX TYPE ROL0 kester Sn63pB37 sn63pb37 solder wire flux 232
Contextual Info: 2011RECOMMENDED RECOMMENDED 2012 ElectronicsAssembly Assembly Materials Materials Electronics Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information

rj45 JACK ultra low profile

Abstract: 43202-8919 1803
Contextual Info: Modular Jack FEATURES AND SPECIFICATIONS Features and Benefits • Ultra low profile ■ Enhanced panel grounding tabs on shielding RJ-45 configuration ■ Enclosed top ■ Surface Mount Compatible materials ■ Pin through paste solderability ■ 100% tested for hi-pot and continuity

Contextual Info: SEE SHEET THREE Patent Pending Chicago Miniature Lamp P/N 7520A10 series SMD Light Pipe solder profile Melting point for 63/37 Tin-Lead solder paste: 183 Degrees C. Temperature degrees Maximum Reflow Temperature for 7520A10 is 221 Degrees C. 250.00 228.00

IPC-SM-785

Abstract: GENERAL SEMICONDUCTOR MARKING UM micro solder ball AN-1112 WLCSP stencil design BGA and CSP
Contextual Info: National Semiconductor Application Note 1112 March 2002 CONTENTS Introduction to Micro SMD Package Construction Micro SMD Package Data Surface Mount Assembly Considerations PCB Layout Stencil Printing Process Component Placement Solder Paste Reflow and Cleaning

Contextual Info: Easy Profile 256 No-Clean Solderpaste Product Description Physical Properties Data given for Sn63Pb37 90% metal, -325+500 mesh Easy Profile® 256 is a no-clean, air or nitrogen reflowable, solder paste specifically designed for maximum robustness in reflow profiling and stencil

rj45 JACK ultra low profile

Contextual Info: Modular Jack FEATURES AND SPECIFICATIONS Features and Benefits • Ultra low profile ■ Enhanced panel grounding tabs on shielding RJ-45 configuration ■ Enclosed top ■ Surface Mount Compatible materials ■ Pin through paste solderability ■ 100% tested for hi-pot and continuity