PAD LAYOUTS Search Results

Soldering Process

Abstract: DO213-AB
Contextual Info: Pad Layouts/Soldering Process www.vishay.com Vishay General Semiconductor Pad Layouts/Soldering Process VISHAY GENERAL SEMICONDUCTOR RECOMMENDED MINIMUM MOUNTING PAD LAYOUT SIZES FOR THE SURFACE MOUNT RECTIFIER DFS BRIDGE MBS BRIDGE 0.047 1.20 MIN. MBLS BRIDGE

"General Semiconductor" DO-214AC

Abstract: MicroSMP Pad Layout TL 413 DO-213AA DO-220AA GL34
Contextual Info: Pad Layouts/Soldering Process Vishay General Semiconductor Pad Layouts/Soldering Process VISHAY GENERAL SEMICONDUCTOR RECOMMENDED MINIMUM MOUNTING PAD LAYOUT SIZES FOR THE SURFACE MOUNT RECTIFIER MBS BRIDGE DFS BRIDGE 0.023 MIN. 0.58 MIN. 0.047 MIN. (1.20 MIN.)

Contextual Info: CERAM IC MICROWAVE FILTERS SAW FILTERS & RESONATORS DIMENSIONS & SUGGESTED PAD LAYOUTS SC33PACKAGE Terminals : Input : Output O th e rs: Ground mnffata /kM&nter t* SC33 LOW PROFILE Terminals $ Land Pattern 4 -1 .5 ± 0.15 1 .5 ± 0 .1 5 Sugge ste d Pad Layout

524 suppressor

Contextual Info: CONTENTS POWER SEMICONDUCTOR DIVISION PRODUCT CATALOG 12 Edition GENERAL INFORMATION PACKAGING, ASSEMBLY RECOMMENDATIONS, Introduction .1 AND PAD LAYOUTS . 495

MM912G634DV1AE

Abstract: 51413 15x10-6 125c59 Operational transconductance amplifier 54-031 S12CPMU
Contextual Info: Freescale Semiconductor Advance Information Document Number: MM912_634D1 Rev. 10.0, 1/2013 Integrated S12 Based Relay Driver with LIN MM912_634 48-PIN LQFP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option AP SUFFIX: Non Exposed Pad Option The MM912G634 48 kB and MM912H634 (64 kB) are

CTR31 PCB Controller

Abstract: MM912G634 fet ifr 634 MM912G634CV1AE TSG 3255 TC0800 54113 uns tread MM912 D flip flop
Contextual Info: Freescale Semiconductor Advance Information Document Number: MM912_634D1 Rev. 5.0, 9/2011 Integrated S12 Based Relay Driver with LIN MM912_634 48-PIN LQFP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option AP SUFFIX: Non Exposed Pad Option The MM912G634 48 kB and MM912H634 (64 kB) are

bc 494 b f.m transmitter

Abstract: SCR SS 3328 CTR31 PCB Controller 51-6332 Tl 5153 dp1203 N203 57210 54123 application as pulse generator TSG 3255
Contextual Info: Freescale Semiconductor Advance Information Document Number: MM912_634D1 Rev. 7.0, 3/2012 Integrated S12 Based Relay Driver with LIN MM912_634 48-PIN LQFP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option AP SUFFIX: Non Exposed Pad Option The MM912G634 48 kB and MM912H634 (64 kB) are

Contextual Info: Freescale Semiconductor Advance Information Document Number: MM912_634D1 Rev. 9.0, 12/2012 Integrated S12 Based Relay Driver with LIN MM912_634 48-PIN LQFP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option AP SUFFIX: Non Exposed Pad Option The MM912G634 48 kB and MM912H634 (64 kB) are

dual coil latching relay

Abstract: hall sensor 41 hall 44132 rain light sensor ctr31 D2D DIODE B2k marking 3 PIN hall effect sensor n 177 4205 mosfet TSG 3255
Contextual Info: Freescale Semiconductor Advance Information Document Number: MM912_634D1 Rev. 4.0, 5/2011 Integrated S12 Based Relay Driver with LIN MM912_634 48-PIN LQFP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option AP SUFFIX: Non Exposed Pad Option The MM912G634 48 kB and MM912H634 (64 kB) are

dual coil latching relay

Abstract: MOSFET K 4202 mosfet 4914 LIN conformance fet ifr 634 TSG 3255
Contextual Info: Freescale Semiconductor Advance Information Document Number: MM912_634D1 Rev. 3.0, 5/2011 Integrated S12 Based Relay Driver with LIN MM912_634 48-PIN LQFP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option AP SUFFIX: Non Exposed Pad Option The MM912G634 48 kB and MM912H634 (64 kB) are

Contextual Info: Freescale Semiconductor Advance Information Document Number: MM912_634D1 Rev. 7.0, 3/2012 Integrated S12 Based Relay Driver with LIN MM912_634 48-PIN LQFP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option AP SUFFIX: Non Exposed Pad Option The MM912G634 48 kB and MM912H634 (64 kB) are

Contextual Info: Freescale Semiconductor Advance Information Document Number: MM912_634D1 Rev. 8.0, 11/2012 Integrated S12 Based Relay Driver with LIN MM912_634 48-PIN LQFP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option AP SUFFIX: Non Exposed Pad Option The MM912G634 48 kB and MM912H634 (64 kB) are

Contextual Info: THS6032 www.ti.com SLOS233E – APRIL 1999 – REVISED OCTOBER 2007 LOW-POWER ADSL CENTRAL-OFFICE LINE DRIVER FEATURES 1 THERMALLY ENHANCED SOIC DWP PowerPAD? PACKAGE (TOP VIEW) PAD† VCCH− 1OUT VCCL− 1IN− 1IN+ NC SHDN1 SHDN2 PAD† 1 2 3 4 5 6 7

Contextual Info: THS6032 www.ti.com SLOS233E – APRIL 1999 – REVISED OCTOBER 2007 LOW-POWER ADSL CENTRAL-OFFICE LINE DRIVER FEATURES 1 THERMALLY ENHANCED SOIC DWP PowerPAD? PACKAGE (TOP VIEW) PAD† VCCH− 1OUT VCCL− 1IN− 1IN+ NC SHDN1 SHDN2 PAD† 1 2 3 4 5 6 7

Contextual Info: THS6032 www.ti.com SLOS233E – APRIL 1999 – REVISED OCTOBER 2007 LOW-POWER ADSL CENTRAL-OFFICE LINE DRIVER FEATURES 1 THERMALLY ENHANCED SOIC DWP PowerPAD? PACKAGE (TOP VIEW) PAD† VCCH− 1OUT VCCL− 1IN− 1IN+ NC SHDN1 SHDN2 PAD† 1 2 3 4 5 6 7

Contextual Info: THS6032 www.ti.com SLOS233E – APRIL 1999 – REVISED OCTOBER 2007 LOW-POWER ADSL CENTRAL-OFFICE LINE DRIVER FEATURES 1 THERMALLY ENHANCED SOIC DWP PowerPAD? PACKAGE (TOP VIEW) PAD† VCCH− 1OUT VCCL− 1IN− 1IN+ NC SHDN1 SHDN2 PAD† 1 2 3 4 5 6 7

Contextual Info: THS6032 www.ti.com SLOS233E – APRIL 1999 – REVISED OCTOBER 2007 LOW-POWER ADSL CENTRAL-OFFICE LINE DRIVER FEATURES 1 THERMALLY ENHANCED SOIC DWP PowerPAD? PACKAGE (TOP VIEW) PAD† VCCH− 1OUT VCCL− 1IN− 1IN+ NC SHDN1 SHDN2 PAD† 1 2 3 4 5 6 7

epcos 16v 157

Abstract: B45196 EPCOS B45196 EPCOS B45196-E 107 16V epcos B45190E1336M209 B45196-H B45197-A B45198-H B45198-R
Contextual Info: Specification Tantalum Chip Capacitor; MnO2 B45190E1336M209 Content 1. Electrical parameter 2. Shipping, storage and production environment 3. Ordering code structure 4. Specification in brief 5. Dimensional drawing 6. Marking 7. Recommended solder pad layouts

AA112A

Abstract: IPC-7351A
Contextual Info: PACKAGE OUTLINE DIMENSIONS AP02002 SUGGESTED PAD LAYOUT(AP02001) (Based on IPC-7351A) Table of Contents X4-DFN0402‐2/SWP . 10

Contextual Info: SM Crystal GSX-7A Specifications Product Parameters GSX 7A Frequency range: 12.0 ~ 40.0MHz fund 40.0 ~ 67.0MHz (3rd OT) Frequency stability: ±100ppm inclusive of calibration tolerance 6.20 (max) 3.70 (max) 1.40 (max) 2.54 ACTUAL SIZE SOLDER PAD LAYOUTS

16.0MHZ

Abstract: 22.1184 22.118400
Contextual Info: SM Crystal GSX-7A Specifications Product Parameters GSX-7A Frequency range: 12.0 ~ 40.0MHz fund 40.0 ~ 67.0MHz (3rd OT) Frequency stability: ±100ppm inclusive of calibration tolerance 6.20 (max) 3.70 (max) 1.40 (max) 2.54 ACTUAL SIZE SOLDER PAD LAYOUTS

Contextual Info: SM Crystal GSX-7A Specifications Product Parameters GSX-7A Frequency range: 12.0 ~ 40.0MHz fund 40.0 ~ 67.0MHz (3rd OT) Frequency stability: ±100ppm inclusive of calibration tolerance 6.20 (max) 3.70 (max) 1.40 (max) 2.54 ACTUAL SIZE SOLDER PAD LAYOUTS

16.0MHz GSX

Abstract: 7,3728 7.3728 GSX-852
Contextual Info: SM Crystal - Ceramic Lid GSX-852 Specifications Product Parameters GSX-852 Frequency range: 7.3728 ~ 60.0MHz 4.65 max ACTUAL SIZE 1.60 (max) SOLDER PAD LAYOUTS 3.00 2.00 1.50 2.50 1.50 4.00 ˿ ࡯ ˿ 3 5 specify Temperature stability: ±30ppm ±50ppm ±100ppm

7.3728

Abstract: GSX-852 400D 16.0MHz
Contextual Info: SM Crystal - Ceramic Lid GSX-852 Specifications Product Parameters GSX-852 Frequency range: 7.3728 ~ 60.0MHz 4.65 max ACTUAL SIZE 1.60 (max) SOLDER PAD LAYOUTS 3.00 2.00 1.50 2.50 1.50 4.00 ˿ ࡯ ˿ 3 5 specify Temperature stability: ±30ppm ±50ppm ±100ppm