PAD DIMENSION Search Results

PAD DIMENSION Result Highlights (5)

Part	Manufacturer	Description	Download
V36BEZ02307000T	Amphenol Communications Solutions	ExtremePort QSFP-DD 112G stacked SMT connector, Glue pad version	PDF
NDHN3B2	Amphenol Communications Solutions	Rectangular Push Pull IP67 Industrial Ethernet Connector, NDH, Ix Industrial, Hood + Plug Kit, B Key, Plug with Solder Pad Termination, 8u\\ Gold plating	PDF
NDHN6B2	Amphenol Communications Solutions	Rectangular Push Pull IP67 Industrial Ethernet Connector, NDH, Ix Industrial, Bulkhead, Hood + Plug Kit, B Key, Plug with Solder Pad Termination, 8u\\ Gold plating	PDF
MSPEP6P22A0	Amphenol Communications Solutions	SPE IP67 Plug, Push Pull Lock, Solder Pad, 28 to 18 AWG, Cable OD 0.138in to 0.252in, 3 Grommets	PDF
NDHN3B1	Amphenol Communications Solutions	Rectangular Push Pull IP67 Industrial Ethernet Connector, NDH, Ix Industrial, Hood + Plug Kit, B Key, Plug with Solder Pad Termination, Gold flash plating	PDF

PAD DIMENSION Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
Contextual Info: C18 Pad 1 Bonding Pad 4 Pls 16 [0.406] 14 [0.356] SQ. 1 [0.025] Bond only on crosshatched area Pad 2 Pad 3 Pad 4 6 [0.152] 4 [0.102] Back Contact Dimensions in mils [mm] Give us a call at 888-641-SEMI 7364 web: http://www.aeroflex.com/metelics, email: metelics-sales@aeroflex.com	Original	888-641-SEMI	PDF
J412 Abstract: TELEDYNE RELAYS j412 j422d J412D J411T ER422DD ER412DD ER134 J116C J422 Contextual Info: Appendix A: Spacer Pads Pad designation and bottom view dimensions Height Ø.150 [3.81] REF Dim H MAX “M4” Pad for TO-5 Dim H MAX “M4” Pad for TO-5 Dim H MAX “M4” Pad for Centigrid .156 [3.96] (REF) Dim H MAX .256 [6.5] (REF) “M9” Pad for Centigrid®	Original	ER411T ER412, ER412D, ER412DD 712TN, RF300, RF310, RF320 ER420, ER422D, J412 TELEDYNE RELAYS j412 j422d J412D J411T ER422DD ER134 J116C J422	PDF
ADN2845 Abstract: 18-PAD Contextual Info: a 18-Pad Bare Die Dimensions shown in micrometers and millimeters 1 ADN2845 PAD PITCH: 200␮m DIE SIZE: 1140␮m ؎20␮m ؋ 1340␮m (؎20␮m) DIE THICKNESS: 0.25mm SINGLE PAD SIZE: 92␮m ؋ 92␮m DOUBLE PAD SIZE: 151␮m ؋ 92␮m 1140␮m (؎20␮m)	Original	18-Pad ADN2845 1140m 1340m ADN2845	PDF
MRGF Abstract: LP73 UR73D LA73 LT73 NT73 RF73 RK73 RN73 SG73 Contextual Info: Appendix E pad dimensions standard soldering pad dimensions The optimum soldering pad dimensions may differ depending on soldering conditions, however, the following land dimensions are generally recommended. WK73 RK73 SG73 RN73 RN73H SR73 LT73 NT73 PT72 LA73	Original	RN73H SDT73 MRGF LP73 UR73D LA73 LT73 NT73 RF73 RK73 RN73 SG73	PDF
TLM563D Contextual Info: Package Details - TLM563D Mechanical Drawing Lead Code: Reference individual device data sheet. Part Marking: 2-3 Character Alpha/Numeric Code Exposed pad P1 common to pin 6 Exposed pad P2 common to pin 3 Mounting Pad Geometry Dimensions in mm Central	Original	TLM563D EIA-481-1-A 20x18x5 23x23x13 23x23x23 21x9x9 53x23x23 27x9x17 69x23x43 TLM563D	PDF
DS2430AX Abstract: FR4 substrate 0537 Contextual Info: NOTES: 1. DIMENSIONS: MM [IN C H ] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND COORDINATES, SEE TABLE 1 4. UNDERFILL RECOMMENDED FOR F R 4 SUBSTRATE APPLICATION TABLE 1. PAD CONNECTIONS AND CENTER COORDINATES MILLIMETERS	OCR Scan	DS2430AX IS2430AX 022GE DS2430AX FR4 substrate 0537	PDF
FR4 SUBSTRATE SHEET Abstract: DS75X 3ao2 Contextual Info: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. NON-SOLDER MASK DEFINED LANDING PAD 4. UNDERFILL OR GLOB TOP RECOMMENDED FOR F R - 4 OR EQUIVALENT SUBSTRATE APPLICATIONS TABLE 1: SUBSTRATE CONNECTIONS AND PAD COORDINATES MILLIMETERS INCHES PAD# NAME CENTER X	OCR Scan	DS75X DS75X FR4 SUBSTRATE SHEET 3ao2	PDF
avx 9155 Abstract: avx 8610 series Contextual Info: Recommended Mounting Pad Dimensions for SQ Series RF Devices These diagrams show the recommended pad layout dimensions for the AVX SQ series range of RF/Microwave components. B C A D MOUNTING PAD DIMENSIONS: inches millimeters Case A min B min C min D min	Original	S-PDSQ00M1206-C avx 9155 avx 8610 series	PDF
Standard EIA-481-1-A Abstract: TLM563D Contextual Info: Package Details TLM563D Case Mechanical Drawing Part Marking: 2-3 Character Alpha/Numeric Code Lead Code: Reference individual device data sheet. Exposed pad P1 common to pin 6 Exposed pad P2 common to pin 3 Mounting Pad Geometry Dimensions in mm R1 (4-March 2010)	Original	TLM563D EIA-481-1-A 21x9x9 27x9x17 23x23x13 23x23x23 53x23x23 69x23x43 Standard EIA-481-1-A	PDF
TN0702 Contextual Info: Supertex inc. TN0702 Die Speciﬁcation Pad Layout 1 0,0 2 Backside: Drain Die Speciﬁcations Die Dimensions Device Length1 Width1 Thickness mils Back Side Metal 65 50 11.0 ± 1.5 Au (mils) TN0702 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description	Original	TN0702 TN0702 A031710	PDF
TP0620 Contextual Info: Supertex inc. TP0620 Die Speciﬁcation Pad Layout 1 0,0 2 Backside: Drain Die Speciﬁcations Die Dimensions Device Length1 Width1 Thickness mils Back Side Metal 45 45 11 ± 1.5 Au (mils) TP0620 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description	Original	TP0620 TP0620 A031610	PDF
VP0808 Contextual Info: Supertex inc. VP0808 Die Speciﬁcation Pad Layout 1 0,0 2 Backside: Drain Die Speciﬁcations Die Dimensions Device Length1 Width1 Thickness mils Back Side Metal 45 45 11 ± 1.5 Au (mils) VP0808 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description	Original	VP0808 VP0808 A031610	PDF
TN2435 Contextual Info: Supertex inc. TN2435 Die Speciﬁcation Pad Layout 1 0,0 2 Backside: Drain Die Speciﬁcations Die Dimensions Device Length Width Thickness mils Back Side Metal 55 55 11 ± 1.5 Au 1 (mils) TN2435 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description	Original	TN2435 TN2435 A031610	PDF
DN2470 Contextual Info: Supertex inc. DN2470 Die Speciﬁcation Pad Layout 1 0,0 2 Backside: Drain Die Speciﬁcations Die Dimensions Device Length Width Thickness mils Back Side Metal 55 55 11 ± 1.5 Au 1 (mils) DN2470 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description	Original	DN2470 DN2470 A031610	PDF

TP5335 Contextual Info: Supertex inc. TP5335 Die Speciﬁcation Pad Layout 1 2 0,0 Backside: Drain Die Speciﬁcations Die Dimensions Device Length Width Thickness mils Back Side Metal 30 56 8.0 ± 1.0 Au 1 (mils) TP5335 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description	Original	TP5335 TP5335 A031610	PDF
VN10K Contextual Info: Supertex inc. VN10K Die Speciﬁcation Pad Layout 1 0,0 2 Backside: Drain Die Speciﬁcations Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) VN10K 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description	Original	VN10K VN10K A031610	PDF
VN2410 Contextual Info: Supertex inc. VN2410 Die Speciﬁcation Pad Layout 1 0,0 2 Backside: Drain Die Speciﬁcations Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) VN2410 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description	Original	VN2410 VN2410 A031610	PDF
TN2106 Contextual Info: Supertex inc. TN2106 Die Speciﬁcation Pad Layout 1 0,0 2 Backside: Drain Die Speciﬁcations Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) TN2106 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description	Original	TN2106 TN2106 A031610	PDF
TN2510 Contextual Info: Supertex inc. TN2510 Die Speciﬁcation Pad Layout 1 0,0 2 Backside: Drain Die Speciﬁcations Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) TN2510 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description	Original	TN2510 TN2510 A031610	PDF
TP2510 Contextual Info: Supertex inc. TP2510 Die Speciﬁcation Pad Layout 1 0,0 2 Backside: Drain Die Speciﬁcations Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) TP2510 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description	Original	TP2510 TP2510 A031610	PDF
2N7002 Die Specification Abstract: 2N7002-DIE 2N7002 Contextual Info: Supertex inc. 2N7002 Die Speciﬁcation Pad Layout 1 0,0 2 Backside: Drain Die Speciﬁcations Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) 2N7002 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description	Original	2N7002 2N7002 A031610 2N7002 Die Specification 2N7002-DIE	PDF
DN2535 Contextual Info: Supertex inc. DN2535 Die Speciﬁcation Pad Layout 1 0,0 2 Backside: Drain Die Speciﬁcations Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) DN2535 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description	Original	DN2535 DN2535 A031610	PDF
TN0610 Contextual Info: Supertex inc. TN0610 Die Speciﬁcation Pad Layout 1 0,0 2 Backside: Drain Die Speciﬁcations Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) TN0610 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description	Original	TN0610 TN0610 A031610	PDF
2N6661 Abstract: 2n6661 bonding pad lay-out Contextual Info: Supertex inc. 2N6661 Die Speciﬁcation Pad Layout 1 0,0 2 Backside: Drain Die Speciﬁcations Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) 2N6661 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description	Original	2N6661 2N6661 A031610 2n6661 bonding pad lay-out	PDF

PAD DIMENSION Search Results

PAD DIMENSION Result Highlights (5)

PAD DIMENSION Datasheets Context Search

J412

ADN2845

MRGF

TLM563D

DS2430AX

FR4 SUBSTRATE SHEET

avx 9155

Standard EIA-481-1-A

TN0702

TP0620

VP0808

TN2435

DN2470

TP5335

VN10K

VN2410

TN2106

TN2510

TP2510

2N7002 Die Specification

DN2535

TN0610

2N6661