PACKING LIST Search Results

TE85R

Abstract: TE85L
Contextual Info: 12. Packing M e th o d 12. Packing Method 12.1 List o f Packing Forms Sm all Su p e r M in i Type SSM Packing Form Tapine Spec.Marked Applicable Package Packing Dimensions (U nit:m m ) Packing U nit Appearance TE85L a , /SlQiSS i ( Emboss system TE85R (SSM)

56mm carrier tape

Abstract: 28 pin ic TM 1628
Contextual Info: u Chapter 13 Packing Methods and Labels CHAPTER 13 PACKING METHODS AND LABELS Introduction Quality Pack Program Packing for Tubes Packing for Trays Packing for Tape and Reels Packing for Jewel Boxes Box Labeling Packages and Packing Publication Revision A 3/1/03

Contextual Info: MITSUMI Packing Packing Tube Magazine Packing List of Devices per Packing Unit The following table gives the number of devices per packing unit for each package type. Package type DIP SDIP SIP SOP SSOP 8A 8B 14A 16A 16B 18A 28A 28B 28C 22A 24A 30A 30C 32A

WNF008

Abstract: code res pack 8 SO3016 UNE008 spansion tray
Contextual Info: ‹ Chapter 10 Packing Methods and Labels CHAPTER 10 PACKING METHODS AND LABELS Introduction Quality Pack Program Packing for Tubes Packing for Trays Packing for Tape and Reels Box Labeling Packages and Packing Methodologies Handbook 1 March 2008 10-1 ‹ Chapter 10 Packing Methods and Labels

poly aluminum chloride

Abstract: rubidium radioactive
Contextual Info: ‹ Chapter 11 Chemical Content of Product Carriers and Packing Materials CHAPTER 11 CHEMICAL CONTENT OF PRODUCT CARRIERS AND PACKING MATERIALS Introduction Packing Materials Content Recyclability of Packing Materials and Product Carriers Summary of Hazardous Chemicals Not Present in Packing Materials

MD300-10A

Abstract: QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA
Contextual Info: CHAPTER 4 CHAPTER 4 4.1 PACKING STYLES AND NOTES 4.1.1 Packing Styles 4.1.2 Notes on Handling 4.2 PACKING OF IC PACKAGES 4.2.1 List of Packing 1 DIP (2) SIP, V-DIP, ZIP (3) QUIP, Piggyback (4) PGA (5) SOP, SSOP (6) TSOP (I) (II) (7) QFP, QFP (FP) (8) SVP

K660

Abstract: material content amd AMD chemical content 9002-86-2
Contextual Info: u Chapter 14 Chemical Content of Product Carriers and Packing Materials CHAPTER 14 CHEMICAL CONTENT OF PRODUCT CARRIERS AND PACKING MATERIALS Introduction Packing Materials Content Tray Recycling Program Recyclability of Packing Materials and Product Carriers

a1770

Abstract: EVD30 a3x2g7 E41871 B66298 corrugated B66298V1012T1 250 B 340 smd Transistor u cores Wound Toroids Coil
Contextual Info: Ferrites and accessories Packing Date: September 2006 Data Sheet  EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet and the information contained therein without EPCOS’ prior express consent is prohibited. Packing Packing Survey of packing modes

SC-82AB

Abstract: packing packing list
Contextual Info: MITSUMI Packing Packing List of Packing Types Packing types for each package are given in the following table. Package type TO-92 SOP SSOP VSOP TSOP MMP SOT-25 SOT-26 SC-82AB QFP 3 A 7A 8A 8B 8C 8D 8E 14A 14B 16A 16B 18A 20B 22A 24A 28A 28B 16A 20A 24A 8A

mmelf

Abstract: carton box L0 SOD-123 SOD-323F sod-323f diode ssp sot-363
Contextual Info: Packing Code List Of SSP REEL PACKING Reel Inner Box Carton Carton Size Gross Weight Reel Size PCS (PCS) (PCS) (mm) (kgs/ Carton) (inch) 370x350x200 5.6 7 Outline (Package) Green compound Packing code RZ RZG 0503 5,000 30,000 0603 4,000 24,000 96,000 370x350x200

tqfp 10x10 tray

Abstract: tqfp 14x14 tray QFN tray Tube 4-400 tray tqfp 14x14 1.4 156 QFN 12X12 LQFP 48 Package Box A7 SOT-89 HS-2000-1 QFN Shipping Trays
Contextual Info: The Operation Instruction of Packing Materials Purpose Warehouse and subcontractors according to the instruction for purchasing and incoming inspection , formulate the Operation Instruction of Packing Materials. Scope Related all packing materials in warehouse.

antistatic epe foam

Abstract: mark JS sot-25 V7100 sot89 MARK JB 150MIL 300MIL 600MIL SOT-25 JB QFP Shipping Trays TTO-220
Contextual Info: The Operation Instruction of Packing Materials PURPOSE Warehouse and Subcontractors according to the instruction for purchaseing and incoming inspection, formulate the Operation Instruction of Packing Materials. SCOPE Related all packing materials in warehouse.

EPX10

Abstract: corrugated cardboard EPCOS LABEL
Contextual Info: Packing Packing Survey of packing modes Ferrites Type Packing Para. RM cores RM 4 to RM 10 RM 12, RM 14 Blister tapes Standard trays 3.2 2.2.1 170 168 PM cores PM 50/39 to PM 114/93 Standard trays 2.2.1 168 P cores all P cores P 9 x 5 to P 22 × 13 Standard trays

TIMING DIAGRAM OF INT R

Abstract: C6000 SPRU190 TMS320C6000 programming tms320c6000
Contextual Info: Application Report SPRA551 TMS320C6000 McBSP: Data Packing Rebecca Ma Digital Signal Processing Solutions Abstract This document describes how to use the multi-channel buffered serial port McBSP in the Texas Instruments (TIä) TMS320C6000 digital signal processor (DSP) for data packing. Data packing

MSOP-08

Abstract: 1206 melf MELF dimensions DFN1006 SOT-263
Contextual Info: Packing Code List of SSP REEL PACKING Outline Package Reel Inner Box Carton Carton Size (PCS) (PCS) (PCS) (mm) (Kgs/Carton) (inch) Packing code Green compound Packing Gross Weight Reel Size 0503 5,000 30,000 150,000 370x350x200 5.6 7 RZ RZG 0603

ODIN

Abstract: avago package and packing information JESD22-C101A
Contextual Info: ODIN MOST 4 Transceiver Handling, Storage, Operating and Processing Application Note 5345 Packing The MOST4 devices are delivered in tubes and dry packing see also Storage Conditions and Maximum Storage Time . Figure 1. shows the Avago dry packing for MOST4 Transceiver.

Contextual Info: OS-CON Line-up Products list Packing specifications （SMD type） Packing specifications （Radial lead type） Recommended soldering condition Fundamental structure Characteristics Reliability Characteristics 1. OS-CONElectrical characteristics 1-1. Frequency characteristics

Contextual Info: SVPFSeries Surface mount type OS-CON Line-up Image of case size Products list Packing specifications （SMD type） Packing specifications （Radial lead type） Recommended soldering condition Fundamental structure Characteristics Reliability Technical data

Contextual Info: SEPFSeries Radial lead type OS-CON Line-up Image of case size Products list Packing specifications （SMD type） Packing specifications （Radial lead type） Recommended soldering condition Fundamental structure Characteristics Reliability Specifications

Contextual Info: OS-CON Line-up Image of case size Products list Packing specifications （SMD type） Packing specifications （Radial lead type） Recommended soldering condition Fundamental structure Characteristics Reliability Technical data Series system diagram Selection guide

Contextual Info: OS-CON Line-up Image of case size Products list Packing specifications （SMD type） Packing specifications （Radial lead type） Recommended soldering condition Fundamental structure Characteristics Reliability Technical data Series system diagram Selection guide

Contextual Info: OS-CON Line-up Image of case size Products list Packing specifications （SMD type） Packing specifications （Radial lead type） Recommended soldering condition Fundamental structure Characteristics Reliability Technical data Series system diagram Selection guide

Contextual Info: OS-CON Line-up Image of case size Products list Packing specifications （SMD type） Packing specifications （Radial lead type） Recommended soldering condition Fundamental structure Characteristics Reliability Technical data Series system diagram Selection guide

smd marking E9

Abstract: SMD e9 SEPC Series 16SEPC100M 2SEPC820MW 6SEPC560MW SMD MARKING CODE C9 16SEPC270MX List of Marking
Contextual Info: SEPCSeries Radial lead type OS-CON Line-up Update Image of case size Products list Packing specifications （SMD type） Packing specifications （Radial lead type） Recommended soldering condition Fundamental structure Characteristics Reliability Technical data