PACKAGING DIAGRAMS Search Results

sm58a

Abstract: DO215AA EIA 481-C RGP10E DO-221
Contextual Info: Packaging Information www.vishay.com Vishay General Semiconductor Packaging Information PACKAGING ORDERING CODE PREFERRED ANTI-STATIC PACKAGE CODE PACKAGE CODE 51 PACKAGING DESCRIPTION Bulk 52, 52T P DO-214AA SMB /DO-215AA (SMBG), 12 mm tape, 7" diameter plastic reel

Contextual Info: Packaging Information www.vishay.com Vishay General Semiconductor Packaging Information PACKAGING ORDERING CODE ANTI-STATIC PREFERRED PACKAGE CODE PACKAGE CODE 51 PACKAGING DESCRIPTION Bulk 52, 52T P DO-214AA SMB /DO-215AA (SMBG), 12 mm tape, 7" diameter plastic reel

EIAJ-ETX-7001

Abstract: TE-17 RB731XN T106 T108 T110 T116 T146 T148 RoHM TE25 tape reel
Contextual Info: Packaging specifications Diodes Packaging specifications surface mounting type zTaping Code Taping Code Package Package Specification Packaging Style, Direction T2R T2R T2L TE61 TL VMN2 VMD2 VMD3 EMD2 EMD3 EMD4 EMD5 TEMD5 EMD6 Embossed tape Embossed tape

EIAJ-ETX-7001

Abstract: T106 T108 T110 T116 T146 T148 TE-17 RoHM TE25 tape reel
Contextual Info: Packaging specifications Diodes Packaging specifications surface mounting type zTaping Code Ordering Unit (pcs/reel) Taping Code Package Package Specification Packaging Style, Direction T2R T2R T2R T2L TE61 TL GMD2 VMN2 VMD2 VMD3 EMD2 EMD3 EMD4 EMD5 TEMD5

intel packaging handbook 240800

Abstract: Ultrasonic cleaner circuit diagram moisture sensitive handling and packaging MIL-B-81705 intel 815 reflow profile INTEL PLCC 68 dimensions tape LEAD FRAME SURFACE MOUNT Intel Packaging Handbook 240800 solder PQFP die size PQFP moisture sensitive handling and packaging
Contextual Info: 2 8 Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs 1/22/97 10:19 AM CH08WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 8 MOISTURE SENSITIVITY/DESICCANT PACKAGING/HANDLING OF PSMCS 8.1. INTRODUCTION This chapter of the Packaging Handbook examines surface mount assembly processes and

Contextual Info: Packaging Information www.vishay.com Vishay General Semiconductor Packaging Information PACKAGING ORDERING CODE PREFERRED ANTI-STATIC PACKAGE CODE PACKAGE CODE 51 52, 52T P 2D P 2E 2M 2N 53 54 P 5A, 5AT P 5B, 5BT P 5CA P 57, 57T P 6A P 6B P 9A, 9AT P 61, 61T

sm58a

Abstract: GL348 PKG65 tvs, DO214 PKG56 TVS SMA CM RGP10E DO-214 SMA ea DO-213AA DO-214BA
Contextual Info: Packaging Information Vishay General Semiconductor Packaging Information PACKAGING ORDERING CODE ANTI-STATIC PACKAGE CODE PREFERRED PACKAGE CODE 51 52, 52T 2A 2C 2D 2E 2G 2KA 2M 53 54 4E 4F 4G 4H 55 5A, 5AT 5B, 5BT 5CA 56 57T 58 59 9AT 9C 60 61, 61T 62 63

MMST4401

Abstract: MMST4403 SST4401 SST4403 T116 T146
Contextual Info: SST4401 / MMST4401 Transistors NPN Medium Power Transistor Switching SST4401 / MMST4401 zDimensions (Unit : mm) zFeatures 1) BVCEO>40V (IC=1mA) 2) Complements the SST4403 / MMST4403. SST4401 zPackage, marking, and packaging specifications Part No. Packaging type

Contextual Info: SST4401 / MMST4401 Transistors NPN Medium Power Transistor Switching SST4401 / MMST4401 zDimensions (Unit : mm) zFeatures 1) BVCEO>40V (IC=1mA) 2) Complements the SST4403 / MMST4403. SST4401 zPackage, marking, and packaging specifications Part No. Packaging type

Contextual Info: SSTA06 / MMSTA06 Transistors NPN General Purpose Transistor SSTA06 / MMSTA06 zDimensions Unit : mm zFeatures 1) BVCEO < 80V ( IC=1mA) 2) Complements the SSTA56 / MMSTA56. SSTA06 zPackage, marking and packaging specifications Part No. SSTA06 MMSTA06 Packaging type

part r1G

Abstract: MMSTA06 MMSTA56 SSTA06 SSTA56 T116 T146
Contextual Info: SSTA06 / MMSTA06 Transistors NPN General Purpose Transistor SSTA06 / MMSTA06 zDimensions Unit : mm zFeatures 1) BVCEO < 80V ( IC=1mA) 2) Complements the SSTA56 / MMSTA56. SSTA06 zPackage, marking and packaging specifications Part No. SSTA06 MMSTA06 Packaging type

UMT222A

Abstract: TRANSISTOR 1P transistors marking 1p BC847B BC857B MMST2222A PN2222A T116 B128D MARKING 5D NPN
Contextual Info: BC847B Transistors NPN General Purpose Transistor BC847B zExternal dimensions Unit : mm zFeatures 1) BVCEO < 45V (IC=1mA) 2) Complements the BC857B. 2.9±0.2 0.95 +0.2 −0.1 1.9±0.2 zPackage, marking, and Packaging specifications Packaging type SST3 Marking

Contextual Info: BC847B Transistors NPN General Purpose Transistor BC847B zExternal dimensions Unit : mm zFeatures 1) BVCEO < 45V (IC=1mA) 2) Complements the BC857B. 2.9±0.2 0.95 +0.2 −0.1 1.9±0.2 zPackage, marking, and Packaging specifications Packaging type SST3 Marking

Contextual Info: CBS05F30 Schottky Barrier Diode Silicon Epitaxial CBS05F30 1. Applications • High-Speed Switching 2. Features 1 Low forward voltage: VF(3) = 0.38 V (typ.) (2) Thin and compact packaging: Height = 0.40mm(max) 3. Packaging and Internal Circuit 1: Cathode

Contextual Info: CBS10S40 Schottky Barrier Diode Silicon Epitaxial CBS10S40 1. Applications • High-Speed Switching 2. Features 1 Low forward voltage: VF(2) = 0.48 V (typ.) (2) Thin and compact packaging: Height = 0.40mm(max) 3. Packaging and Internal Circuit 1: Cathode

Contextual Info: CBS05F30 Schottky Barrier Diode Silicon Epitaxial CBS05F30 1. Applications • High-Speed Switching 2. Features 1 Low forward voltage: VF(3) = 0.38 V (typ.) (2) Thin and compact packaging: Height = 0.40mm(max) 3. Packaging and Internal Circuit 1: Cathode

Contextual Info: CBS10S40 Schottky Barrier Diode Silicon Epitaxial CBS10S40 1. Applications • High-Speed Switching 2. Features 1 Low forward voltage: VF(2) = 0.48 V (typ.) (2) Thin and compact packaging: Height = 0.40mm(max) 3. Packaging and Internal Circuit 1: Cathode

carrier chiller

Abstract: BRIDGE RECTIFIER SMD oscilloscopes manual SOT-353 Mark va ECL Handbook smd diode Cathode is indicated by a blue band mar TO-204aa MICROSEMI PACKAGE OUTLINE Microsemi Catalog 2000 RCA 559 TO3 MECL System Design Handbook
Contextual Info: CASERM/D Rev. 0, Sep-2000 Semiconductor Packaging and Case Outlines ON Semiconductor Reference Manual and Design Guide Semiconductor Packaging and Case Outlines Reference Manual and Design Guide CASERM/D Rev. 0, Sep–2000  SCILLC, 2000 “All Rights Reserved’’

68L SOT 353

Abstract: tip 3035 transistor C04-067 footprint jedec MS-026 TQFP SP-750 footprint jedec MS-026 TQFP 128 C0421 30014 c04090 transistor wm
Contextual Info: SECTION 11 PACKAGING Outlines and Parameters . 1 Product Tape and Reel Specifications . 58

Contextual Info: 27C512A 512K 64K x 8 CMOS EPROM TSOP 27C512A A complete family of packages is offered to provide the most flexibility in applications. For surface mount applications, PLCC, VSOP, TSOP or SOIC packaging is available. Tape or reel packaging is also available for

SMR5010C-E

Abstract: SMR5016C-E SMR5016C Fujisoku Corporation Fujisoku 16 position rotary switch fujisoku CI 7478 SMR5010C SMR5000 rotary coded switch
Contextual Info: FUJISOKU CORPORATION 1/ 10 SPECIFICATIONS ROTARY CODED SWITCH SMR5000 1 . GENERAL SPECIFICATIONS 1 Part number designation S M R 5 1 0 C — E Forni of packaging Blank : Tray packaging E : Taping (Reel) Number of steps_ 10 : 10 steps 16 : 16 steps

200B

Abstract: 27C512-12 27C512-15 27C512A
Contextual Info: 27C512A 512K 64K x 8 CMOS EPROM PACKAGE TYPES TSOP 27C512A A complete family of packages is offered to provide the most flexibility in applications. For surface mount applications, PLCC, VSOP, TSOP or SOIC packaging is available. Tape or reel packaging is also available for

Motorola MPC556

Abstract: mpc556 MPC555 AN-485-1 AAN52
Contextual Info: SECTION 2 SIGNAL DESCRIPTIONS 2.1 Packaging and Pinout Descriptions Figure 2-1 gives the case configuration and packaging information for the MPC555 / MPC556. Figure 2-2 gives the MPC555 / MPC556 pinout data. Table 2-1 gives an overview of the pins on the MPC555 / MPC556.

MPC555

Abstract: MPC556
Contextual Info: SECTION 2 SIGNAL DESCRIPTIONS 2.1 Packaging and Pinout Descriptions Figure 2-1 gives the case configuration and packaging information for the MPC555 / MPC556. Figure 2-2 gives the MPC555 / MPC556 pinout data. Table 2-1 gives an overview of the pins on the MPC555 / MPC556.