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    PACKAGE WEIGHT Search Results

    PACKAGE WEIGHT Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54ACT825/QKA
    		Rochester Electronics LLC 54ACT825/QKA - Dual marked (5962-9161101MKA), D-Type Flip-Flop, 5V, 24-CFP PDF Buy
    TPH1R306PL
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Datasheet
    TPH9R00CQH
    		Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Datasheet
    TPH9R00CQ5
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Datasheet
    TPHR8504PL
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Datasheet

    PACKAGE WEIGHT Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    1653G

    Contextual Info: v00.0909 C-20 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-20 Package Outline Drawing Package Information Package Type C-20 Package Weight [1] 16.53g Spacer Weight 4.6g [1] Does not include connectors, or mounting hardware B - 24 NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR


    Original     		PDF

    EP20K100E

    Abstract: EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA
    Contextual Info: Altera Device Package Information August 2000, ver. 8.03 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		49-pin 169-pin EP20K100E EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA PDF

    transistors BC 458

    Abstract: 240 pin rqfp drawing ep600i BC 458 256-pin BGA drawing EPM7032-44 transistor BC 458 tqfp 44 thermal resistance datasheet epm7064s cross reference BGA PACKAGE thermal resistance
    Contextual Info: Altera Device Package Information August 1999, ver. 8 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		PDF

    ep600i

    Abstract: JEDEC MS-034-AAJ-1 BGA Package 172 EP1800 MS-034 AAF-1 192PGA pdip 24 altera AP672 EP610 epm9560 die
    Contextual Info: Altera Device Package Information May 2001, ver. 9.1 Introduction Data Sheet This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		PDF

    100P6S-A

    Abstract: LQFP100-P-1414-0 LQFP144-P-2020-0 QFP100-P-1420-0 PAD108
    Contextual Info: Under development Preliminary specification Specifications in this manual are tentative and subject to change. Package Dimensions M32C/85 Group Package Dimensions Recommended EIAJ Package Code LQFP144-P-2020-0.50 Plastic 144pin 20✕20mm body LQFP Weight g


    Original     		M32C/85 LQFP144-P-2020-0 144pin 2020mm 144P6Q-A 100P6S-A QFP100-P-1420-0 LQFP100-P-1414-0 100P6Q-A REJ09B0037-0030Z 100P6S-A PAD108 PDF

    100P6S-A

    Abstract: LQFP100-P-1414-0 LQFP144-P-2020-0 QFP100-P-1420-0 PAD108
    Contextual Info: Under development Preliminary specification Specifications in this manual are tentative and subject to change. Package Dimensions M32C/84 Group Package Dimensions Recommended EIAJ Package Code LQFP144-P-2020-0.50 Plastic 144pin 20✕20mm body LQFP Weight g


    Original     		M32C/84 LQFP144-P-2020-0 144pin 2020mm 144P6Q-A 100P6S-A QFP100-P-1420-0 LQFP100-P-1414-0 100P6Q-A REJ09B0036-0041Z 100P6S-A PAD108 PDF

    lead frame cu C194

    Abstract: SB203 chip led C194 ICM7212AMIPL mold compound copper bond wire mold components
    Contextual Info: Environmental Management and Materials Information Product Content Information for: ICM7212AMIPL No Lead−Free Qualified Moisture Sensitivity Level L1 Package Code Package Type Body Size Package Option Pin Count P40−1 PDIP .600" Standard 40 Lead Form1 Unit Weight


    Original     		ICM7212AMIPL P40-1 UL-94 lead frame cu C194 SB203 chip led C194 ICM7212AMIPL mold compound copper bond wire mold components PDF

    TSSOP-56

    Abstract: resin compound bond wire gold
    Contextual Info: Fairchild Semiconductor Product Package Material Disclosure Package Type Weight of Package grams Component TSSOP-56 Lead Frame Copper alloy Maximum Minimum Material 2.21E-01 2.08E-01 Weight in grams Substance in material 7.37E-02 Copper Nickel Silicon Magnesium


    Original     		TSSOP-56 21E-01 08E-01 28E-01 84E-03 90E-03 22E-04 39E-03 37E-02 TSSOP-56 resin compound bond wire gold PDF

    LQFP80-P-1212-0

    Contextual Info: Under development Preliminary specification Specifications in this manual are tentative and subject to change. M16C/28 Group 20. Package 20. Package Recommended EIAJ Package Code LQFP64-P-1010-0.50 Plastic 64pin 10✕10mm body LQFP Weight g – Lead Material


    Original     		M16C/28 LQFP64-P-1010-0 64pin 1010mm 80pin 1212mm LQFP80-P-1212-0 64P6Q-A REJ09B0047-0060Z PDF

    100P6S-A

    Abstract: QFP100-P-1420-0
    Contextual Info: Under development This document is under development and its contents are subject to change. M16C/6N5 Group Package Dimension Package Dimension 100P6S-A MMP EIAJ Package Code QFP100-P-1420-0.65 Plastic 100pin 14✕20mm body QFP Weight g 1.58 Lead Material


    Original     		M16C/6N5 100P6S-A QFP100-P-1420-0 100pin 1420mm 100P6S-A PDF

    100P6S-A

    Abstract: QFP100-P-1420-0
    Contextual Info: Under development This document is under development and its contents are subject to change. M16C/6N4 Group Package Dimension Package Dimension 100P6S-A MMP EIAJ Package Code QFP100-P-1420-0.65 Plastic 100pin 14✕20mm body QFP Weight g 1.58 Lead Material


    Original     		M16C/6N4 100P6S-A QFP100-P-1420-0 100pin 1420mm 100P6S-A PDF

    100P6S-A

    Abstract: LQFP100-P-1414-0 LQFP128-P-1420-0 QFP100-P-1420-0 128P6Q-A
    Contextual Info: Renesas microcomputers M16C / 62P Group Package Dimensions SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Package Dimensions MMP 100P6S-A EIAJ Package Code QFP100-P-1420-0.65 Plastic 100pin 14✕20mm body QFP Weight g 1.58 Lead Material Alloy 42 MD e JEDEC Code –


    Original     		16-BIT 100P6S-A QFP100-P-1420-0 100pin 1420mm LQFP100-P-1414-0 1414mm 100P6Q-A 128pin 100P6S-A LQFP128-P-1420-0 128P6Q-A PDF

    P127

    Abstract: P-MFP018 42-alloy P-TSOP050-0400 P-TSOP048-1220
    Contextual Info: PACKAGE OUTLINES Unit : mm P-SOP008-0225 M TYP. 5.05 (1.05) 0.65 0−10゜ 0.1 Seating plane 0.65±0.2 Epoxy resin 42Alloy Solder plating 10 0.07 Package material Lead frame material Lead finishing・material Solder plating thickness (ı) Package weight (n)


    Original     		P-SOP008-0225 42Alloy P-SOP014-0225 P-SOJ040-0400 P127 P-MFP018 42-alloy P-TSOP050-0400 P-TSOP048-1220 PDF

    PSOP-28

    Abstract: SOP28 package FPT-28P-M17 P-SOP28-8
    Contextual Info: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC FPT-28P-M17 28-pin plastic SOP Lead pitch 1.27 mm Package width x package length 8.6 × 17.75 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 2.80 mm MAX Weight


    Original     		FPT-28P-M17 28-pin P-SOP28-8 FPT-28P-M17) F28048S-c-3-4 PSOP-28 SOP28 package FPT-28P-M17 PDF

    SMD MARKING CODE 071 A01

    Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
    Contextual Info: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods


    Original     		LCC-26P-M09 LCC-28P-M04 LCC-28P-M05 LCC-28P-M06 LCC-28P-M07 LCC-28C-A04 LCC-32P-M03 LCC-40P-M01 LCC-42P-M01 SMD MARKING CODE 071 A01 smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo PDF

    100P6S-A

    Abstract: LQFP100-P-1414-0 LQFP144-P-2020-0 QFP100-P-1420-0 PAD108
    Contextual Info: Package Dimensions M32C/83 Group Package Dimensions Recommended EIAJ Package Code LQFP144-P-2020-0.50 Plastic 144pin 20✕20mm body LQFP Weight g 1.23 JEDEC Code – Lead Material Cu Alloy MD e 144P6Q-A b2 D ME HD 144 109 1 l2 Recommended Mount Pad 108 36


    Original     		M32C/83 LQFP144-P-2020-0 144pin 2020mm 144P6Q-A 100P6S-A QFP100-P-1420-0 LQFP100-P-1414-0 100P6Q-A REJ09B0034-0120Z 100P6S-A PAD108 PDF

    package

    Abstract: AON5812 AON5810 alpha solder paste PROFILE
    Contextual Info: Document No. DSMT-0002 Rev. 1 Page: 1/1 PCB Land Design and Surface Mount for DFN2x5 Punched Package Introduction DFN package is a plastic encapsulated package with a copper lead frame substrate. It offers near chip scale footprint, thin profile, low weight and good thermal and electrical performance.


    Original     		DSMT-0002 AON5810, AON5812) package AON5812 AON5810 alpha solder paste PROFILE PDF

    LQFP32-P-0707-0

    Abstract: 32P6U-a
    Contextual Info: R8C/10 Group Appendix 1. Package Dimensions Appendix 1. Package Dimensions 32P6U-A MMP Plastic 32pin 7✕7mm body LQFP Weight g JEDEC Code – Lead Material Cu Alloy MD b2 HD D 32 ME e EIAJ Package Code LQFP32-P-0707-0.80 25 I2 24 Recommended Mount Pad Symbol


    Original     		R8C/10 32P6U-A 32pin LQFP32-P-0707-0 32P6U-a PDF

    SSOP42-P-450-0

    Contextual Info: APPENDIX 3.9 Package outline 3.9 Package outline 42P2R-A Plastic 42pin 450mil SSOP EIAJ Package Code SSOP42-P-450-0.80 Weight g 0.63 JEDEC Code – Lead Material Alloy 42/Cu Alloy e b2 22 Caution ! E HE e1 I2 42 F Symbol TBD 21 1 A D Recommended Mount Pad


    Original     		42P2R-A 42pin 450mil SSOP42-P-450-0 42/Cu 42P2R-A 42P4in 42S1B-A 600mil PDF

    32P6U-A

    Contextual Info: R8C/11 Group Appendix 1. Package Dimensions Appendix 1. Package Dimensions 32P6U-A MMP Plastic 32pin 7✕7mm body LQFP Weight g JEDEC Code – Lead Material Cu Alloy MD b2 HD D 32 ME e EIAJ Package Code LQFP32-P-0707-0.80 25 I2 24 Recommended Mount Pad Symbol


    Original     		R8C/11 32P6U-A 32pin LQFP32-P-0707-0 32P6U-A PDF

    100P6S-A

    Abstract: LQFP100-P-1414-0 LQFP144-P-2020-0 QFP100-P-1420-0 JEDEC Code PAD108
    Contextual Info: Package Dimensions M32C/82 Group Package Dimensions 144P6Q-A Plastic 144pin 20✕20mm body LQFP Weight g 1.23 JEDEC Code – Lead Material Cu Alloy MD e EIAJ Package Code LQFP144-P-2020-0.50 b2 D ME HD 144 109 1 l2 Recommended Mount Pad 108 36 A A1 A2 b c


    Original     		M32C/82 144P6Q-A 144pin 2020mm LQFP144-P-2020-0 100P6S-A LQFP100-P-1414-0 100P6Q-A 100P6S-A QFP100-P-1420-0 JEDEC Code PAD108 PDF

    QFP64-P-1414-0

    Abstract: SDIP64-P-750-1 3804 f
    Contextual Info: APPENDIX 3.6 Package outline 3.6 Package outline 64P6N-A Plastic 64pin 14✕14mm body QFP EIAJ Package Code QFP64-P-1414-0.80 Weight g 1.11 Lead Material Alloy 42 MD e JEDEC Code – HD 64 b2 ME D 49 1 I2 48 Recommended Mount Pad HE E Symbol 33 16 A 32 L1


    Original     		64P6N-A 64pin 1414mm QFP64-P-1414-0 64P4B 750mil SDIP64-P-750-1 3804 f PDF

    QFP64-P-1414-0

    Abstract: SDIP64-P-750-1
    Contextual Info: APPENDIX 3.6 Package outline 3.6 Package outline 64P6N-A Plastic 64pin 14✕14mm body QFP EIAJ Package Code QFP64-P-1414-0.80 Weight g 1.11 Lead Material Alloy 42 MD e JEDEC Code – HD 49 b2 64 ME D 1 48 I2 HE E Recommended Mount Pad Symbol A A1 A2 b c D


    Original     		64P6N-A 64pin 1414mm QFP64-P-1414-0 64P4B LQFP64-P-1414-0 SDIP64-P-750-1 PDF

    SSOP42-P-450-0

    Contextual Info: APPENDIX 3.6 Package outline 3.6 Package outline MMP 42P4B EIAJ Package Code SDIP42-P-600-1.78 Plastic 42pin 600mil SDIP Weight g 4.1 Lead Material Alloy 42/Cu Alloy 22 1 21 E 42 e1 c JEDEC Code – Symbol L A1 A A2 D e b1 b2 b SEATING PLANE A A1 A2 b b1


    Original     		42P4B SDIP42-P-600-1 42pin 600mil 42/Cu 42P2R-A/E 450mil SSOP42-P-450-0 42S1B-A PDF