PACKAGE WEIGHT Search Results

1653G

Contextual Info: v00.0909 C-20 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-20 Package Outline Drawing Package Information Package Type C-20 Package Weight [1] 16.53g Spacer Weight 4.6g [1] Does not include connectors, or mounting hardware B - 24 NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR

tensolite

Contextual Info: v01.0310 C-11 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-11 Package Outline Drawing Package Information NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. PLATING: GOLD PLATE OVER NICKEL PLATE Package Type C-11 Package Weight [1] 20 gms [2] 4. ALL DIMENSIONS ARE IN INCHES [MILLIMETERS].

tensolite

Abstract: 231CCSF tensolite price 231CC
Contextual Info: v01.0310 C-10 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-10 Package Outline Drawing Typical Package Weight Package 18.7 gms Spacer 3.3 gms +/- 1 gms Tolerance NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. FINISH: GOLD PLATE OVER NICKEL PLATE

tensolite

Contextual Info: v01.0310 C-5 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-5 Package Outline Drawing Typical Package Weight Package 17.7 gms Spacer 2.6 gms NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. FINISH: GOLD PLATE OVER NICKEL PLATE 3. MOUNTING SPACER: NICKEL PLATED ALUMINUM

tensolite

Abstract: tensolite price
Contextual Info: v01.0310 C-9 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-9 Package Outline Drawing Typical Package Weight Package 18.7 gms Spacer 3.3 gms NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. FINISH: GOLD PLATE OVER NICKEL PLATE 3. ALL DIMENSIONS ARE IN INCHES [MILLIMETERS]

tensolite

Abstract: tensolite* connec 5ccs
Contextual Info: v01.0310 C-6 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-6 Package Outline Drawing Typical Package Weight Package 17.4 gms Spacer 3 gms NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. PLATING: ELECTROLYTIC GOLD 50 MICROINCHES MIN., OVER ELECTROLYTIC NICKEL 75 MICROINCHES MIN

tensolite

Abstract: 231CCSF
Contextual Info: v00.0406 C-10 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-10 Package Outline Drawing Typical Package Weight Package 18.7 gms Spacer 3.3 gms +/- 1 gms Tolerance NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. SPACER MATERIAL: ALUMINUM 3. PLATING: ELECTROLYTIC GOLD 50 MICROINCHES MIN., OVER

100 PIN "PGA" ALTERA DIMENSION

Contextual Info: Altera Device Package Information June 1996, ver. 6 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in ascending pin count order.

altera ep610

Abstract: EPM5130 240 PIN QFP ALTERA DIMENSION epm7064s cross reference 192PGA EPF10K100 EPF10K20 EPF10K30 EPF10K40 EPF10K50
Contextual Info: Altera Device Package Information June 1996, ver. 6 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in ascending pin count order.

208 pin rqfp drawing

Abstract: 240 pin rqfp drawing BGA 144 MS-034 AAL-1 bga package weight 192 BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information April 2002, ver. 10.2 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

LGA 1156 PIN OUT diagram

Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
Contextual Info: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)

EP20K100E

Abstract: EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA
Contextual Info: Altera Device Package Information August 2000, ver. 8.03 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package 2 D PAK Package Weight mg 1700 Product Group Type No. SB820D –SB8200D SB820DC –SB8200DC SB1020D –SB10200D SB1020DC –SB10200DC SB1620D –SB16200D SB1620DC –SB16200DC

transistors BC 458

Abstract: 240 pin rqfp drawing ep600i BC 458 256-pin BGA drawing EPM7032-44 transistor BC 458 tqfp 44 thermal resistance datasheet epm7064s cross reference BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information August 1999, ver. 8 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

weight

Abstract: PLCC weight
Contextual Info: Package Outlines - Integrated Circuits Dimensions in mm 68-Pin PLCC Package Weight approx. 4.8 g 61 W rnjiJTi 10 -e 26 JUUUUUULTT 27 -2 5 * I 44-Pin PLCC Package Weight approx. 2.5 g 80-Pin QFP Plastic Package Weight approx. 1.61 g - 2 3 x 0 .8 = 18.4- 65 EE

BC 1098

Abstract: EPM7384 ALTERA 68 PLCC t187
Contextual Info: Altera Device Package Information June 1998, ver. 7.01 Introduction Data Sheet This data sheet provides the following package information for all Altera¨ devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

diode switching

Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package SOT-363 Package Weight mg 6 Product Group Type No. RB731XN SD103ATW BAT54ADW / CDW / SDW BAT54BRW, BAT54TW BAS16TW, BAV70DW, BAV99BRW, BAV756DW BAW56DW, BAW567DW, MMBD4148TW

Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package KBPC-PW Package Weight mg 18000 Product Group Type No. KBPC1000PW – KBPC1012PW KBPC1500PW – KBPC1512PW KBPC2500PW – KBPC2512PW KBPC3500PW – KBPC3512PW KBPC4000PW – KBPC4012PW

Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package KBPC-S Package Weight mg 21000 Product Group Type No. GBPC1000S – GBPC1016S KBPC1000S – KBPC1012S GBPC1500S – GBPC1516S KBPC1500S – KBPC1512S GBPC2500S – GBPC2516S

Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package ITO-220 Package Weight mg 1900 Product Group Type No. SB620FCT – SB6100FCT SB820FCT – SB8200FCT SB1020FCT – SB10200FCT SB1620FCT – SB16200FCT SB2020FCT – SB20200FCT

Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package GBPC-W Package Weight mg 18000 Product Group Type No. GBPC1000W – GBPC1016W GBPC1500W – GBPC1516W GBPC2500W – GBPC2516W GBPC3500W – GBPC3516W GBPC4000W – GBPC4016W

Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package KBPC-W Package Weight mg 28000 Product Group Type No. KBPC1000W – KBPC1012W KBPC1500W – KBPC1512W KBPC2500W – KBPC2512W KBPC3500W – KBPC3512W KBPC4000W – KBPC4012W

Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package KBPC-P Package Weight mg 21000 Product Group Type No. KBPC1000P – KBPC1012P KBPC1500P – KBPC1512P KBPC2500P – KBPC2512P KBPC3500P – KBPC3512P KBPC4000P – KBPC4012P

Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package MiniMELF Package Weight mg 30 Product Group Type No. LL4148 GLZ Series ZMM5221B – ZMM5266B ZMM55C2V4 – ZMM55C75 Component Die Doped Silicon* Dumet Wire Ferrous Alloy