PACKAGE STYLE 51 Search Results

gunther 3570.1301

Abstract: gunther reed relay 3570 Gunther - 3570 MSS4 relay 3570 gunther gunther relay. 3700 gunther reed relay 35631231 3565.1231
Contextual Info: REED RELAY DIMENSIONS PACKAGE STYLE 7 PACKAGE STYLE 8 Comus International 454 Allwood Road Clifton New Jersey 07012 U.S.A Tel: 1 973 - 777 - 6900 Fax:(1)973 - 777 - 8405 email: info@comus-intl.com internet: http://www.comus-intl.com PACKAGE STYLE 9 Assemtech Europe Limited

IC 8021-2

Abstract: onida DVD player circuit diagram HFBR5106 HFBR-5106 HFBR-5106T HFBR-5107 HFBR-510X
Contextual Info: 100VG-AnyLAN Multimode Fiber Transceivers in Low Cost 1x9 Package Style Technical Data Features • Full Compliance with the Optical Performance Requirements of the IEEE 802.12 • Multisourced 1x9 Package Style with Choice of Duplex SC or ST Receptacles

IC 8021-2

Abstract: HFBR5106 HFBR-5106 HFBR-5106T HFBR-5107 HFBR-510X Hewlett-Packard LED 2 SD 106 AI
Contextual Info: 100VG-AnyLAN Multimode Fiber Transceivers in Low Cost 1x9 Package Style Technical Data Features • Full Compliance with the Optical Performance Requirements of the IEEE 802.12 • Multisourced 1x9 Package Style with Choice of Duplex SC or ST Receptacles

MP816

Abstract: MP850 MP825 MP808 resistance 220 ohm resistor 220 ohm mp850 150
Contextual Info: MP808 / MP825 TO-126 style and MP816 / MP850 (TO-220 style) Kool-Pak Power Film Resistors Page 1 of 2 TO-126 and TO-220 Style Power Packages - Non-Inductive Designs Use your thermal design experience with power semiconductors in the TO-220 and TO-126 style power package. This

M7T33

Abstract: TO3VAR package 50Z50
Contextual Info: REGULATOR DIODES, 2 0 W OR MORE Item Number Part Number Vz Nom. V @ Iz (A) Po Max (W) Tol. Zz Max % Ohms Package Style Item Number Part Number Vz Nom. (V) @ Iz (A) Po Max (W) Tol. Zz Max % Ohms Package Style Zener Regulators, PD 20 Watts or More (Cont'd) Zener Regulators, PD 20 Watts or More (Cont'd)

TFH85P330RJE

Abstract: 10R2 400M TFH85P15R0JE
Contextual Info: TFH Series 85 Watt TO264 Package Thick Film Power 0.79" 20.07mm P style (standard) 0.20" (5.08mm) M style (optional) 0.25" (6.35mm) 1.03" (26.16mm) FEATURES SPECIFICATIONS • 85 Watt power rating at 25°C case temperature • Non-inductive performance • Low thermal resistance

MRF5003

Contextual Info: MRF5003 VHF POWER MOSFET DESCRIPTION: PACKAGE STYLE The ASI MRF5003 is common source device, designed for broadband amplifier applications at frequencies to 520 MHz. FEATURES: • PG = 9.5 dB @ 3.0 W 512 MHz • Surface mount package MAXIMUM RATINGS ID 8.0 A

MP725

Abstract: Power Film Resistors IL101
Contextual Info: MP725 Surface Mount Power Film Resistors www.caddock.com D-Pak Style Surface Mount Power Package including Metal Tab - 0.020 ohm to 1.00 Kohm Use your thermal design experience with power semiconductors in D-Pak style power packages. This experience will help you get the most out

LTL-93BEK1

Abstract: 93BYA1 697 SMD LTL-93BCK1 LTL-93BYK1 93BPA axial DIODE 517 LTL93BGK1
Contextual Info: Subminiature Solid State Lamps LTL-93BCK1/CA1 LTL-93BGK1/GA1 LTL-93BPK1/PA1 LTL-93BYK1/ YA1 LTL-93BEK1/HRA1 Features AIGaAs Red Green Bright Red Yellow Red Orange Package Dimensions Subminiature package style. Low package profile. Axial leads. Wide viewing Angle.

Contextual Info: Common Mode Inductors Designed to prevent noise emission in switching power supplies at input. Windings balanced to 1% Isolation 2500 V RMS R. UU Style UU Style Schematic "UU" Package Dimensions in inches mm Size 1 0 ; i 6. o; .709 is. o; TYP TYP -0 6 [21.5;

C 5478 transistor

Abstract: 12205 transistor RF TRANSISTOR K 2191 IC AT 6884 transistor 7929 TRANSISTOR NPN 6822
Contextual Info: NPN SILICON TRANSISTOR NE894M13 OUTLINE DIMENSIONS Units in mm FEATURES • PACKAGE OUTLINE M13 NEW MINIATURE M13 PACKAGE: – Small transistor outline – 1.0 X 0.5 X 0.5 mm – Low profile / 0.50 mm package height – Flat lead style for better RF performance

nec 16312

Abstract: 2SC5800 NE851M03 NE851M03-T3 S21E nec 9701
Contextual Info: NEC's NPN SILICON TRANSISTOR NE851M03 OUTLINE DIMENSIONS Units in mm FEATURES • PACKAGE OUTLINE M03 NEW MINIATURE M03 PACKAGE: – Small transistor outline – Low profile / 0.59 mm package height – Flat lead style for better RF performance IDEAL FOR ≤ 3 GHz OSCILLATORS

NSR01L30NXT5G

Contextual Info: NSR01L30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN

NSR02F30NXT5G

Contextual Info: NSR02F30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN

NSR01F30NXT5G

Contextual Info: NSR01F30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN

NSR02L30NXT5G

Abstract: 0201 footprint
Contextual Info: NSR02L30NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No−lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN

Contextual Info: RURU50120 Semiconductor 50A, 1200V Ultrafast Diode April 1995 Package Features • Ultrafast with Soft Recovery.< 125ns SINGLE LEAD JEDEC STYLE TO-218 • Operating

ic 7738

Contextual Info: PRELIMINARY DATA SHEET NPN SILICON TRANSISTOR NE851M13 OUTLINE DIMENSIONS Units in mm FEATURES • PACKAGE OUTLINE M13 NEW MINIATURE M13 PACKAGE: – Small transistor outline – 1.0 X 0.5 X 0.5 mm – Low profile / 0.50 mm package height – Flat lead style for better RF performance

ic 7738

Contextual Info: PRELIMINARY DATA SHEET NPN SILICON TRANSISTOR NE851M13 OUTLINE DIMENSIONS Units in mm FEATURES • PACKAGE OUTLINE M13 NEW MINIATURE M13 PACKAGE: – Small transistor outline – 1.0 X 0.5 X 0.5 mm – Low profile / 0.50 mm package height – Flat lead style for better RF performance

Contextual Info: GRAYHILL INC S7E d o t so LIP iT Â ïi m,L D • OOGa^b Dû H6RH A Z A - v ? * T * ^ S 'S \ STYLE V 1.000 25,4 .300 (7,62) 1.200 STYLE K FEATURES (30,48) ' T • DC Load Switching in the Popular Package Outlines and Terminations • Optically Isolated

IC 4011

Abstract: 4006 DATA SHEET IC 4011 ic 4013 DATASHEET CSTLS4M00G53-B0 CSTS0400MG03 HD6437049 TC4069UBP
Contextual Info: Technical Data of Ceramic Resonator * New Part No. Previous Part No. : CSTLS4M00G53-B0 : CSTS0400MG03 Applied to HD6437049 Note: Suffix indicates packaging style. •Lead type -A0 : Flat pack package(Ho=18mm) -B0 : Bulk ·SMD type -R0 : Plastic tape package(∅=180mm)

CSTLS8M00G53-B0

Abstract: HD6437049 TC4069UBP
Contextual Info: Technical Data of Ceramic Resonator * New Part No. Previous Part No. : CSTLS8M00G53-B0 : CSTS0800MG03 Applied to HD6437049 Note: Suffix indicates packaging style. •Lead type -A0 : Flat pack package(Ho=18mm) -B0 : Bulk ·SMD type -R0 : Plastic tape package(∅=180mm)

X6866D

Abstract: EPCOS SAW X6966M X6965M EPCOS SAW X6855M X6857D x6966m
Contextual Info: RF3330 RF3330IF Gain Controlled Amplifier IF GAIN CONTROLLED AMPLIFIER RoHS Compliant & Pb-Free Product Package Style: SOT23-8 Features „ „ „ „ Single 5V Positive Power Supply 26dB Gain Range 150MHz Bandwidth Compact Package Applications „ „ „ VCC 1

Contextual Info: AT9001 SILICON VARACTOR DIODE DESCRIPTION: The AT9001 is an Abrupt PN Junction Tuning Varactor designed so the capacitance-voltage relationship closely approximates Square Law n=0.5 . PACKAGE STYLE 51 FEATURES: • Available in several other packages upon request.