PACKAGE ON PACKAGE CHIPS Search Results

FF1152

Abstract: UG002 BG728 BF957 FG676 led flip-chip CS144 FG256 BGA Package
Contextual Info: R Chapter 4: PCB Design Considerations Package Specifications This section contains specifications for the following Virtex-II packages: 426 • "CS144 Chip-Scale BGA Package 0.80 mm Pitch " on page 427 • "FG256 Fine-Pitch BGA Package (1.00 mm Pitch)" on page 428

Contextual Info: LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Features * Blue and Yellow chips are matched for uniform light output. * T-1 type package. * Long life-solid state reliability. * Low power consumption. * Lead Pb free product – RoHS compliant. Package Dimensions

Contextual Info: LITE-ON TECHNOLOGY CORPORATION. Property of Lite-On Only Features * Red Orange and Green chips are matched for uniform light output. * T-1 3/4 type package. * Long life-solid state reliability. * Low power consumption. Package Dimensions Part No. Lens Source Color

LTL30EKLJ

Contextual Info: LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Features * Blue and Super Red chips are matched for uniform light output. * T-1 3/4 type package. * Long life-solid state reliability. * Low power consumption. Package Dimensions Part No. Lens Source Color

W-CSP footprint

Abstract: MO-211-C DM056 wcsp package reliability WLCSP stencil design EH11 wcsp wcsp qualification WAN0158
Contextual Info: w WAN_0202 Guidelines on How to Use W-CSP Packages and Create Associated PCB Footprints INTRODUCTION The Wolfson Wafer level ChipScale Package W-CSP is a die-sized package, which obtains electrical contact via solder bumps on the bottom surface of the device to a Printed Circuit Board

Contextual Info: Part Number: ZCBDDGKME107SC2 5.0mm x 5.0mm FULL-COLOR SURFACE MOUNT LED LAMP www.SunLED.com Package Schematics Features ● Ideal for indication light on hand held products ● Long life and robust package ● Standard Package: 500pcs/ Reel ● MSL Moisture Sensitivity Level : 3

ARL-5060WYC3

Abstract: h238 0175Y
Contextual Info: ARL-5060WYC3 WarmWhite H238 Features • Chips can be controlled separately. • Suitable for all smt assembly and Solder process. • Available on tape and reel. • Package: 1000pcs / reel. Package Dimensions Description • The White source color devices are

MVL-504B3A

Contextual Info: DUAL COLOR INDICATOR LAMP T-1 3/4 PACKAGE SOLID STATE LAMP Description MVL-504B3A Package Dimensions Unit: mm inches The MVL-504B3A is a water clear narrow viewing angle, dual chips, utilizing Gallium Arsenide Phosphide on Gallium Phosphide yellow light emitting

MVL-504B6A

Abstract: ic 565 features
Contextual Info: DUAL COLOR INDICATOR LAMP T-1 3/4 PACKAGE SOLID STATE LAMP Description MVL-504B6A Package Dimensions Unit: mm inches The MVL-504B6A is a water clear narrow viewing angle, dual chips, utilizing Gallium Phosphide on Gallium Phosphide green light emitting diode and

Contextual Info: surfee-leds PACKAGE: SOT-23 CONSTRUCTION: Epoxy Lens Molded on Lead Frame FEATURES • • • • Standard SOT-23 package Low cost construction Frame handles multiple chips Choice of colors, bi-color APPLICATIONS • PCB fault/status indicator • Data pad, graphics backlighting

ARM926EJ-S

Abstract: AUO lcd module LED ipad data sheet 0.65mm pitch BGA socket AUO lcd module VIA ARM926EJ-S AMBA AXI IMX* Sony ARM926EJ-S electrical characteristic AUO lcd driver
Contextual Info: Freescale Semiconductor Data Sheet, Advance Information Document Number: MCIMX27 Rev. 0.1, 7/2007 i.MX27 This document contains information on a new product. Specifications and information herein are subject to change without notice. Package Information Plastic Package

LTL30EG

Abstract: LTL-30EG
Contextual Info: T-1 3/ 4 5mm Common Cathode Indicator Lamp LTL- 30EG Dual Green Features Package Dimensions T-1 3/4 type package. Long life solid state reliability. Low power consumption. Description The Green LTL-30EG bipolar lamp is a Green diffused, dual chips, utilizing Gallium Phosphide on Gallium Phosphide Green Light Emitting Diode.

Contextual Info: TL7702B, TL7705B, TL7702BY, TL7705BY SUPPLY VOLTAGE SUPERVISORS SLVS037D - SEPTEMBER 1989 - REVISED AUGUST 1995 Power-On Reset Generator TL77xxBC . . . P OR D PACKAGE TL77xxBM . . . JG PACKAGE Automatic Reset Generation After Voltage Drop TOP VIEW RESET Output Defined From Vcc 2 1 V

LTL-1BEDJ

Contextual Info: LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Features * Yellow and Green chips are matched for uniform light output. * Long life solid state reliability. * Low power consumption. * I.C. compatible. * Pb Free and RoHS compliant. Package Dimensions

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: MC9328MX1 Rev. 7, 12/2006 MC9328MX1 Package Information Plastic Package Case 1304B-01 MAPBGA–225 MC9328MX1 Ordering Information See Table 1 on page 3 1 Introduction The i.MX Family of applications processors provides a

LTL-1BEHJ

Contextual Info: LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Features * Red Orange and green chips are matched for uniform light output. * Long life-solid state reliability. * Low power consumption. * I.C. compatible. * Pb Free and RoHS compliant. Package Dimensions

XTAL16M

Abstract: CNC MACHINE ELECTRICAL DIAGRAM PC11 Sharp ARM920T MC9328MXL MC9328MXLDVM20 MC9328MXLVM15 MC9328MXLVM20 MAPBGA-225 sharp lcd panel pinout
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: MC9328MXL Rev. 8, 12/2006 MC9328MXL Package Information Plastic Package Case 1304B-01 MAPBGA–225 MC9328MXL Ordering Information See Table 1 on page 3 1 Introduction The i.MX Family of applications processors provides a

MX 13002

Abstract: ARM920T MC9328MXS MC9328MXSCVP10 MC9328MXSVP10 AN2537 1020T
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: MC9328MXS Rev. 3, 12/2006 MC9328MXS Package Information Plastic Package Case 1304B-01 MAPBGA–225 MC9328MXS Ordering Information See Table 1 on page 3 1 Introduction The i.MX Family of applications processors provides a

Contextual Info: Ordering number : EISB*0007 Ultrathin Miniature Package ISB-A30-0 4 P-channel MOSFETs for the Charger Circuit for Portable Electronic Devices Overview The ISB-A30-0 is a SANYO’S original SIP System In Package IC that includes four low on-resistance P-channel

LTL-30EDJ

Contextual Info: LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Features * Yellow and Green chips are matched for uniform light output. * T-1 3/4 type pakage. * Long life-solid state reliability. * Low power consumption. * Pb free and RoHS compliant. Package Dimensions

2SA1344

Abstract: FC115
Contextual Info: Ordering number:EN3083 FC115 PNP Epitaxial Planar Silicon Composite Transistor Switching Applications Features Package Dimensions • On-chip bias resistors R1=10kΩ, R2=10kΩ · Composite type with 2 transistors contained in the CP package currently in use, improving the mounting efficiency greatly.

2SC3396

Abstract: FC112
Contextual Info: Ordering number:EN3080 FC112 NPN Epitaxial Planar Silicon Composite Transistor Switching Applications Features Package Dimensions • On-chip bias resistors R1=22kΩ, R2=22kΩ · Composite type with 2 transistors contained in the CP package currently in use, improving the mounting efficiency greatly.

2SC3398

Abstract: FC114
Contextual Info: Ordering number:EN3082 FC114 NPN Epitaxial Planar Silicon Composite Transistor Switching Applications Features Package Dimensions • On-chip bias resistors R1=10kΩ, R2=10kΩ · Composite type with 2 transistors contained in the CP package currently in use, improving the mounting efficiency greatly.

EN3077

Abstract: 2SA1342 FC109 marking109
Contextual Info: Ordering number:EN3077 FC109 PNP Epitaxial Planar Silicon Composite Transistor Switching Applications Features Package Dimensions • On-chip bias resistors R1=22kΩ, R2=22kΩ · Composite type with 2 transistors contained in the CP package currently in use, improving the mounting efficiency greatly.