PACKAGE MOTOR Search Results

motorola ECL

Abstract: MCM10145 "motorola ecl" MCM10415 MC10H145 mcm10147 MCM10143 MCM10144 MCM10146 MCM10148
Contextual Info: Memories - Bipolar Random Access Memories RAMs CERAMIC PACKAGE CASE 620 CERAMIC PACKAGE CASE 623 PLASTIC PACKAGE CASE 648 CERAMIC PACKAGE CASE 650 PLASTIC PACKAGE CASE 708 CERAMIC PACKAGE CASE 748 ECL10K/10KH Emitter-coupfed logic (ECL) represents today’s fastest logic form; ECL mem ories com plem ent this characteristic. Motorola ECL RAMs

304-pin dimensions bga

Contextual Info: 1. 7 PowerPC 604e Microprocessor Package Description The following sections provide the package parameters and the mechanical dimensions for the 604e. 1.7.1 M o t o r o la C 4 - C Q F P P a c k a g e D e s c r ip t io n The following sections provide the package parameters and mechanical dimensions for the Motorola C4CQFP package.

Contextual Info: 1109252 52 PIN PLCC PACKAGE MOTOROLA MC68HC11E9 TO 56 PIN SDIP PACKAGE FEATURES: • Allows placing an PLCC package part on a board laid out for a shrink dip. SPECIFICATIONS: • Board material is .062 [1.58] thick FR-4 with 1 oz. Copper traces, both sides.

MC68HC11E9

Contextual Info: 1109252 52 PIN PLCC PACKAGE MOTOROLA MC68HC11E9 TO 56 PIN SDIP PACKAGE FEATURES: • Allows placing an PLCC package part on a board laid out for a shrink dip. SPECIFICATIONS: • Board material is .062 [1.58] thick FR-4 with 1 oz. Copper traces, both sides.

sdip-29

Abstract: amp plcc socket dsip
Contextual Info: 1109252 52 PIN PLCC PACKAGE MOTOROLA MC68HC11E9 TO 56 PIN SDIP PACKAGE FEATURES: • Allows placing an PLCC package part on a board laid out for a shrink dip. SPECIFICATIONS: • Board material is .062 [1.58] thick FR-4 with 1 oz. Copper traces, both sides.

sdip-29

Contextual Info: 1109252 52 PIN PLCC PACKAGE MOTOROLA MC68HC11E9 TO 56 PIN SDIP PACKAGE FEATURES: • Allows placing an PLCC package part on a board laid out for a shrink dip. SPECIFICATIONS: • Board material is .062 [1.58] thick FR-4 with 1 oz. Copper traces, both sides.

4066 spice model

Abstract: SOT343 lna Spice Parameter, Bipolar Transistor 8948 transistor npn d 2078 marking 900
Contextual Info: Technical Data MBC13900/D Rev. 0, 06/2002 MBC13900 NPN Silicon Low Noise Transistor Scale 2:1 Package Information Plastic Package Case 318M (SOT-343) Ordering Information Device Marking Package MBC13900T1 900 SOT-343 The MBC13900 is a high performance transistor fabricated using Motorola’s 15 GHz fτ

318M

Abstract: LL1608-FH MBC13900 MBC13900T1 marking r4 SOT343 SOT343 lna
Contextual Info: Technical Data MBC13900/D Rev. 0, 06/2002 MBC13900 NPN Silicon Low Noise Transistor Scale 2:1 Package Information Plastic Package Case 318M (SOT-343) Ordering Information Device Marking Package MBC13900T1 900 SOT-343 The MBC13900 is a high performance transistor fabricated using Motorola’s 15 GHz fτ

MBC13916

Abstract: motorola zc 527 5cm1
Contextual Info: Technical Data MBC13916/D Rev. 0, mm/2002 MBC13916 General Purpose SiGe:C RF Cascode Amplifier Scale 2:1 Package Information Plastic Package Case 1404 (SOT-343R) Ordering Information Device Device Marking Package MBC13916T1 916 SOT-343R The MBC13916 is a cost-effective, high isolation amplifier fabricated with Motorola’s

CBGA

Contextual Info: 1.5 Pin Assignments Motorola and IBM both offer a ceramic ball grid array CBGA package. Both IBM and Motorola CBGA packages have identical pinouts. Figure 9 (in part A) shows the pinout of the CBGA package as viewed from the top surface. Part B shows the side profile of the CBGA package to indicate the direction of the top

TND025F

Abstract: TND025MP AC24V
Contextual Info: Ordering number:EN6036 ExPD Excellent Power Device TND025F, TND025MP Lamp-, solenoid-, and motor-driving Applications • N-channel MOSFET built in. · Overheat protection. · Overcurrent protection. · Overvoltage protection. Package Dimensions Package Dimensions

60404

Abstract: TA-1735 AC24V TND020F TND020MP EN6040
Contextual Info: Ordering number:EN6040 ExPD Excellent Power Device TND020F, TND020MP Lamp-, solenoid-, and motor-driving Applications • N-channel MOSFET built in. · Overheat protection. · Overcurrent protection. · Overvoltage protection. Package Dimensions Package Dimensions

AC24V

Abstract: TND024F TND024MP power MOSFET Reference
Contextual Info: Ordering number:ENN6035A ExPD Excellent Power Device TND024F, TND024MP Lamp-, solenoid-, and motor-driving Applications • N-channel MOSFET built in. · Overheat protection. · Overcurrent protection. · Overvoltage protection. Package Dimensions Package Dimensions

AC24V

Abstract: TND020F TND020MP ta1735
Contextual Info: Ordering number:ENN6040A ExPD Excellent Power Device TND020F, TND020MP Lamp-, solenoid-, and motor-driving Applications • N-channel MOSFET built in. · Overheat protection. · Overcurrent protection. · Overvoltage protection. Package Dimensions Package Dimensions

TND023F

Abstract: AC24V TND023MP
Contextual Info: Ordering number:EN6034 ExPD Excellent Power Device TND023F, TND023MP Lamp-, solenoid-, and motor-driving Applications • N-channel MOSFET built in. · Overheat protection. · Overcurrent protection. · Overvoltage protection. Package Dimensions Package Dimensions

60361

Abstract: AC24V TND025F TND025MP
Contextual Info: Ordering number:ENN6036A ExPD Excellent Power Device TND025F, TND025MP Lamp-, solenoid-, and motor-driving Applications • N-channel MOSFET built in. · Overheat protection. · Overcurrent protection. · Overvoltage protection. Package Dimensions Package Dimensions

TA-3186

Abstract: TND023
Contextual Info: Ordering number:ENN6034A ExPD Excellent Power Device TND023F, TND023MP Lamp-, solenoid-, and motor-driving Applications • N-channel MOSFET built in. · Overheat protection. · Overcurrent protection. · Overvoltage protection. Package Dimensions Package Dimensions

AC24V

Abstract: TND022F TND022MP
Contextual Info: Ordering number:ENN6033A ExPD Excellent Power Device TND022F, TND022MP Lamp-, solenoid-, and motor-driving Applications • N-channel MOSFET built in. · Overheat protection. · Overcurrent protection. · Overvoltage protection. Package Dimensions Package Dimensions

AC24V

Abstract: TND024F TND024MP
Contextual Info: Ordering number:EN6035 ExPD Excellent Power Device TND024F, TND024MP Lamp-, solenoid-, and motor-driving Applications • N-channel MOSFET built in. · Overheat protection. · Overcurrent protection. · Overvoltage protection. Package Dimensions Package Dimensions

TND012NM

Abstract: AC24V TND012MP
Contextual Info: Ordering number:EN5828A ExPD Excellent Power Device TND012NM, TND012MP Lamp, solenoid, and motor-driving Applications Features • N-channel MOSFET built in · Overheat protection · Overcurrent protection · Overvoltage protection Package Dimensions Package Dimensions

transistor JF

Contextual Info: ST1000EX21 TOSHIBA INSULATED GATE BIPOLAR TRANSISTOR TENTATIVE ST1000EX21 HIGH POWER SWITCHING APPLICATIONS MOTOR CONTROL APPLICATIONS Unit: mm All Electric contacts by Pressure Structure and Airtight Package Anti−Parallel Fast Recovery Diode in This Package

AC24V

Abstract: TND012MP TND012NM ta1339
Contextual Info: Ordering number:ENN5828C ExPD Excellent Power Device TND012NM, TND012MP Lamp, solenoid, and motor-driving Applications Features • N-channel MOSFET built in · Overheat protection · Overcurrent protection · Overvoltage protection Package Dimensions Package Dimensions

transistor JF

Abstract: ST1000EX21
Contextual Info: ST1000EX21 TOSHIBA INSULATED GATE BIPOLAR TRANSISTOR TENTATIVE ST1000EX21 HIGH POWER SWITCHING APPLICATIONS MOTOR CONTROL APPLICATIONS Unit: mm All Electric contacts by Pressure Structure and Airtight Package Anti−Parallel Fast Recovery Diode in This Package

TO-251 footprint

Abstract: motorola triac catalog DO204AH Packages thyristor T 218 N Thyristor catalog RCA THYRISTOR isolated gate Thyristor
Contextual Info: M1 Package Dimensions M1 This section contains the dimensions for the following packages: • F Package — TO-202AB, Type 1 Non-isolated • Y Package — DO-35 or DO-204AH • R Package — TO-220AB (Non-isolated) • L Package — TO-220AB (Isolated)