PACKAGE MARKING Search Results

820 marking

Abstract: top marking codes MARKING CODE e1 6 lead marking 34 Marking code CS Marking MB linear marking code
Contextual Info: Package Description How Package Dimensions Are Indicated/Codes/Marking 1. How Package Dimensions Are Indicated 2. Package Codes 3. Marking DB81-10003-1E 1 Package Description (How Package Dimensions Are Indicated/Codes/Marking) 1. How Package Dimensions Are Indicated

FX609LG

Abstract: FX609 FX609J FX609L2 FX609P6
Contextual Info: FX609P6 package discontinued 1 FX609P6 package discontinued 2 FX609P6 package discontinued 3 FX609P6 package discontinued 4 FX609P6 package discontinued 5 Package Outlines Handling Precautions The FX609 is available in the package styles outlined below. Pin 1 identification marking is shown on the relevant

Contextual Info: FX609P6 package discontinued 1 FX609P6 package discontinued 2 FX609P6 package discontinued 3 FX609P6 package discontinued 4 FX609P6 package discontinued 5 Package Outlines Handling Precautions The FX609 is available in the package styles outlined below. Pin 1 identification marking is shown on the relevant

SMD MARKING CODE 071 A01

Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Contextual Info: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods

FX315P2

Abstract: mX 1524 pin diagram FX315LG FX315 CML marking
Contextual Info: Package Outlines Handling Precautions The FX315 is available in the package styles outlined below. Mechanical package diagrams and specifications are detailed below. Pin 1 identification marking is shown on the relevant diagram and pins on all package styles number

date code marking samsung

Abstract: samsung date code samsung samsung year code
Contextual Info: KS57 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS57P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):

samsung date code

Abstract: samsung year code date code marking samsung
Contextual Info: KS57 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS57P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):

KS88P0424

Abstract: KS88P0416
Contextual Info: KS88 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS88P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):

date code marking samsung

Abstract: samsung date code functions of remocon
Contextual Info: KS57 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS57P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):

date code samsung

Abstract: date code marking samsung telephone microcontroller caller id
Contextual Info: KS57 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS57P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):

samsung year code

Contextual Info: KS57 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS57P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):

date code marking samsung

Abstract: KS57P samsung date code
Contextual Info: KS57 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS57P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):

Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 26-Aug-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) 5962-9203101M2A OBSOLETE LCCC

JM38510/01405BEA

Abstract: SN74368A SN54LS367A-SP M38510 SN74367A SN54365A
Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 21-Mar-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) 5962-9687802QEA OBSOLETE CDIP

samsung 2416

Abstract: eprom 2416 samsung date code date code marking samsung date code samsung samsung year code
Contextual Info: KS88 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS88P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):

samsung date code

Abstract: date code marking samsung samsung date code marking samsung year code date code samsung
Contextual Info: KS88 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS88P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):

FX315P2

Abstract: FX315 FX315LG
Contextual Info: Package Outlines Handling Precautions The FX315 is available in the package styles outlined below. Mechanical package diagrams and specifications are detailed below. Pin 1 identification marking is shown on the relevant diagram and pins on all package styles number

JM38510/01405BEA

Abstract: M38510
Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 23-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) JM38510/07006BCA ACTIVE CDIP

LS27

Abstract: JM38510/01405BEA M38510
Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) JM38510/00404BCA OBSOLETE CDIP

JM38510/01405BEA

Abstract: SN74368A SN54LS367A-SP M38510 SN74367A SN54365A
Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) 5962-9687802QEA OBSOLETE CDIP

Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) (3) Top-Side Markings (4) JM38510/30607B2A OBSOLETE LCCC

Contextual Info: SDLS946 – PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) (3) Top-Side Markings (4) SN5496J OBSOLETE

JM38510/01405BEA

Abstract: M38510
Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) JM38510/00903BCA OBSOLETE CDIP

JM38510/01405BEA

Abstract: SN74LS02N M38510/01401BJB M38510
Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) JM38510/00401BCA ACTIVE CDIP