820 marking
Abstract: top marking codes MARKING CODE e1 6 lead marking 34 Marking code CS Marking MB linear marking code
Contextual Info: Package Description How Package Dimensions Are Indicated/Codes/Marking 1. How Package Dimensions Are Indicated 2. Package Codes 3. Marking DB81-10003-1E 1 Package Description (How Package Dimensions Are Indicated/Codes/Marking) 1. How Package Dimensions Are Indicated
|
Original
|
db81-10003-1e820 markingtop marking codesmarking code e1 6 lead+4marking 34marking code csmarking mblinear marking code
|
PDF
|
FX609LG
Abstract: FX609 FX609J FX609L2 FX609P6
Contextual Info: FX609P6 package discontinued 1 FX609P6 package discontinued 2 FX609P6 package discontinued 3 FX609P6 package discontinued 4 FX609P6 package discontinued 5 Package Outlines Handling Precautions The FX609 is available in the package styles outlined below. Pin 1 identification marking is shown on the relevant
|
Original
|
fx609p6fx609fx609j22-pin+2fx609lgfx609l2
|
PDF
|
|
Contextual Info: FX609P6 package discontinued 1 FX609P6 package discontinued 2 FX609P6 package discontinued 3 FX609P6 package discontinued 4 FX609P6 package discontinued 5 Package Outlines Handling Precautions The FX609 is available in the package styles outlined below. Pin 1 identification marking is shown on the relevant
|
Original
|
fx609p6fx609fx609j22-pin |
PDF
|
SMD MARKING CODE 071 A01
Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Contextual Info: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods
|
Original
|
lcc-26p-m09lcc-28p-m04lcc-28p-m05lcc-28p-m06+15lcc-28p-m07lcc-28c-a04lcc-32p-m03lcc-40p-m01lcc-42p-m01smd marking code 071 a01smd code 38plga 1155 pin diagrammarking code smd ic a08l quad aluminum nitridesmd marking m05lga 1155 socket pin diagrampitch 0.4 qfp 256pmarking code smd fujitsutexas instruments epoxy sumitomo
|
PDF
|
FX315P2
Abstract: mX 1524 pin diagram FX315LG FX315 CML marking
Contextual Info: Package Outlines Handling Precautions The FX315 is available in the package styles outlined below. Mechanical package diagrams and specifications are detailed below. Pin 1 identification marking is shown on the relevant diagram and pins on all package styles number
|
Original
|
fx315fx315lg24-pinfx315p2+2mx 1524 pin diagramcml marking
|
PDF
|
date code marking samsung
Abstract: samsung date code samsung samsung year code
Contextual Info: KS57 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS57P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):
|
Original
|
ks57p_date code marking samsungsamsungdate code samsung+1samsung year code
|
PDF
|
samsung date code
Abstract: samsung year code date code marking samsung
Contextual Info: KS57 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS57P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):
|
Original
|
ks57p_samsung date codesamsung year codedate code marking samsung |
PDF
|
KS88P0424
Abstract: KS88P0416
Contextual Info: KS88 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS88P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):
|
Original
|
ks88p_ks88p0424ks88p0416 |
PDF
|
date code marking samsung
Abstract: samsung date code functions of remocon
Contextual Info: KS57 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS57P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):
|
Original
|
ks57p_date code marking samsungsamsung date codefunctions of remocon |
PDF
|
date code samsung
Abstract: date code marking samsung telephone microcontroller caller id
Contextual Info: KS57 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS57P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):
|
Original
|
ks57p_date code samsungdate code marking samsungtelephone microcontroller caller id |
PDF
|
samsung year code
Contextual Info: KS57 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS57P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):
|
Original
|
ks57p_samsung year code |
PDF
|
date code marking samsung
Abstract: KS57P samsung date code
Contextual Info: KS57 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS57P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):
|
Original
|
ks57p_date code marking samsungks57psamsung date code |
PDF
|
|
Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 26-Aug-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) 5962-9203101M2A OBSOLETE LCCC
|
Original
|
26-aug-20135962-9203101m2a5962-9203101mea5962-9203102mea+45962-9203103q2a59629203103q2auc1863l/5962-9203103qea
|
PDF
|
JM38510/01405BEA
Abstract: SN74368A SN54LS367A-SP M38510 SN74367A SN54365A
Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 21-Mar-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) 5962-9687802QEA OBSOLETE CDIP
|
Original
|
21-mar-20135962-9687802qea5962-9687802qfajm38510/16303bea+8jm38510/16304beajm38510/32201b2ajm38510/01405beasn74368asn54ls367a-spm38510sn74367asn54365a
|
PDF
|
|
|
samsung 2416
Abstract: eprom 2416 samsung date code date code marking samsung date code samsung samsung year code
Contextual Info: KS88 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS88P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):
|
Original
|
ks88p_samsung 2416eprom 2416samsung date code+3date code marking samsungdate code samsungsamsung year code
|
PDF
|
samsung date code
Abstract: date code marking samsung samsung date code marking samsung year code date code samsung
Contextual Info: KS88 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS88P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):
|
Original
|
ks88p_samsung date codedate code marking samsungsamsung date code marking+2samsung year codedate code samsung
|
PDF
|
FX315P2
Abstract: FX315 FX315LG
Contextual Info: Package Outlines Handling Precautions The FX315 is available in the package styles outlined below. Mechanical package diagrams and specifications are detailed below. Pin 1 identification marking is shown on the relevant diagram and pins on all package styles number
|
Original
|
fx315fx315lg24-pinfx315p2+114-pin
|
PDF
|
JM38510/01405BEA
Abstract: M38510
Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 23-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) JM38510/07006BCA ACTIVE CDIP
|
Original
|
23-apr-2013jm38510/07006bcajm38510/07006bca+4jm38510/07006bda07006bdajm38510/01405beam38510
|
PDF
|
LS27
Abstract: JM38510/01405BEA M38510
Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) JM38510/00404BCA OBSOLETE CDIP
|
Original
|
11-apr-2013jm38510/00404bcajm38510/30302b2ajm38510/+530302b2ajm38510/30302bcals27jm38510/01405beam38510
|
PDF
|
JM38510/01405BEA
Abstract: SN74368A SN54LS367A-SP M38510 SN74367A SN54365A
Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) 5962-9687802QEA OBSOLETE CDIP
|
Original
|
11-apr-20135962-9687802qea5962-9687802qfajm38510/16303bea+7jm38510/1630tijm38510/01405beasn74368asn54ls367a-spm38510sn74367asn54365a
|
PDF
|
|
Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) (3) Top-Side Markings (4) JM38510/30607B2A OBSOLETE LCCC
|
Original
|
11-apr-2013jm38510/30607b2ajm38510/30607beasn54ls395aj+1sn74ls395ad
|
PDF
|
|
Contextual Info: SDLS946 – PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) (3) Top-Side Markings (4) SN5496J OBSOLETE
|
Original
|
sdls94611-apr-2013sn5496jsn7496n+4sn74ls96dsn74ls96drsn74ls96jsn74ls96n
|
PDF
|
JM38510/01405BEA
Abstract: M38510
Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) JM38510/00903BCA OBSOLETE CDIP
|
Original
|
11-apr-2013jm38510/00903bcajm38510/30605b2ajm38510/+430605b2ajm38510/30605bcajm38510/01405beam38510
|
PDF
|
JM38510/01405BEA
Abstract: SN74LS02N M38510/01401BJB M38510
Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) JM38510/00401BCA ACTIVE CDIP
|
Original
|
11-apr-2013jm38510/00401bcajm38510/00401bdajm38510/07301bca+6jm38510/07301bdajm38510/30301b2ajm38510/01405beasn74ls02nm38510/01401bjbm38510
|
PDF
|
