PACKAGE DIMENSIONS SSOP20 Search Results

SOL16-P

Abstract: HQFP64-P SOL18 package SOL20 package PACKAGE DIMENSIONS SOP14 HSOP16 HSON-6P HZIP25-P QFP48 package
Contextual Info: [ 7 ] IC/LSI Package Dimensions [ 7 ] IC/LSI Package Dimensions Unit: mm DIP8-P-300-2.54 DIP14-P-300-2.54 DIP16-P-300-2.54A DIP18-P-300-2.54D 1271 [ 7 ] IC/LSI Package Dimensions Unit: mm DIP20-P-300-2.54A DIP42-P-600-2.54 HQFP64-P-1010-0.50 HSON6-P-0303-0.95

Contextual Info: Package outline SSOP20: plastic shrink small outline package; 20 leads; body width 3.9 mm; lead pitch 0.635 mm D E SOT724-1 A X c y HE v M A Z 11 20 A2 A A3 A1 θ Lp L 10 1 1/2 e e bp detail X w M 2.5 5 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)

JEP95

Abstract: MO-137 SSOP20 marx
Contextual Info: ZMD-Standard August 2003 Package SSOP20 3,9 mm MDS 767 Dimensions in millimetres Based on JEDEC JEP95: MO-137 1 Dimensions View X bp A A2 X 1 10 e D Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 Amax 1,73 Amin 1,54 bPmin 0,20 A1min 0,10 bPmax 0,30

JEP95

Abstract: MO-150 SSOP20 QS-000757-HD-02 marx
Contextual Info: ZMD-Standard February 2000 Package SSOP20 5,3 mm MDS 757 Supersedes Edition 11.99 Dimensions in millimetres Based on JEDEC JEP95: MO-150 1 Dimensions A A2 X View X k x 45° 0,1 1 Z bp e 0,15 M D Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 Amax

SSOP20

Abstract: MO-137
Contextual Info: PDF: 2003 Mar 24 Philips Semiconductors Package outline SSOP20: plastic shrink small outline package; 20 leads; body width 3.9 mm; lead pitch 0.635 mm D E SOT724-1 A X c y HE v M A Z 11 20 A2 A A3 A1 θ Lp L 10 1 1/2 e e bp detail X w M 2.5 5 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)

MO-137

Abstract: SSOP20 package SSOP20 sot724
Contextual Info: PDF: 2001 Jul 04 Philips Semiconductors Package outline SSOP20: plastic shrink small outline package; 20 leads; body width 3.9 mm; lead pitch 0.635 mm D E SOT724-1 A X c y HE v M A Z 11 20 A2 A A3 A1 θ Lp L 10 1 1/2 e e bp detail X w M 2.5 5 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)

SMD MARKING CODE 071 A01

Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Contextual Info: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods

Contextual Info: Package outline SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm D SOT339-1 E A X c HE y v M A Z 20 11 Q A2 pin 1 index A A 3 A1 θ Lp L 1 10 w M bp e detail X 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max.

Contextual Info: Package outline SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm D SOT266-1 E A X c y HE v M A Z 11 20 Q A2 pin 1 index A A 3 A1 θ Lp L 1 10 e detail X w M bp 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max.

SSOP20-C3

Contextual Info: PACKAGE DIMENSIONS SSOP20-C3 Ｇ Ｄ － Ｖ ０ ２ ０ ０ ３ Ａ － ０ UNIT : mm Ver.2008-08-28

SSOP20

Abstract: SSOP20 package
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm D SOT266-1 E A X c y HE v M A Z 11 20 Q A2 A A 3 A1 pin 1 index θ Lp L 1 10 detail X w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

jedec MO-150

Abstract: MO-150 SSOP20
Contextual Info: PDF: 2003 Mar 24 Philips Semiconductors Package outline SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm D SOT339-1 E A X c HE y v M A Z 20 11 Q A2 A A 3 A1 pin 1 index θ Lp L 1 10 bp e detail X w M 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

SSOP20

Contextual Info: PDF: 2003 Mar 24 Philips Semiconductors Package outline SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm D SOT266-1 E A X c y HE v M A Z 11 20 Q A2 A A 3 A1 pin 1 index θ Lp L 1 10 detail X w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

MO-150-AE

Abstract: SOT-339-1
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm D SOT339-1 E A X c HE y v M A Z 20 11 Q A2 A A 3 A1 pin 1 index θ Lp L 1 10 w M bp e detail X 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

20P2F-A

Abstract: SSOP20-P 20P2F
Contextual Info: Under development Preliminary specification Specifications in this manual are tentative and subject to change. R8C/14, R8C/15 Group Appendix 1. Package Dimensions 20P2F-A Recommended EIAJ Package Code SSOP20-P-255-0.65 Plastic 20pin 255mil SSOP Weight g –

TO-92 Package Dimensions

Abstract: QFP64 package DMP8 Package emp8 Package dimension FFP16-C1 QFP80-C2 SSOP10 Package Vsp8 Package dimension 335max TVSP10
Contextual Info: PACKAGE DIMENSIONS DIP8 8.8±0.3 5 1 4 6.4±0.2 8 7.62 2.54 0.46±0.1 2.8MIN 1.0±0.2 0.51MIN 0.74MAX 4.7MAX 1.5±0.2 +0.15 0.25 - 0.05 0 ~ 15º UNIT: mm UNIT: mm PACKAGE DIMENSIONS DIP14 19.0±0.3 8 1 7 6.4±0.2 14 7.62 1.5±0.2 2.54 0.46±0.1 2.8MIN 0.51MIN

SSOP20-P-225

Abstract: packing
Contextual Info: Tape Packing Specifications Package Type Packing Type Specification Package Appearance Tape Packing Package dimensions unit: mm Appearance Packing Quantity 12.7 Ammo Pack 2000 devices / carton TPE6 18 A SSIP3-P-1.27 TO-92MOD 12.7 4 TE16L 700 devices / reel

PACKAGE DIMENSIONS

Abstract: SSOP10 SSOP14 SSOP20
Contextual Info: PACKAGE DIMENSIONS 3. PACKAGE DIMENSIONS SSOP10 +0.3 3.50 -0.1 0 – 10º 0.5 ±0.2 4.4 ±0.2 6.4 ±0.3 6 10 1 5 0.50 +0.1 0.15 -0.05 0.1 ±0.1 1.15 ±0.1 0.9MAX 0.1 0.2±0.1 0.1 M UNIT :mm SSOP14 +0.3 5.0 - 0.1 0 – 10º 1 0.5±0.2 6.4 ±0.3 4.4±0.2 8 7

SSOP20

Abstract: SSOP20 package
Contextual Info: PACKAGE DIMENSIONS SSOP20-B2 5.0 +0.3 -0.1 0 ~ 10º 0.5±0.2 6.4±0.3 11 4.4±0.2 20 10 1 0.5 0.15±0.1 0.1±0.1 1.15±0.1 0.4MAX 0.1 0.20±0.1 0.1 M UNIT : mm

SSOP20

Abstract: SSOP20 package
Contextual Info: PACKAGE DIMENSIONS SSOP20 +0.3 6.5 -0.1 1 10 0.5±0.2 11 4.4±0.2 20 6.4±0.3 0 ~ 10º 0.65 +0.1 0.15 -0.05 0.1±0.1 1.15±0.1 0.45MAX 0.1 0.22±0.1 0.1 M UNIT : mm

SSOP20

Abstract: SSOP20 package
Contextual Info: PACKAGE DIMENSIONS SSOP20-F1 0 ~ 10º 8.9±0.3 20 0.5±0.2 7.8±0.3 5.4±0.2 11 1 10 0.8 +0.1 0.15 -0.05 0.10 0.36±0.1 0.12 M +0.1 0.05 - 0.05 1.8±0.1 0.85TYP UNIT : mm

TK10487M

Abstract: MFP20 7BRE-7437Z SSOP-20 TK10487 0487M DB3-E025
Contextual Info: TK10487M TABLE OF CONTENTS 1.Purpose 2.TOKO Part Number 3.Function 4.Applications 5.Structure 6.Package Outline 7.Absolute Maximum Ratings 8.Electrical Characteristics 9.Test Circuit 10.Pin Assignment Block Diagram 11.Package Outline Dimensions/Marking 12.Cautions

LGA-16

Abstract: QFN-20 skyworks LGA16 SKYWORKS SOT-23 6l 118 lga package
Contextual Info: Semiconductor Plastic Package Selection Guide ^ CÏ Q. ? 30 PART NUMBER REFERENCE PACKAGE TYPE ACTUAL SIZE PACKAGE DIMENSIONS mm (LEAD INCLUSIVE)* -050 Chip Scale ♦ 0.68 x 0.56 x 0.3 -334 LGA-6 %» 1.5 x 1.2 x 0.8 -079 SC-79 % 1.6 x 0.8 x 0.6 -011 SOD-323

DB3-C106

Abstract: compandor SSOP-20 TK10651 TK10651M CCITT p53
Contextual Info: TK10651M SPECIFICATION TABLE OF CONTENTS 1.Purpose 2.TOKO Part Number 3.Funct ion 4.Applications 5.Structure 6.Package Out 1ine 7.Absolute Maximum Ratings 8.Electrical Characteristics 9.Test Circuit 10.Pin Assignment 11.Block Diagram 12.Package Outline Dimensions/Marking