PACKAGE CTE Search Results

transistor b 1238

Abstract: PCB design for very fine pitch csp package tray datasheet bga 8x9 5 ball csp drawing BGA PACKAGE TOP MARK intel land pattern BGA 0.75 SCR Manual, General electric databook N4646 15 ball CSP bga 6x8 tray dimension
Contextual Info: The Micro Ball Grid Array µBGA Package The Micro Ball Grid Array (µBGA*) Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA*) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than

28F160

Abstract: 28F160B3 BGA thermal resistance 6x8 intel 28f160 s5 SOP JEDEC tray A576 ubga package BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS TRANSPORT MEDIA AND PACKING
Contextual Info: The Micro Ball Grid Array µBGA* Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA*) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than

7700D

Contextual Info: SUPER BRIGHT PLCC-2 PACKAGE m il SURFACE MOUNT LED LAMP PACKAGE DIM ENSIONS SUPER BRIGHT ORANGE QTLP670C0.7700D FEATURES Non-diffused package excellent for back-lighting and coupling to light pipe Low package profile AllnG aP technology W ide viewing angle of 120°

OPB875

Abstract: QP8870 OPB871 L1052 m745 800LA OPB867 OPB876 OPB 800
Contextual Info: Slotted Optical Switches Types OPB 86O, OPB87Û Series Package N Package L Package P Package T Features Absolute Maximum Ratings Ta = 25°C unless otherwise noted • 0.125" wide gap • Choice of aperture • Choice of opaque or IR transmissive shell material

plcc4 led bicolor

Abstract: 3528 plcc-4
Contextual Info: PLCC-4 BI-COLOR PACKAGE BÆRLIGHT SURFACE MOUNT LED LAMP PACKAGE DIM ENSIO NS HER / PURE GREEN Q TLP670C-25 FEATURES • Non-diffused package excellent for back-lighting and coupling to light pipe • Low package profile • W ide viewing angle of 120°

OPB875

Abstract: OPB371 OPB871 QPB870 Sensor OPB 86
Contextual Info: 0 . O P IE K Product Bulletin O P B 86O May 1993 Slotted Optical Switches Types O P B 86O, OPB87Û Series Package N Package P Package L Package T Features Absolute Maximum Ratings Ta = 25°C unless otherwise noted • 0.125" wide gap • Choice of aperture

DL-LS1027

Contextual Info: Red Laser Diode DL-LS1027 CTentativjO> Features • • • • • • Tolerance : ±0.2 Unit : mm Package Wavelength : 660 nm Typ. High output p o w e r: 70mW at 70°C (pulse) Low threshold cu rren t: Ith = 45 mA (Typ.) Small package : 0 5.6mm TE mode

Analog devices branding codes d6b

Contextual Info: +2.5 V to +5.5 V, Dual Rail-To-Rail, ANALOG DEVICES Voltage Output 8/10/12-Bit DACs AD5302/12/22 Prelim Technical Information FEATURES AD5302: Two 8-B it DACs in One Package AD5312: Two 10-Bit DACs in One Package AD5322: Two 12-Bit DACs in One Package 10-Pin microSOIC Package

Contextual Info: +2.5 V to +5.5 V, Dual Rail-To-Rail, Voltage Output 8/10/12-Bit DACs AD5303/13/23 Preliminary Technical Data ANALOG DEVICES FEATURES AD5303: Tw o 8-Bit DACs in One Package AD5313: Tw o 10-Bit DACs in One Package AD5323: Tw o 12-Bit DACs in One Package 16-Pin TSSOP Package

7622

Abstract: 75225PC LA 7522 55224DM 55225DM 55225FM 75224DC 75224PC 75225DC 7528
Contextual Info: FAIRCHILD LINEAR INTEGRATED CIRCUITS » 5520/7520 SERIES 75224/75225 SENSE AMPLIFIERS CONNECTION D IA G R A M 16-LEAD FLA TP A K PACKAGE O U TLIN E 4 L PACKAGE CODE F CONNECTION D IA G R A M 16-LEAD DIP TOP VIEW PACKAGE OU TLIN E S 6B 9B PACKAGE CODES D P

7535

Abstract: 7534PC 7535PC D 7520 C ua 7524 5534DM 5535DM 5535FM 7534DC 5534D
Contextual Info: FAIRCHILD LINEAR INTEGRATED CIRCUITS • 5520/7520 SERIES 7534/7535 SENSE AMPLIFIERS CONNECTION D IA G R A M 16-LEA D DIP TOP VIEW PACKAGE OU TLIN ES 6B 9B PACKAGE CODES D P CONNECTION D IA G R A M 16-LEAD FLATPAK PACKAGE O U TLIN E 4L PACKAGE CODE F STRO BE B

A7647

Abstract: A7647-01 A7190-01 socket 615-PIN socket s1 REFLOW FCPGA JEDEC Thin Matrix Tray outlines outline of the heat sink for Theta JC A719-0 A7646-01 BGA PACKAGE TOP MARK intel
Contextual Info: 13 Pinned Packaging 13.1 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package

Contextual Info: ANALOG DEVICES + 2 .5 V to +5.5 V, Dual Rail-To-Rail, Voltage Output 8/10/12-Bit DACs AD5302/12/22 Prelim inary Technical Data FEATURES AD5302: Tw o 8-Bit DACs in One Package AD5312: Tw o 10-Bit DACs in One Package AD5322: Tw o 12-Bit DACs in One Package 10-Pin m icroSOIC Package

TTL 7414

Abstract: IC sn7414
Contextual Info: TYPES SN5414, SN54LS14, SN7414, SN74LS14 HEX SCHMITT-TRIGGER INVERTERS _ REVISED DECEMBER 1983 SN 5414, SN 54LS14 . . . J OR W PACKAGE S N 7414 . . . J OR N PACKAGE SN 74LS 14 . . . D, J OR N PACKAGE | • Operation from Very Slow Edges

54ACT11533

Abstract: 74ACT11533 ACT11373 D2957 TI008 624bd
Contextual Info: 54ACT11533, 74ACT11533 OCTAL D-TYPE TRANSPARENT LATCHES WITH 3-STATE OUTPUTS TI0086— 02957, JULY 1907— REVISED MARCH 1990 • Inputs are TTL-Voltage Compatible 54ACT11533 . . . JT PACKAGE 74ACT11533 . . . DW OR NT PACKAGE • 8-Latches in a Single Package

74132N

Abstract: IC TS 74132
Contextual Info: TYPES SN74132, SN74LS132, SN74S132 SN54132, SN54LS132, SN54S132 QUADRUPLE 2-INPUT POSITIVE-NAND SCHMITT TRIGGERS REVISED DECEMBER 1983 | • Operation from Very Slow Edges SN54132, SN54LS132, S N 548132. J PACKAGE SN 74132. N PACKAGE SN74LS132, SN74S132 . D OR N PACKAGE

Contextual Info: rrz SGS-THOMSON T74LS11 TRIPLE 3-INPUT AND GATE DESCRIPTION The T74LS11 is a high speed TRIPLE 3-INPUT AND GATE fabricated in LOW POWER SCHOTTKY technology. D1 B1 Plastic Package (Ceramic Package) M1 C1 (Micro Package) (Plastic Chip Carrier) ORDER CODES :

ac11373

Abstract: 74AC11533 54AC11533 74AC D2957 TI008 2dzl
Contextual Info: 54AC11533, 74AC11533 OCTAL D-TYPE TRANSPARENT LATCHES WITH 3-STATE OUTPUTS TI0085— D2957, JULY 1967— REVISED JANÜAHY 1990 54AC11533 . . . JT PACKAGE 74AC 11533 . . . DW OR NT PACKAGE 8-Lalches in a Single Package 3-State Bus-Driving Inverting Outputs

M676

Abstract: GPLY6928 M676-N2Q1-24
Contextual Info: Hyper Mini TOPLED Hyper Bright LED Lead Pb Free Product - RoHS Compliant LG M676, LP M676 Besondere Merkmale Features • • package: white SMT package, colorless clear resin • feature of the device: small package for applications where small space is required

M676

Contextual Info: Hyper Mini TOPLED Hyper Bright LED Lead Pb Free Product - RoHS Compliant LG M676, LP M676 Besondere Merkmale Features • • package: white SMT package, colorless clear resin • feature of the device: small package for applications where small space is required

Contextual Info: OM65Û5SA OM65Q6SA INSULATED GATE BIPOLAR TRANSISTOR IGBT IN A HERMETIC TO-254AA PACKAGE 500 Volt, 15 And 20 Amp, N-Channel IGBT In A Hermetic Metal Package FEATURES Isolated Hermetic Metal Package High Input Impedance Low On-Voltage High Current Capability

lateral mosfet audio amplifier

Abstract: OM6009SA OM6011SA OM6109SA OM6110SA OM6111SA OM6112SA
Contextual Info: OM6009SA OM6011SA OM6109SA OM6111SA OM601 OSA QM6012SA OM6110SA OM6112SA POWER MOSFETS IN HERMETIC ISOLATED TO-254AA PACKAGE 100V Thru 500V, Up To 22 Amp, N-Channel MOSFET In Hermetic Metal Package, With Optional Zener Gate Clamp Protection FEATURES • Isolated Hermetic Metal Package

footprint jedec MS-026 TQFP

Abstract: footprint jedec MS-026 LQFP JEDEC TRAY ssop footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP 44 MS-026 BED BGA package tray 40 x 40 AMD Package moisture MO-069 footprint jedec MS-026 TQFP 144
Contextual Info: u Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Surface-Mount Array Packages Column Grid Array Packages Surface-Mount Leaded Packages Thru-Hole Packages Packages and Packing Publication Revision A 3/1/03 2-1 u Chapter 2 Package Design SURFACE-MOUNT ARRAY PACKAGES

D 7520 C

Abstract: 75234PC 66234 ua 7524 55234DM 55234FM 55235DM 55235FM 75234DC 75235DC
Contextual Info: FAIRCHILD LINEAR INTEGRATED CIRCUITS » 5520/7520 SERIES 7 5 2 3 4 /7 5 2 3 5 SENSE AMPLIFIERS CONNECTION D IA G R A M 16-LEAD FLA TP A K PACKAGE O U TLIN E 4 L PACKAGE CODE F CONNECTION D IA G R A M 16-LEAD DIP TOP VIEW PACKAGE OU TLIN ES 6 8 9B PACKAGE CODES D P