PACKAGE 1218 Search Results

TSOP048-P-1218-1

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index FPT-48P-M07 EIAJ code : TSOP048-P-1218-1 48-pin plastic TSOP I Lead pitch 0.50 mm Lead shape Gullwing Lead bend direction Normal bend

Ablebond 8380

Abstract: smema DA6523 nozzle heater X3304 Theta-JC 5th mechnical engineering date sheet alpha Resistors slide cut template DRAWING Die Attach epoxy stamping
Contextual Info: 2 12 Advanced Package Applications: Tape Carrier Package 1/17/97 9:18 AM CH12WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 12 ADVANCED PACKAGE APPLICATIONS: TAPE CARRIER PACKAGE 12.1. INTRODUCTION TO THE PACKAGE TECHNOLOGY As semiconductor devices become more complex, they are being introduced into products that

Contextual Info: SILICON PIN DIODES Selection guide SILICON PIN DIODES Selection Guide PAGE HOW TO SPECIFY A PIN DIODE? 12-5 SURFACE MOUNT PACKAGE - PLASTIC PACKAGE SWITCHING SILICON PIN DIODES 12-6 - PLASTIC PACKAGE ATTENUATING SILICON PIN DIODES 12-8 - LOW COST SQUARE CERAMIC PACKAGE PIN DIODES

Diodes

Contextual Info: SILICON PIN DIODES Selection guide SILICON PIN DIODES Selection Guide PAGE HOW TO SPECIFY A PIN DIODE? 12-5 SURFACE MOUNT PACKAGE - PLASTIC PACKAGE SWITCHING SILICON PIN DIODES 12-6 - PLASTIC PACKAGE ATTENUATING SILICON PIN DIODES 12-8 - LOW COST SQUARE CERAMIC PACKAGE PIN DIODES

Ablebond 8380

Abstract: X3304 ablestik ablebond Ablestik 8380 A5700 shoulder angle foot length lead solder joint reliability smema control IPC-SM-780 tms 3615 A5716
Contextual Info: Advanced Package Applications: Tape Carrier Package 12.1 12 Introduction To The Package Technology As semiconductor devices become more complex they are being introduced into products that cover the spectrum of the marketplace. Portability of computing and information management is

LT1460BCS3-10

Abstract: marking code LTGG LTGF marking code sot 23 MARK LTGG LTKD MARKING CODE ltbw LM 3937 LT1460BCS3-2 LT1521CS8-3 LTHS
Contextual Info: PACKAGE PACKAGE CROSSDIMENSIONS REFERENCE LCC METAL CAN CERDIP Ceramic Dual-In-Line METAL CANS SSOP Shrink Small Outline TSSOP Thin Shrink Small Outline SIDE BRAZED PACKAGE OUTLINE DESCRIPTION LTC NSC MOT TI LINFIN MAXIM 8-Lead Side Brazed Hermetic D8 D

LG 5804

Abstract: VMMK-1218-BLKG RGS 13/1 PHEMT marking code a BYY 56 byy 88 A004R MM20 RO4350 VMMK-1218
Contextual Info: VMMK-1218 0.5 to 18 GHz Low Noise E-PHEMT in a Wafer Scale Package Data Sheet Description Features Avago Technologies has combined it’s industry leading E-pHEMT technology with a revolutionary chip scale package. The VMMK-1218 can produce an LNA with high dynamic range, high gain and low noise figure that

Contextual Info: VMMK-1218 0.5 to 18 GHz Low Noise E-PHEMT in a Wafer Scale Package Data Sheet Description Features Avago Technologies has combined it’s industry leading E-pHEMT technology with a revolutionary chip scale package. The VMMK-1218 can produce an LNA with high dynamic range, high gain and low noise figure that

117450

Abstract: TO253 lt941 ltc947 1624i LT 129i5 sm 2178a LT1510CGN sot23 1303 ltbw 83
Contextual Info: PACKAGE PACKAGE CROSSDIMENSIONS REFERENCE SIDE BRAZED PACKAGE OUTLINE DESCRIPTION LTC NSC MOT TI LINFIN MAXIM 8-Lead Side Brazed Hermetic D8 D D ADI/PMI — l — — DA 14-, 16-, 18- and 20-Lead Side Brazed (Hermetic) D D D YB QB XB L — — DD, DE, DN, DP

ablebond 8380

Abstract: land pattern PQFP 132 smema Ablestik 8380 ablestik ablebond shoulder angle foot length lead solder joint reliability nozzle heater gold embrittlement Ablebond cut template DRAWING
Contextual Info: CHAPTER 12 ADVANCED PACKAGE APPLICATIONS TAPE CARRIER PACKAGE INTRODUCTION TO THE PACKAGE TECHNOLOGY As semiconductor devices become more complex they are being introduced into products that cover the spectrum of the marketplace Portability of computing and information management is driving the reduction in size from desktop to laptop to notebook to palm top sized

Contextual Info: BPW17N www.vishay.com Vishay Semiconductors Silicon NPN Phototransistor FEATURES • Package type: leaded • Package form: T-¾ • Dimensions in mm : Ø 1.8 • High photo sensitivity • High radiant sensitivity • Suitable for visible and near infrared radiation

Contextual Info: BPW16N www.vishay.com Vishay Semiconductors Silicon NPN Phototransistor FEATURES • Package type: leaded • Package form: T-¾ • Dimensions in mm : Ø 1.8 • High photo sensitivity • High radiant sensitivity • Suitable for visible and near infrared radiation

Contextual Info: BPW20RF www.vishay.com Vishay Semiconductors Silicon Photodiode, RoHS Compliant FEATURES • Package type: leaded • Package form: TO-5 • Dimensions in mm : Ø 8.13 • Radiant sensitive area (in mm2): 7.5 • High photo sensitivity • High radiant sensitivity

Contextual Info: BPW21R www.vishay.com Vishay Semiconductors Silicon Photodiode FEATURES • Package type: leaded • Package form: TO-5 • Dimensions in mm : Ø 8.13 • Radiant sensitive area (in mm2): 7.5 • High photo sensitivity • Adapted to human eye responsivity

pn photodiode

Contextual Info: BPW21R www.vishay.com Vishay Semiconductors Silicon Photodiode FEATURES • Package type: leaded • Package form: TO-5 • Dimensions in mm : Ø 8.13 • Radiant sensitive area (in mm2): 7.5 • High photo sensitivity • Adapted to human eye responsivity

Contextual Info: BPW16N www.vishay.com Vishay Semiconductors Silicon NPN Phototransistor FEATURES • Package type: leaded • Package form: T-¾ • Dimensions in mm : Ø 1.8 • High photo sensitivity • High radiant sensitivity • Suitable for visible and near infrared radiation

Contextual Info: BPW17N www.vishay.com Vishay Semiconductors Silicon NPN Phototransistor FEATURES • Package type: leaded • Package form: T-¾ • Dimensions in mm : Ø 1.8 • High photo sensitivity • High radiant sensitivity • Suitable for visible and near infrared radiation

vbpw77nb

Abstract: APPLICATION NOTE BpW77 BPW77NB BPW77NA BPW77
Contextual Info: BPW77NA, BPW77NB Vishay Semiconductors Silicon NPN Phototransistor, RoHS Compliant FEATURES • Package type: leaded • Package form: TO-18 • Dimensions in mm : Ø 4.7 • High photo sensitivity • High radiant sensitivity • Suitable for visible and near infrared radiation

Contextual Info: D3SB10 Thru D3SB100 High Current Glass Passivated Molding Single-Phase Bridge Rectifier Reverse Voltage 100 to 1000V Forward Current 4.0 A FEATURES z Plastic Package has Underwriters Laboratory Flammability Classification 94V-0 z High current capacity with small package

BPW17N application note

Abstract: ic 8243 BPW17N
Contextual Info: BPW17N Vishay Semiconductors Silicon NPN Phototransistor, RoHS Compliant FEATURES • Package type: leaded • Package form: T-¾ • Dimensions in mm : Ø 1.8 • High photo sensitivity • High radiant sensitivity • Suitable for visible and near infrared radiation

BPW77NA

Contextual Info: BPW77NA, BPW77NB Vishay Semiconductors Silicon NPN Phototransistor, RoHS Compliant FEATURES • Package type: leaded • Package form: TO-18 • Dimensions in mm : Ø 4.7 • High photo sensitivity • High radiant sensitivity • Suitable for visible and near infrared radiation

VBPW77NB

Abstract: APPLICATION NOTE BpW77 BPW77NB Infrared phototransistor TO18
Contextual Info: BPW77NA, BPW77NB Vishay Semiconductors Silicon NPN Phototransistor, RoHS Compliant FEATURES • Package type: leaded • Package form: TO-18 • Dimensions in mm : Ø 4.7 • High photo sensitivity • High radiant sensitivity • Suitable for visible and near infrared radiation

PBLS1504Y

Abstract: PBLS1504V
Contextual Info: PBLS1504Y; PBLS1504V 15 V PNP BISS loadswitch Rev. 02 — 25 November 2004 Product data sheet 1. Product profile 1.1 General description Low VCEsat PNP transistor and NPN resistor-equipped transistor in one package. Table 1: Product overview Type number Package

SMO-14

Abstract: S1965
Contextual Info: SAW Bandpass Filter 205602B 1. Features z IF Bandpass Filter z Single-Ended Operation z Ceramic Surface Mount Device SMD Package z Maximum Storage Temperature Range : -40℃ ~ 85℃ z Electrostatics Sensitive Device (ESD) 2. Package Dimensions 19.00±0.2