PACKAGE 12 Search Results

QTLP690-AG

Abstract: QTLP630C-IG QTLP630C-7 QTLP690C-Y QTLP650D-3 QTLP600C-2 PLCC-2 1210 QTLP600C-4 QTLP600C-7 QTLP600C-B
Contextual Info: Analog Discrete Interface & Logic Optoelectronics Surface Mount LED Lamps • 0603 Package • 0606 Package • Right Angle Package • 0805 Package • 1206 Package • 1210 Package • 1.8 mm Dome Lens Package • PLCC-2 Package • PLCC-4 Package • Reflector Package

16MM TAPE PACKAGE

Contextual Info: Package O rientation Feed D irection Feed D irection Typical SOIC Package Orientation 12mm, 16mm, 24mm Carrier Tape SOT-143 Package Orientation 8mm Carrier Tape Feed D irection Feed D irection SOT-23 Package Orientation 8mm Carrier Tape SOT-223 Package Orientation

pcb design 0,5 mm pitch

Abstract: PBGA 1515 D 4242 STD150 Samsung ASIC fbga 153
Contextual Info: Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers. • In-house ❏ Sub-contractor LQFP Package 0707 mm 1010 mm 1212 mm 1420 mm

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index FPT-48P-M15 48-pin plastic QFP Lead pitch 0.80 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index FPT-48P-M16 48-pin plastic QFP Lead pitch 0.80 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold

Contextual Info: SMALL OUTLINE NON-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 46 PIN PLASTIC To Top / Package Lineup / Package Index LCC-46P-M02 46-pin plastic SON Lead pitch 0.50 mm Package width x package length 10.10 × 12.00 mm Sealing method Plastic mold LCC-46P-M02

TQFP 80 PACKAGE

Contextual Info: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 80 PIN PLASTIC To Top / Package Lineup / Package Index FPT-80P-M15 80-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold

QFP-120P

Abstract: 120-pin
Contextual Info: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC To Top / Package Lineup / Package Index FPT-120P-M05 EIAJ code :∗QFP120-P-1414-1 120-pin plastic LQFP Lead pitch 0.40 mm Package width x package length 14 × 14 mm

TQFP120

Contextual Info: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC To Top / Package Lineup / Package Index FPT-120P-M17 EIAJ code :∗TQFP120-P-1414-1 120-pin plastic TQFP Lead pitch 0.40 mm Package width x package length 14 × 14 mm Lead shape

120 M13

Abstract: FPT-120P-M13 QFP120 QFP120-P-2020-1
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC To Top / Package Lineup / Package Index FPT-120P-M13 EIAJ code :∗QFP120-P-2020-1 120-pin plastic QFP Lead pitch 0.50 mm Package width x package length 20 × 20 mm Lead shape Gullwing

Contextual Info: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC To Top / Package Lineup / Package Index FPT-100P-M18 100-pin plastic TQFP Lead pitch 0.40 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold

FPT-120P-M04

Abstract: QFP120
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC To Top / Package Lineup / Package Index FPT-120P-M04 EIAJ code :∗QFP120-P-2828-4 120-pin plastic QFP Lead pitch 0.80 mm Package width x package length 28 × 28 mm Lead shape Gullwing

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN CERAMIC To Top / Package Lineup / Package Index FPT-120C-C01 120-pin ceramic QFP Lead pitch 0.80 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Cerdip Length of flat

FPT-64P-M09

Abstract: fujitsu 64-Pin Plastic QFP QFP064-P-1212-1
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN PLASTIC To Top / Package Lineup / Package Index FPT-64P-M09 EIAJ code :∗QFP064-P-1212-1 64-pin plastic QFP Lead pitch 0.65 mm Package width x package length 12 × 12 mm Lead shape Gullwing

QFP080-P-1212-1

Contextual Info: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 80 PIN PLASTIC To Top / Package Lineup / Package Index FPT-80P-M05 EIAJ code :∗QFP080-P-1212-1 80-pin plastic LQFP Lead pitch 0.50 mm Package width x package length 12 × 12 mm

16MM TAPE PACKAGE

Contextual Info: Micrel Semiconductor Designing With LDO Regulators Package Orientation Feed Direction Feed Direction Typical SOIC Package Orientation 12mm, 16mm, 24mm Carrier Tape SOT-143 Package Orientation 8mm Carrier Tape Feed Direction Feed Direction SOT-23 Package Orientation

Contextual Info: Data sheet acquired from Harris Semiconductor SCHS096 PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty CD40105BE ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU

CD4517BE

Abstract: CD4517BEE4 CD4517BF3A
Contextual Info: Data sheet acquired from Harris Semiconductor SCHS075 PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty CD4517BE ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU

SN74ALS2540N

Abstract: SN74ALS2541DW SN74ALS2541DWR SN74ALS2541DWRE4 SN74ALS2541N SN74ALS2541NE4 SN74ALS2541NSR SN74ALS2541NSRE4
Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN74ALS2540N OBSOLETE PDIP N 20 TBD Call TI SN74ALS2541DW OBSOLETE

JM38510/01405BEA

Abstract: 74ls20 M38510
Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 12-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) JM38510/07006BCA ACTIVE CDIP

CZ12

Abstract: CZ16 12-pin
Contextual Info: At a glance IP425xCZ8-4/CZ12-6/CZ16-8 Package Ultra Thin Leadless Package UTLP - HXSON12: plastic thermal enhanced extremely thin small outline package; 12 terminals; body 1.35 x 2.5 x 0.5 mm QFN compatible plastic package with 0.4 mm pitch Applications

Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 12-Mar-2012 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp Samples (Requires Login) 5962-9451301MPA ACTIVE CDIP JG 8 1 TBD Call TI

Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN54LS375J ACTIVE CDIP J 16 1 TBD Call TI SN74LS375D ACTIVE SOIC

Contextual Info: SBOS175 PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty 4213AM NRND TO-100 LME 4213AM2 OBSOLETE TO-99 LMC 8 4213BM NRND TO-100 LME 10 4213BM1 OBSOLETE