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    PACKAGE 12 Search Results

    PACKAGE 12 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH1R306PL
    Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Datasheet
    TPH9R00CQH
    Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Datasheet
    TPH9R00CQ5
    Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Datasheet
    TPHR8504PL
    Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Datasheet
    XPH2R106NC
    Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Datasheet

    PACKAGE 12 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    QTLP690-AG

    Abstract: QTLP630C-IG QTLP630C-7 QTLP690C-Y QTLP650D-3 QTLP600C-2 PLCC-2 1210 QTLP600C-4 QTLP600C-7 QTLP600C-B
    Contextual Info: Analog Discrete Interface & Logic Optoelectronics Surface Mount LED Lamps • 0603 Package • 0606 Package • Right Angle Package • 0805 Package • 1206 Package • 1210 Package • 1.8 mm Dome Lens Package • PLCC-2 Package • PLCC-4 Package • Reflector Package


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    QTLP690C-E QTLP690C-O QTLP690C-Y QTLP690-AG QTLP690-AG QTLP630C-IG QTLP630C-7 QTLP690C-Y QTLP650D-3 QTLP600C-2 PLCC-2 1210 QTLP600C-4 QTLP600C-7 QTLP600C-B PDF

    16MM TAPE PACKAGE

    Contextual Info: Package O rientation Feed D irection Feed D irection Typical SOIC Package Orientation 12mm, 16mm, 24mm Carrier Tape SOT-143 Package Orientation 8mm Carrier Tape Feed D irection Feed D irection SOT-23 Package Orientation 8mm Carrier Tape SOT-223 Package Orientation


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    OT-143 OT-223 OT-23 O-263 OT-23-5 16MM TAPE PACKAGE PDF

    pcb design 0,5 mm pitch

    Abstract: PBGA 1515 D 4242 STD150 Samsung ASIC fbga 153
    Contextual Info: Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers. • In-house ❏ Sub-contractor LQFP Package 0707 mm 1010 mm 1212 mm 1420 mm


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    STD150 pcb design 0,5 mm pitch PBGA 1515 D 4242 STD150 Samsung ASIC fbga 153 PDF

    Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index FPT-48P-M15 48-pin plastic QFP Lead pitch 0.80 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold


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    FPT-48P-M15 48-pin FPT-48P-M15) F48025S-1C-1 PDF

    Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index FPT-48P-M16 48-pin plastic QFP Lead pitch 0.80 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold


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    FPT-48P-M16 48-pin FPT-48P-M16) F48026S-1C-1 PDF

    Contextual Info: SMALL OUTLINE NON-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 46 PIN PLASTIC To Top / Package Lineup / Package Index LCC-46P-M02 46-pin plastic SON Lead pitch 0.50 mm Package width x package length 10.10 × 12.00 mm Sealing method Plastic mold LCC-46P-M02


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    LCC-46P-M02 46-pin LCC-46P-M02) C46002S-4C-3 PDF

    TQFP 80 PACKAGE

    Contextual Info: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 80 PIN PLASTIC To Top / Package Lineup / Package Index FPT-80P-M15 80-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold


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    FPT-80P-M15 80-pin FPT-80P-M15) F80028S-1C-1 TQFP 80 PACKAGE PDF

    QFP-120P

    Abstract: 120-pin
    Contextual Info: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC To Top / Package Lineup / Package Index FPT-120P-M05 EIAJ code :∗QFP120-P-1414-1 120-pin plastic LQFP Lead pitch 0.40 mm Package width x package length 14 × 14 mm


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    FPT-120P-M05 QFP120-P-1414-1 120-pin FPT-120P-M05) F120006S-2C-3 QFP-120P PDF

    TQFP120

    Contextual Info: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC To Top / Package Lineup / Package Index FPT-120P-M17 EIAJ code :∗TQFP120-P-1414-1 120-pin plastic TQFP Lead pitch 0.40 mm Package width x package length 14 × 14 mm Lead shape


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    FPT-120P-M17 TQFP120-P-1414-1 120-pin FPT-120P-M17) F120022S-1C-3 TQFP120 PDF

    120 M13

    Abstract: FPT-120P-M13 QFP120 QFP120-P-2020-1
    Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC To Top / Package Lineup / Package Index FPT-120P-M13 EIAJ code :∗QFP120-P-2020-1 120-pin plastic QFP Lead pitch 0.50 mm Package width x package length 20 × 20 mm Lead shape Gullwing


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    FPT-120P-M13 QFP120-P-2020-1 120-pin FPT-120P-M13) F120013S-2C-3 120 M13 FPT-120P-M13 QFP120 QFP120-P-2020-1 PDF

    Contextual Info: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC To Top / Package Lineup / Package Index FPT-100P-M18 100-pin plastic TQFP Lead pitch 0.40 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold


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    FPT-100P-M18 100-pin FPT-100P-M18) F100029S-1C-1 PDF

    FPT-120P-M04

    Abstract: QFP120
    Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC To Top / Package Lineup / Package Index FPT-120P-M04 EIAJ code :∗QFP120-P-2828-4 120-pin plastic QFP Lead pitch 0.80 mm Package width x package length 28 × 28 mm Lead shape Gullwing


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    FPT-120P-M04 QFP120-P-2828-4 120-pin FPT-120P-M04) F120005S-3C-2 FPT-120P-M04 QFP120 PDF

    Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN CERAMIC To Top / Package Lineup / Package Index FPT-120C-C01 120-pin ceramic QFP Lead pitch 0.80 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Cerdip Length of flat


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    FPT-120C-C01 120-pin FPT-120C-C01) F120011SC-3-2 PDF

    FPT-64P-M09

    Abstract: fujitsu 64-Pin Plastic QFP QFP064-P-1212-1
    Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN PLASTIC To Top / Package Lineup / Package Index FPT-64P-M09 EIAJ code :∗QFP064-P-1212-1 64-pin plastic QFP Lead pitch 0.65 mm Package width x package length 12 × 12 mm Lead shape Gullwing


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    FPT-64P-M09 QFP064-P-1212-1 64-pin FPT-64P-M09) F64018S-1C-2 FPT-64P-M09 fujitsu 64-Pin Plastic QFP QFP064-P-1212-1 PDF

    QFP080-P-1212-1

    Contextual Info: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 80 PIN PLASTIC To Top / Package Lineup / Package Index FPT-80P-M05 EIAJ code :∗QFP080-P-1212-1 80-pin plastic LQFP Lead pitch 0.50 mm Package width x package length 12 × 12 mm


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    FPT-80P-M05 QFP080-P-1212-1 80-pin FPT-80P-M05) F80008S-2C-5 QFP080-P-1212-1 PDF

    16MM TAPE PACKAGE

    Contextual Info: Micrel Semiconductor Designing With LDO Regulators Package Orientation Feed Direction Feed Direction Typical SOIC Package Orientation 12mm, 16mm, 24mm Carrier Tape SOT-143 Package Orientation 8mm Carrier Tape Feed Direction Feed Direction SOT-23 Package Orientation


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    OT-143 OT-223 OT-23 O-263 OT-23-5 16MM TAPE PACKAGE PDF

    Contextual Info: Data sheet acquired from Harris Semiconductor SCHS096 PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty CD40105BE ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU


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    SCHS096 12-Jan-2006 CD40105BE CD40105BF CD40105BF3A PDF

    CD4517BE

    Abstract: CD4517BEE4 CD4517BF3A
    Contextual Info: Data sheet acquired from Harris Semiconductor SCHS075 PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty CD4517BE ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU


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    SCHS075 12-Jan-2006 CD4517BE CD4517BEE4 CD4517BF3A CD4517BE CD4517BEE4 CD4517BF3A PDF

    SN74ALS2540N

    Abstract: SN74ALS2541DW SN74ALS2541DWR SN74ALS2541DWRE4 SN74ALS2541N SN74ALS2541NE4 SN74ALS2541NSR SN74ALS2541NSRE4
    Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN74ALS2540N OBSOLETE PDIP N 20 TBD Call TI SN74ALS2541DW OBSOLETE


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    12-Jan-2006 SN74ALS2540N SN74ALS2541DW Level-1-260C-UNLIM SN74ALS2541DWR SN74ALS2541DWRE4 SN74ALS2541N SN74ALS2540N SN74ALS2541DW SN74ALS2541DWR SN74ALS2541DWRE4 SN74ALS2541N SN74ALS2541NE4 SN74ALS2541NSR SN74ALS2541NSRE4 PDF

    JM38510/01405BEA

    Abstract: 74ls20 M38510
    Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 12-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) JM38510/07006BCA ACTIVE CDIP


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    12-Apr-2013 JM38510/07006BCA JM38510/ 07006BCA JM38510/07006BDA 07006BDA JM38510/01405BEA 74ls20 M38510 PDF

    CZ12

    Abstract: CZ16 12-pin
    Contextual Info: At a glance IP425xCZ8-4/CZ12-6/CZ16-8 Package Ultra Thin Leadless Package UTLP - HXSON12: plastic thermal enhanced extremely thin small outline package; 12 terminals; body 1.35 x 2.5 x 0.5 mm QFN compatible plastic package with 0.4 mm pitch Applications


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    IP425xCZ8-4/CZ12-6/CZ16-8 HXSON12: IP425xCZ8/CZ12/CZ16: CZ12-6 12-pin CZ16-8 IP4252 IP4251 CZ12 CZ16 12-pin PDF

    Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 12-Mar-2012 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp Samples (Requires Login) 5962-9451301MPA ACTIVE CDIP JG 8 1 TBD Call TI


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    12-Mar-2012 5962-9451301MPA 5962-9451302MPA 5962-9451303MPA 5962-9451304MPA 5962-9451305MPA 5962-9451305VPA UCC1800J UCC1800J883B UCC1800L883B PDF

    Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN54LS375J ACTIVE CDIP J 16 1 TBD Call TI SN74LS375D ACTIVE SOIC


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    12-Jan-2006 SN54LS375J SN74LS375D SN74LS375DE4 SN74LS375DR SN74LS375DRE4 PDF

    Contextual Info: SBOS175 PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty 4213AM NRND TO-100 LME 4213AM2 OBSOLETE TO-99 LMC 8 4213BM NRND TO-100 LME 10 4213BM1 OBSOLETE


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    SBOS175 12-Jan-2006 4213AM 4213AM2 4213BM 4213BM1 4213SM O-100 O-100 PDF