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TLP2768B
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Toshiba Electronic Devices & Storage Corporation
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Photocoupler (photo-IC output), 20 Mbps, 5000 Vrms, SO6L |
Datasheet
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77313-827-68LF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 68 Positions |
PDF
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|
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77313-127-68LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 68 Positions |
PDF
|
|
|
77313-427-68LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 68 Positions |
PDF
|
|
|
JM38510/50404BRA
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Texas Instruments
|
Standard High-Speed PAL Circuits 20-CDIP -55 to 125 |
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