|
54122-105240900LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 24 position, 2.54mm (0.100in) pitch |
PDF
|
|
|
54122-105240800LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 24 position, 2.54mm (0.100in) pitch |
PDF
|
|
|
54122-105240950LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 24 position, 2.54mm (0.100in) pitch |
PDF
|
|
|
LM10524TME/NOPB
|
|
Texas Instruments
|
Triple Buck Power Management IC (PMIC) for Solid-State Drives 46-DSBGA -30 to 85 |
|
|
|
LM10524TME-A/NOPB
|
|
Texas Instruments
|
Triple Buck Power Management IC (PMIC) for Solid-State Drives 46-DSBGA 0 to 0 |
|
|
