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    OZ 9966 Search Results

    OZ 9966 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    67996-620
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 20 Positions, 2.54 mm (0.100in) Pitch PDF
    67996-606LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 6 Positions, 2.54 mm (0.100in) Pitch PDF
    51939-966LF
    		Amphenol Communications Solutions PwrBlade®, Power Connectors, 1P 8S 1P Right Angle Header, Solder To Board PDF
    67996-606
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 6 Positions, 2.54 mm (0.100in) Pitch PDF
    67996-600H
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 0 Positions, 2.54 mm (0.100in) Pitch PDF

    OZ 9966 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Contextual Info: 14-4904-18 REPLACEMENT FOR SN74LS12 DIP 14 PACKAGE FEATURES: • A cost effective means of upgrading to SOIC . without changing your PCB layout. • Available on .300 [7.62] centers. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper


    Original     		sn74ls12c36000astm-b16085mil-p-81728+1qqn-290 PDF

    Contextual Info: 14-4904-18 REPLACEMENT FOR SN74LS12 DIP 14 PACKAGE FEATURES: • A cost effective means of upgrading to SOIC . without changing your PCB layout. • Available on .300 [7.62] centers. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper


    Original     		sn74ls12c36000astm-b16085mil-t-10727+2mil-p-81728qq-n-290 PDF

    OZ 9966

    Contextual Info: SSOP TO SOWIC ADAPTER FEATURES: • A cost effective means of upgrading to SSOP without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides. • Pins are Brass Alloy 360 1/2 hard per UNS C36000


    Original     		c36000astm-b-16-85mil-t-10727mil-p-81728+2qq-n-290oz 9966 PDF

    Contextual Info: 1111903 24Pin SOWIC IC to 22Pin .4 CTR DIP Adapter for 75ALS162 and other IC’s FEATURES: • A cost effective means of upgrading to SOIC without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		24pin22pin75als162c36000+4astm-b-16-85mil-t-10727mil-p-81728qq-n-290 PDF

    75als162

    Abstract: OZ 9966 18071
    Contextual Info: 1111903 24Pin SOWIC IC to 22Pin .4 CTR DIP Adapter for 75ALS162 and other IC’s FEATURES: • A cost effective means of upgrading to SOIC without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		24pin22pin75als162c36000+6astm-b-16-85mil-t-10727mil-p-81728qq-n-290oz 996618071 PDF

    Contextual Info: SSOP TO SOWIC ADAPTER FEATURES: • A cost effective means of upgrading to SSOP without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides. • Pins are Brass Alloy 360 1/2 hard per UNS C36000


    Original     		c36000astm-b-16-85mil-t-10727mil-p-81728+1qq-n-290 PDF

    Contextual Info: 1109252 52 PIN PLCC PACKAGE MOTOROLA MC68HC11E9 TO 56 PIN SDIP PACKAGE FEATURES: • Allows placing an PLCC package part on a board laid out for a shrink dip. SPECIFICATIONS: • Board material is .062 [1.58] thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		mc68hc11e9c36000astm-b16-00saeams-qq-n-290 PDF

    MC68HC11E9

    Contextual Info: 1109252 52 PIN PLCC PACKAGE MOTOROLA MC68HC11E9 TO 56 PIN SDIP PACKAGE FEATURES: • Allows placing an PLCC package part on a board laid out for a shrink dip. SPECIFICATIONS: • Board material is .062 [1.58] thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		mc68hc11e9c36000astm-b16-85mil-p-81728+1qq-n-290 PDF

    Contextual Info: SSOP TO SOWIC ADAPTER FEATURES: • A cost effective means of upgrading to SSOP without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides. • Pins are Brass Alloy 360 1/2 hard per UNS C36000


    Original     		c36000astm-b-16-85mil-t-10727mil-p-81728+1qq-n-290 PDF

    sdip-29

    Abstract: amp plcc socket dsip
    Contextual Info: 1109252 52 PIN PLCC PACKAGE MOTOROLA MC68HC11E9 TO 56 PIN SDIP PACKAGE FEATURES: • Allows placing an PLCC package part on a board laid out for a shrink dip. SPECIFICATIONS: • Board material is .062 [1.58] thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		mc68hc11e9c36000astm-b16-85mil-t-10727+5mil-p-81728qq-n-290sdip-29amp plcc socketdsip PDF

    Contextual Info: 1111903 24Pin SOWIC IC to 22Pin .4 CTR DIP Adapter for 75ALS162 and other IC’s FEATURES: • A cost effective means of upgrading to SOIC without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		24pin22pin75als162c36000+4astm-b-16-85mil-t-10727mil-p-81728qq-n-290 PDF

    Contextual Info: 1111903 24Pin SOWIC IC to 22Pin .4 CTR DIP Adapter for 75ALS162 and other IC’s FEATURES: • A cost effective means of upgrading to SOIC without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		24pin22pin75als162c36000+4astm-b-16-85mil-t-10727mil-p-81728qq-n-290 PDF

    Contextual Info: ADAPTER FOR MOTOROLA MC145158-2 FROM 16 PIN SOIC DW PACKAGE TO PLCC 20 PIN PACKAGE. FEATURES: • A cost effective means of upgrading to SOJ or SOIC . without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper


    Original     		mc145158-2c36000astm-b-16-85mil-t-10727+5mil-p-81728qq-n-29020-301550-x01112610-t1112578-t PDF

    Contextual Info: SSOP TO SOWIC ADAPTER FEATURES: • A cost effective means of upgrading to SSOP without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides. • Pins are Brass Alloy 360 1/2 hard per UNS C36000


    Original     		c36000astm-b-16-85mil-t-10727mil-p-81728+1qq-n-290 PDF

    Contextual Info: 4121-106-18-N 64 PIN .5MM TQFP TO .65MM QFP ADAPTER FEATURES: • A cost effective means of upgrading without changing your PCB layout. • Available on .300 [7.62] centers. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		4121-106-18-nc36000astm-b16085mil-p-81728+1qqn-290 PDF

    sdip-29

    Contextual Info: 1109252 52 PIN PLCC PACKAGE MOTOROLA MC68HC11E9 TO 56 PIN SDIP PACKAGE FEATURES: • Allows placing an PLCC package part on a board laid out for a shrink dip. SPECIFICATIONS: • Board material is .062 [1.58] thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		mc68hc11e9c36000astm-b16-85mil-t-10727+3mil-p-81728qq-n-290sdip-29 PDF

    Contextual Info: ADAPTER FOR MOTOROLA MC145158-2 FROM 16 PIN SOIC DW PACKAGE TO PLCC 20 PIN PACKAGE. FEATURES: • A cost effective means of upgrading to SOJ or SOIC . without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper


    Original     		mc145158-2c36000astm-b-16-00sae-ams-qq-n-290+320-301550-x01112610-t1112578-t PDF

    Contextual Info: SSOP TO SOWIC ADAPTER FEATURES: • A cost effective means of upgrading to SSOP without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides. • Pins are Brass Alloy 360 1/2 hard per UNS C36000


    Original     		c36000astm-b-16-00sae-ams-qq-n-290 PDF

    OZ 9966

    Contextual Info: 1111841-X .5MM 8 AND 10 PIN MSOP TO .3 DIP ADAPTERS FEATURES: • A cost effective means of upgrading to MSOP .5MM package SOIC. without changing your PCB layout. • Available on .300 [7.62] centers. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper


    Original     		1111841-xc36000astm-b16085mil-t-10727+3mil-p-81728qq-n-290oz 9966 PDF

    Contextual Info: ADAPTER FOR MOTOROLA MC145158-2 FROM PLCC 20 PIN FN PACKAGE TO SOIC DW PACKAGE. FEATURES: • A cost effective means of upgrading to SOJ or SOIC . without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		mc145158-2c36000astm-b-16-85mil-p-81728+4qqn-29020-301550-x01109639-t1109901-t PDF

    OZ 9966

    Abstract: QQN-290
    Contextual Info: 1111841-X .5MM 8 AND 10 PIN MSOP TO .3 DIP ADAPTERS FEATURES: • A cost effective means of upgrading to MSOP .5MM package SOIC. without changing your PCB layout. • Available on .300 [7.62] centers. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper


    Original     		1111841-xc36000astm-b16085mil-p-81728+2qqn-290oz 9966 PDF

    OZ 9966

    Abstract: MC12009
    Contextual Info: 16-304633-18 20 PIN PLCC TO 16 PIN DIP ADAPTER FOR MOTOROLA MC12009 AND OTHERS FEATURES: • A cost effective means of upgrading to PLCC Package without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		mc12009c36000astm-b-16-85mil-p-81728+2qq-n-290oz 9966 PDF

    Aromat hb2e

    Abstract: hb2e AROMAT HB2E RELAY aromat
    Contextual Info: 08-305984-10 Adapter for Replacing Old Aromat HB2E Relay w/ SM Type TXSS FEATURES: • A cost effective means of upgrading to SOIC . without changing your PCB layout. • Available on .300 [7.62] centers. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper


    Original     		c36000astm-b16085mil-p-81728qqn-290+4aromat hb2ehb2earomat hb2e relayaromat PDF

    hb2e

    Abstract: Aromat relay pcb layout Aromat relay hb2e AROMAT HB2E RELAY AROMAT
    Contextual Info: 08-305984-10 Adapter for Replacing Old Aromat HB2E Relay w/ SM Type TXSS FEATURES: • A cost effective means of upgrading to SOIC . without changing your PCB layout. • Available on .300 [7.62] centers. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper


    Original     		c36000astm-b16085mil-p-81728qqn-290+6hb2earomat relaypcb layoutaromat relay hb2earomat hb2e relayaromat PDF