OM6254U Search Results
OM6254U Datasheets (1)
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| OM6254U |
|
fine-pitch land grid array package; 274 lands | Original | 327.52KB | 1 |
OM6254U Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
|
Contextual Info: Bare die outline WLCSP9: wafer level chip-size package; 9 bumps; 1.26 x 1.89 x 0.22 mm OM6254U D e e1 y e2 E x 0,0 X Y 2 P1 P2 A1 detail X A2 A Dimensions Unit(1) mm A A1 A2 max nom 0.215 0.015 0.2 min D(1) E(1) detail Y e e1 1.26 1.89 1.05 0.22 P1 e2 0.9 |
Original |
OM6254U PC8564A-1 om6254u |