NX5P1000 Search Results

Contextual Info: Package outline WLCSP12: wafer level chip-scale package; 12 bumps; 1.664 x 1.364 x 0.509 mm Backside coating included B A D NX5P1000 A2 ball A1 index area A E A1 detail X e1 1/2 e e C A B C Øv Øw b C y C e B e2 A ball A1 index area 1 2 3 4 X 2 mm scale

Contextual Info: NX5P1000 Logic controlled high-side power switch Rev. 1 — 29 April 2013 Product data sheet 1. General description The NX5P1000 is an advanced power switch and ESD- protection device for USB OTG applications. The device includes under voltage and over voltage lockout, over-current,

Contextual Info: Package outline WLCSP12: wafer level chip-scale package; 12 bumps; 1.36 x 1.66 x 0.51 mm, 0.4 mm pitch Backside coating included A E NX5P1000E NX5P3001/NX18P3001 B A2 ball A1 index area A D A1 detail X e1 e C Øv Øw b C A B C y D e C e2 1/2 e B A ball A1

Contextual Info: NX5P1000 Logic controlled high-side power switch Rev. 2 — 14 January 2014 Product data sheet 1. General description The NX5P1000 is an advanced power switch and ESD- protection device for USB OTG applications. The device includes under voltage and over voltage lockout, over-current,

Contextual Info: NXP Load Switches and Over-Voltage Protection ICs Simple, efficient, protection and control with smallest footprint NXP’s integrated load switch and OVP families, NX3P/NX5P/NX18P, provide simple and efficient power distribution solutions to reduce system power consumption,