NX3DV1066 Search Results
NX3DV1066 Datasheets (1)
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| NX3DV1066 |
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Wafer level chip-size package; 16 bumps | Original | 326.64KB | 1 |
NX3DV1066 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
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Contextual Info: Package outline WLCSP16: wafer level chip-size package; 16 bumps; 1.36 x 1.36 x 0.435 mm A B D NX3DV1066 ball A1 index area A2 A E A1 detail X e1 C e Øv Øw b C A B C y D e C e2 B A ball A1 index area 1 2 3 4 X 2 mm scale Dimensions mm are the original dimensions |
Original |
WLCSP16: NX3DV1066 nx3dv1066 | |
hef4051
Abstract: 74AUP2G34 74LVT1403 74ABT543A 74LV74 74AVCH1T45 74HC590 CBTD3306 NCX2200 74HC40103
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Original |