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    NP383-18010-* Search Results

    NP383-18010-* Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    77311-801-02LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 02 Positions, 2.54 mm Pitch. PDF
    77311-801-06LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 06 Positions, 2.54 mm Pitch. PDF
    77311-801-00LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 00 Positions, 2.54 mm Pitch. PDF
    77311-801-05LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 05 Positions, 2.54 mm Pitch. PDF
    77311-801-08LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 08 Positions, 2.54 mm Pitch. PDF

    NP383-18010-* Datasheets (2)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    NP383-18010-N
    		Yamaichi Electronics Chip Scale Package -TH (CSP, 0.50mm Pitch) Original PDF 78.02KB 1
    NP383-18010-P
    		Yamaichi Electronics Chip Scale Package -TH (CSP, 0.50mm Pitch) Original PDF 78.02KB 1