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68021-230HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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68001-230HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 30 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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78511-230HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch. |
PDF
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68031-230HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail. |
PDF
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TM4C1230H6PMI
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Texas Instruments
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32-bit Arm Cortex-M4F based MCU with 80-MHz, 256-kb Flash, 32-kb RAM, CAN, 64-pin LQFP 64-LQFP -40 to 85 |
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